Copper [Cu] as principal constituent

Industry

CPC
H01L2224/84447

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84447Copper [Cu] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,373,919
- Issue date Aug 6, 2019
- Fuji Electric Co., Ltd.
- Tatsuhiko Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array based fabrication of power semiconductor package with integra...
- Patent number 9,620,475
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,245,832
- Issue date Jan 26, 2016
- Fuji Electric Co., Ltd.
- Akane Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...
- Publication number 20120211799
- Publication date Aug 23, 2012
- ABB Research Ltd.
- Chunlei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-conducting multilayer substrate and power module substrate
- Publication number 20040188828
- Publication date Sep 30, 2004
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Nagatomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with adjustable clip

Die stack assembly using an edge separation structure for connectiv...

Die stack assembly using an edge separation structure for connectiv...

Using MEMS fabrication incorporating into LED device mounting and a...

Semiconductor device and method of manufacturing semiconductor device

Clip and related methods

Using MEMS fabrication incorporating into LED device mounting and a...

Clip and related methods

Semiconductor device having multiple contact clips

Power module and method of manufacturing power module

Semiconductor module

Array based fabrication of power semiconductor package with integra...

Semiconductor module

Multichip power semiconductor device

Electric power semiconductor device

Stacked synchronous buck converter having chip embedded in outside...

Semiconductor module

Semiconductor module

Semiconductor module and method for manufacturing the same

Semiconductor module

Semiconductor device using diffusion soldering

Multichip power semiconductor device

Patents Applicationslast 30 patents

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

CLIP AND RELATED METHODS

Multichip Power Semiconductor Device

Semiconductor Device Using Diffusion Soldering

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...

Heat-conducting multilayer substrate and power module substrate