Copper [Cu] as principal constituent

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CPC
H01L2224/37647

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37647Copper [Cu] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 10,455,692
- Issue date Oct 22, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 9,736,925
- Issue date Aug 15, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a HEMT semiconductor device and structure therefor
- Patent number 9,214,423
- Issue date Dec 15, 2015
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...
- Publication number 20170325329
- Publication date Nov 9, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged semiconductor device having a shielding against electromag...

Connection member with bulk body and electrically and thermally con...

Packaged semiconductor device having a shielding against electromag...

Semiconductor device and structure therefor

Method of forming a HEMT semiconductor device and structure therefor

Module including a discrete device mounted on a DCB substrate

Semiconductor device using diffusion soldering

Electric device package and method of making an electric device pac...

Semiconductor component and method of manufacture

Connector assembly and method of manufacture

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

Connection member with bulk body and electrically and thermally con...

PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

Electric Device Package and Method of Making an Electric Device Pac...

Semiconductor Device Using Diffusion Soldering

Module Including a Discrete Device Mounted on a DCB Substrate

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE