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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,204,849
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor device
- Patent number 10,109,565
- Issue date Oct 23, 2018
- Renesas Electronics Corporation
- Keita Takada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 9,935,075
- Issue date Apr 3, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive jumper traces
- Patent number 9,508,635
- Issue date Nov 29, 2016
- STATS ChipPAC Pte. Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet and method for manufacturing semiconductor device
- Patent number 9,212,298
- Issue date Dec 15, 2015
- Hitachi Chemical Company, Ltd.
- Megumi Kodama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,040,358
- Issue date May 26, 2015
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,846,455
- Issue date Sep 30, 2014
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring pattern having a stub wire
- Patent number 8,786,071
- Issue date Jul 22, 2014
- Canon Kabushiki Kaisha
- Yoshitaka Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,384,229
- Issue date Feb 26, 2013
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for shielding electromagnetic int...
- Patent number 8,178,956
- Issue date May 15, 2012
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter integrated circuit floor plan and package
- Patent number 8,169,088
- Issue date May 1, 2012
- Monolithic Power Systems, Inc.
- James H. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 7,989,964
- Issue date Aug 2, 2011
- Panasonic Corporation
- Hiroki Matsunaga
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for fabricating high performance leadframe in electronic pac...
- Patent number 7,528,013
- Issue date May 5, 2009
- Marvell International Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the integrated circuit having a die with high Q i...
- Patent number 6,946,321
- Issue date Sep 20, 2005
- National Semiconductor Corporation
- Visvamohan Yegnashankaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance leadframe in electronic package
- Patent number 6,903,448
- Issue date Jun 7, 2005
- Marvell International Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having optimized wire bond positioning
- Patent number 6,812,580
- Issue date Nov 2, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the integrated circuit hav...
- Patent number 6,781,239
- Issue date Aug 24, 2004
- National Semiconductor Corporation
- Visvamohan Yegnashankaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier package structure with dummy pads and dummy leads for...
- Patent number 6,713,850
- Issue date Mar 30, 2004
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined system, method and apparatus for wire bonding and testing
- Patent number 6,564,115
- Issue date May 13, 2003
- Texas Instruments Incorporated
- Clark Kinnaird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonded semiconductor device with improved wire arrangement sch...
- Patent number 6,441,501
- Issue date Aug 27, 2002
- Siliconware Precision Industries Co., Ltd.
- Charles Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bond wires at the corners of an int...
- Patent number 6,420,651
- Issue date Jul 16, 2002
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method which prevents wire sweep and the wire structure the...
- Patent number 6,391,759
- Issue date May 21, 2002
- Advanced Semiconductor Engineering, Inc.
- Te-Tsung Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bond wires at the corners of an int...
- Patent number 6,297,078
- Issue date Oct 2, 2001
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,268,644
- Issue date Jul 31, 2001
- Texas Instruments Incorporated
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the lead frame and method...
- Patent number 6,265,762
- Issue date Jul 24, 2001
- Hitachi, Ltd.
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detecting the height above a silicon surface
- Patent number 6,067,025
- Issue date May 23, 2000
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring between semiconductor integrated circuit chip electrode pads...
- Patent number 5,923,092
- Issue date Jul 13, 1999
- Samsung Electronics, Co., Ltd.
- Je Bong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-tool wire bonder
- Patent number 5,839,640
- Issue date Nov 24, 1998
- Texas Instruments Incorporated
- Clark D. Kinnaird
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable pitch stagger die for optimal density
- Patent number 5,801,450
- Issue date Sep 1, 1998
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution to mold wire sweep in fine pitch devices
- Patent number 5,780,772
- Issue date Jul 14, 1998
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20230260960
- Publication date Aug 17, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180218969
- Publication date Aug 2, 2018
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180197834
- Publication date Jul 12, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180033764
- Publication date Feb 1, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170179010
- Publication date Jun 22, 2017
- RENESAS ELECTRONICS CORPORATION
- Keita TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...
- Publication number 20170133344
- Publication date May 11, 2017
- Kabushiki Kaisha Toshiba
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20140374892
- Publication date Dec 25, 2014
- Yit Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140363926
- Publication date Dec 11, 2014
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130171776
- Publication date Jul 4, 2013
- RENESAS ELECTRONICS CORPORATION
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120211903
- Publication date Aug 23, 2012
- Canon Kabushiki Kaisha
- Yoshitaka Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20110233772
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Hiroaki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110101544
- Publication date May 5, 2011
- Renesas Electronics Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER INTEGRATED CIRCUIT FLOOR PLAN AND PACKAGE
- Publication number 20110001171
- Publication date Jan 6, 2011
- James H. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100320592
- Publication date Dec 23, 2010
- SANYO ELECTRIC CO., LTD.
- Yasuhiro Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20090289357
- Publication date Nov 26, 2009
- Hiroaki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20090273099
- Publication date Nov 5, 2009
- Hiroki Matsunaga
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...
- Publication number 20090152688
- Publication date Jun 18, 2009
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040262723
- Publication date Dec 30, 2004
- RENESAS TECHNOLOGY CORP.
- Zhikang Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAPLESS LEAD FRAME
- Publication number 20020121682
- Publication date Sep 5, 2002
- RONALD B AZCARATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BOND WIRES AT THE CORNERS OF AN INT...
- Publication number 20020050379
- Publication date May 2, 2002
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS

Corner adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Wire bonding method and apparatus for electromagnetic interference...

Methods of forming conductive jumper traces

Adhesive sheet and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Wiring pattern having a stub wire

Semiconductor device and method for manufacturing the same

Integrated circuit package system for shielding electromagnetic int...

Power converter integrated circuit floor plan and package

Semiconductor integrated circuit

Method for fabricating high performance leadframe in electronic pac...

Method of forming the integrated circuit having a die with high Q i...

High performance leadframe in electronic package

Semiconductor package having optimized wire bond positioning

Integrated circuit and method of forming the integrated circuit hav...

Tape carrier package structure with dummy pads and dummy leads for...

Combined system, method and apparatus for wire bonding and testing

Wire-bonded semiconductor device with improved wire arrangement sch...

Integrated circuit package with bond wires at the corners of an int...

Bonding method which prevents wire sweep and the wire structure the...

Integrated circuit package with bond wires at the corners of an int...

Semiconductor device

Lead frame and semiconductor device using the lead frame and method...

Apparatus and method for detecting the height above a silicon surface

Wiring between semiconductor integrated circuit chip electrode pads...

Multiple-tool wire bonder

Variable pitch stagger die for optimal density

Solution to mold wire sweep in fine pitch devices

Patents Applicationslast 30 patents

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

SEMICONDUCTOR DEVICE

Wire Bonding Method and Apparatus for Electromagnetic Interference...

Wire Bonding Method and Apparatus for Electromagnetic Interference...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...

LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER CONVERTER INTEGRATED CIRCUIT FLOOR PLAN AND PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...

Semiconductor device

STRAPLESS LEAD FRAME

INTEGRATED CIRCUIT PACKAGE WITH BOND WIRES AT THE CORNERS OF AN INT...