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H01L2224/30179
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/30179
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Patents Grants
last 30 patents
Information
Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for coating conductive substrate with adhesive
Patent number
10,056,534
Issue date
Aug 21, 2018
G-SMATT CO., LTD.
Hak Ryul Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical-device adhesive barrier
Patent number
9,978,707
Issue date
May 22, 2018
Delphi Technologies, Inc.
David W. Zimmerman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer package-on-package structure
Patent number
9,406,636
Issue date
Aug 2, 2016
Broadcom Corporation
Sam Ziqun Zhao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
Publication number
20240250055
Publication date
Jul 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
Publication number
20220278069
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH ISOLATION STRUCTURE
Publication number
20190157222
Publication date
May 23, 2019
NXP USA, Inc.
Nishant LAKHERA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
Publication number
20160284958
Publication date
Sep 29, 2016
G-SMATT CO., LTD.
Hak Ryul SHIN
H01 - BASIC ELECTRIC ELEMENTS