Copper [Cu] as principal constituent

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H01L2924/16747

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16747Copper [Cu] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,011,431
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 10,978,427
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,777,467
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 10,645,824
- Issue date May 5, 2020
- Kyocera Corporation
- Noritaka Niino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit including a switch-mode regulator and m...
- Patent number 10,103,627
- Issue date Oct 16, 2018
- Altera Corporation
- Teik Wah Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage
- Patent number 10,056,268
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage with semiconductor chip lid and...
- Patent number 9,892,935
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die assembly and methods of forming thermal paths
- Patent number 9,780,079
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bonded heat sinks
- Patent number 9,721,866
- Issue date Aug 1, 2017
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,601,406
- Issue date Mar 21, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 9,531,209
- Issue date Dec 27, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,449,946
- Issue date Sep 20, 2016
- Amkor Technology, Inc.
- Pil Je Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230378024
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LIMITING ELECTRONIC PACKAGE WARPAGE
- Publication number 20180047590
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20170125371
- Publication date May 4, 2017
- STMicroelectronics S.r.l.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...
- Publication number 20140328023
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- IN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140284785
- Publication date Sep 25, 2014
- Amkor Technology, Inc.
- Pil Je Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20140246770
- Publication date Sep 4, 2014
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME
- Publication number 20120234592
- Publication date Sep 20, 2012
- KABUSHIKI KAISHA TOSHIBA
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME
- Publication number 20120126246
- Publication date May 24, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
- Publication number 20120098116
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP
- Publication number 20100270667
- Publication date Oct 28, 2010
- INFINEON TECHNOLOGIES AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Stacked semiconductor die assemblies with partitioned logic and ass...

Shielded package assemblies with integrated capacitor

Semiconductor structure and manufacturing method thereof

Stacked semiconductor die assemblies with partitioned logic and ass...

Semiconductor structure and manufacturing method thereof

Electronic component housing package and electronic apparatus

Shielded package assemblies with integrated capacitor

Thermally conductive sheet, production method for thermally conduct...

Semiconductor device and corresponding method

Packaged integrated circuit including a switch-mode regulator and m...

Electrical package including bimetal lid

Limiting electronic package warpage

Electrical package including bimetal lid

Limiting electronic package warpage with semiconductor chip lid and...

Electronic apparatus and method for fabricating the same

Semiconductor die assembly and methods of forming thermal paths

Electronic apparatus and method for fabricating the same

Chip packages and methods of manufacture thereof

Semiconductor device having multiple bonded heat sinks

Semiconductor device and manufacturing method of semiconductor device

Printed circuit board

Semiconductor package with package-on-package stacking capability a...

Copper nanorod-based thermal interface material (TIM)

Electronic apparatus and method for fabricating the same

Shielded package assemblies with integrated capacitor

Electronic apparatus and method for fabricating the same

Semiconductor device and manufacturing method thereof

Thermal hot spot cooling for semiconductor devices

Semiconductor package with package-on-package stacking capability a...

Patents Applicationslast 30 patents

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

LIMITING ELECTRONIC PACKAGE WARPAGE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP