Core having two or more power planes Capacitive laminate of two power planes

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CPC
H05K2201/09309

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09309Core having two or more power planes Capacitive laminate of two power planes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting apparatus comprising a light engine with a plurality of in...
- Patent number 11,653,429
- Issue date May 16, 2023
- Arkalumen Inc.
- Gerald Edward Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for mitigating the swiss cheese effec...
- Patent number 11,412,610
- Issue date Aug 9, 2022
- Juniper Networks, Inc.
- Boris Reynov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,363,710
- Issue date Jun 14, 2022
- Samsung SDI Co., Ltd.
- Seokryun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-overlapping power/ground planes for localized power distributio...
- Patent number 11,330,699
- Issue date May 10, 2022
- San Diego State University Research Foundation
- Arif Ege Engin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 11,277,900
- Issue date Mar 15, 2022
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 11,129,275
- Issue date Sep 21, 2021
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-Package device ball map and layout optimization
- Patent number 11,032,910
- Issue date Jun 8, 2021
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SpaceCube V3.0 single-board computer
- Patent number 11,026,331
- Issue date Jun 1, 2021
- UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA.
- Thomas Flatley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light engine configured to be between a power source and another li...
- Patent number 10,939,527
- Issue date Mar 2, 2021
- Arkalumen Inc.
- Gerald Edward Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device with paralleled transistors
- Patent number 10,903,834
- Issue date Jan 26, 2021
- Bae Systems Controls Inc.
- Nicholas A. Lemberg
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Communication apparatus
- Patent number 10,854,981
- Issue date Dec 1, 2020
- Sony Interactive Entertainment Inc.
- Masayuki Pak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 10,827,602
- Issue date Nov 3, 2020
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 10,798,818
- Issue date Oct 6, 2020
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resource allocation for traffic-profile-dependent scheduling request
- Patent number 10,708,807
- Issue date Jul 7, 2020
- QUALCOMM Incorporated
- Chong Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lighting apparatus with a plurality of light engines
- Patent number 10,568,170
- Issue date Feb 18, 2020
- Arkalumen Inc.
- Gerald Edward Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paddle card and plug-cable assembly
- Patent number 10,468,830
- Issue date Nov 5, 2019
- Via Technologies, Inc.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power signal transmission structure and design method thereof
- Patent number 10,470,299
- Issue date Nov 5, 2019
- Pegatron Corporation
- Ching Ou Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for via connection with reduced via currents
- Patent number 10,383,298
- Issue date Aug 20, 2019
- Micron Technology, Inc.
- Atsushi Morishima
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Printed board
- Patent number 10,375,818
- Issue date Aug 6, 2019
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply board
- Patent number 10,331,161
- Issue date Jun 25, 2019
- Fujitsu Limited
- Yuki Kanai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light engine and lighting apparatus with first and second groups of...
- Patent number 10,251,229
- Issue date Apr 2, 2019
- Arkalumen Inc.
- Gerald Edward Briggs
- F21 - LIGHTING
Information Patent Grant
Staggered power structure in a power distribution network (PDN)
- Patent number 10,231,324
- Issue date Mar 12, 2019
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic circuit board and method for manufacturing same
- Patent number 10,225,934
- Issue date Mar 5, 2019
- Schaeffler Technologies AG & Co. KG
- Joerg Kegeler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electromagnetic bandgap structure thereof
- Patent number 10,165,674
- Issue date Dec 25, 2018
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chih-Cheng Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for via connection with reduced via currents
- Patent number 10,165,683
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Atsushi Morishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for embedding a discrete electrical device in a printed circ...
- Patent number 10,149,388
- Issue date Dec 4, 2018
- International Business Machines, Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and wiring substrate
- Patent number 10,079,415
- Issue date Sep 18, 2018
- NEC Corporation
- Yoshiaki Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible cable and electronic device
- Patent number 9,847,171
- Issue date Dec 19, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMC FILTER FOR A CONTROL DEVICE
- Publication number 20230328874
- Publication date Oct 12, 2023
- ROBERT BOSCH GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR MITIGATING THE SWISS CHEESE EFFEC...
- Publication number 20220141952
- Publication date May 5, 2022
- Juniper Networks, Inc.
- Boris Reynov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES
- Publication number 20210274636
- Publication date Sep 2, 2021
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...
- Publication number 20210153341
- Publication date May 20, 2021
- San Diego State University Research Foundation
- Arif Ege ENGIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS
- Publication number 20210007221
- Publication date Jan 7, 2021
- Astec International Limited
- Prabou RANGANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200375023
- Publication date Nov 26, 2020
- Samsung SDI Co., Ltd.
- Seokryun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT ENGINE CONFIGURED TO BE BETWEEN A POWER SOURCE AND ANOTHER LI...
- Publication number 20200260555
- Publication date Aug 13, 2020
- ARKALUMEN INC.
- Gerald Edward BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20200245463
- Publication date Jul 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200084879
- Publication date Mar 12, 2020
- Toshiba Memory Corporation
- Satoru FUKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING APPARATUS WITH A PLURALITY OF LIGHT ENGINES
- Publication number 20190364633
- Publication date Nov 28, 2019
- ARKALUMEN INC.
- Gerald Edward BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF
- Publication number 20180302978
- Publication date Oct 18, 2018
- PEGATRON CORPORATION
- Ching Ou Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND WIRING SUBSTRATE
- Publication number 20180013187
- Publication date Jan 11, 2018
- NEC Corporation
- Yoshiaki KASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20170156210
- Publication date Jun 1, 2017
- SCHAEFFLER TECHNOLOGIES AG & CO. KG
- Joerg Kegeler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE ASSEMBLY WITH MULTI-LAYER CIRCUIT MEMBER
- Publication number 20160233616
- Publication date Aug 11, 2016
- Molex, LLC
- Kent E. REGNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA BALLOUT PARTITION TECHNIQUES FOR SIMPLIFIED LAYOUT IN MOTHERBOA...
- Publication number 20160093563
- Publication date Mar 31, 2016
- Invensas Corporation
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS
- Publication number 20140355213
- Publication date Dec 4, 2014
- MAVEL S.R.L.
- Davide BETTONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD
- Publication number 20140300428
- Publication date Oct 9, 2014
- NEC Corporation
- Hiroshi Toyao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD
- Publication number 20140300429
- Publication date Oct 9, 2014
- NEC Corporation
- Hiroshi Toyao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE BLIND-MATE MODULE INTERCONNECTION
- Publication number 20140292451
- Publication date Oct 2, 2014
- Martin Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL PASSIVE EQUALIZER
- Publication number 20140266516
- Publication date Sep 18, 2014
- Kai Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE FOR A SEMICONDUCTOR DEVICE HAVING DIFFERENTIAL SIG...
- Publication number 20140252612
- Publication date Sep 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING ELEC...
- Publication number 20140225681
- Publication date Aug 14, 2014
- Myunghoi KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE MODULE
- Publication number 20140202750
- Publication date Jul 24, 2014
- Murata Manufacturing Co., Ltd.
- Takeshi KOGURE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE LIGHTING CIRCUIT AND CONTROLS
- Publication number 20140197743
- Publication date Jul 17, 2014
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- F21 - LIGHTING
Information Patent Application
Printed Circuit Board and Control Device for a Vehicle Transmission...
- Publication number 20140182898
- Publication date Jul 3, 2014
- ZF Friedrichshafen AG
- Wilfried Lassmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20140176264
- Publication date Jun 26, 2014
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20140133115
- Publication date May 15, 2014
- Daisuke IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CURRENT CAPACITOR MODULE
- Publication number 20140085772
- Publication date Mar 27, 2014
- SAMHWA CAPACITOR CO., LTD.
- Young Joo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array (BGA) And Printed Circuit Board (PCB) Via Pattern T...
- Publication number 20140014404
- Publication date Jan 16, 2014
- Avago Technologies Enterprise IP (Singapore) Pte. Ltd.
- Mark A. Hinton
- H01 - BASIC ELECTRIC ELEMENTS

Core having two or more power planes Capacitive laminate of two power planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Providing a lower inductance path in a routing substrate for a capa...

Lighting apparatus comprising a light engine with a plurality of in...

Apparatus, system, and method for mitigating the swiss cheese effec...

Circuit board

Non-overlapping power/ground planes for localized power distributio...

Multilayer laminate and method for producing multilayer printed wir...

Printed circuit boards for power supplies

Power supplies including shielded multilayer power transmission boards

System-in-Package device ball map and layout optimization

SpaceCube V3.0 single-board computer

Light engine configured to be between a power source and another li...

Power electronic device with paralleled transistors

Communication apparatus

Printed circuit boards for power supplies

Power supplies including shielded multilayer power transmission boards

Resource allocation for traffic-profile-dependent scheduling request

Lighting apparatus with a plurality of light engines

Paddle card and plug-cable assembly

Power signal transmission structure and design method thereof

Apparatus and methods for via connection with reduced via currents

Printed board

Power supply board

Light engine and lighting apparatus with first and second groups of...

Staggered power structure in a power distribution network (PDN)

Magnetic circuit board and method for manufacturing same

Circuit board and electromagnetic bandgap structure thereof

Apparatus and methods for via connection with reduced via currents

Method for embedding a discrete electrical device in a printed circ...

Structure and wiring substrate

Flexible cable and electronic device

Patents Applicationslast 30 patents

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

EMC FILTER FOR A CONTROL DEVICE

APPARATUS, SYSTEM, AND METHOD FOR MITIGATING THE SWISS CHEESE EFFEC...

PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES

NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

CIRCUIT BOARD

LIGHT ENGINE CONFIGURED TO BE BETWEEN A POWER SOURCE AND ANOTHER LI...

CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS

ELECTRONIC DEVICE

LIGHTING APPARATUS WITH A PLURALITY OF LIGHT ENGINES

POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF

STRUCTURE AND WIRING SUBSTRATE

MAGNETIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CABLE ASSEMBLY WITH MULTI-LAYER CIRCUIT MEMBER

BGA BALLOUT PARTITION TECHNIQUES FOR SIMPLIFIED LAYOUT IN MOTHERBOA...

ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS

WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD

WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD

CAPACITIVE BLIND-MATE MODULE INTERCONNECTION

DIFFERENTIAL PASSIVE EQUALIZER

WIRING SUBSTRATE FOR A SEMICONDUCTOR DEVICE HAVING DIFFERENTIAL SIG...

ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING ELEC...

MULTILAYER SUBSTRATE MODULE

SOLID STATE LIGHTING CIRCUIT AND CONTROLS

Printed Circuit Board and Control Device for a Vehicle Transmission...

HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME

MULTILAYER WIRING BOARD

DIRECT CURRENT CAPACITOR MODULE

Ball Grid Array (BGA) And Printed Circuit Board (PCB) Via Pattern T...