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H01L2224/17179

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/17179Corner adaptations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 11,991,934
- Issue date May 21, 2024
- Google LLC
- Evan Jeffrey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a semiconductor wafer and a surfa...
- Patent number 11,848,300
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 11,824,009
- Issue date Nov 21, 2023
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 11,538,976
- Issue date Dec 27, 2022
- Google LLC
- Evan Jeffrey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor structure including a first surface mount component a...
- Patent number 11,424,213
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to packaging of radio-frequency devices...
- Patent number 10,771,101
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 10,720,563
- Issue date Jul 21, 2020
- Google LLC
- Evan Jeffrey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,580,750
- Issue date Mar 3, 2020
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,529,744
- Issue date Jan 7, 2020
- Japan Display Inc.
- Tetsuya Okamae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 10,510,670
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of yield prejudgment and bump re-assignment and computer rea...
- Patent number 10,339,253
- Issue date Jul 2, 2019
- Industrial Technology Research Institute
- Chi-Han Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bump interconnections
- Patent number 10,283,485
- Issue date May 7, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 10,090,263
- Issue date Oct 2, 2018
- Rohm Co., Ltd.
- Tsuguto Maruko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor manufacturing process
- Patent number 9,911,709
- Issue date Mar 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with multiple plane I/O structure
- Patent number 9,806,064
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 9,698,111
- Issue date Jul 4, 2017
- Rohm Co., Ltd.
- Tsuguto Maruko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 9,576,926
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and packaging method
- Patent number 9,484,311
- Issue date Nov 1, 2016
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 9,418,957
- Issue date Aug 16, 2016
- Rohm Co., Ltd.
- Tsuguto Maruko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20240421113
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20240047366
- Publication date Feb 8, 2024
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
- Publication number 20230369280
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069511
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336404
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220077102
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20200185328
- Publication date Jun 11, 2020
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20200091075
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190081019
- Publication date Mar 14, 2019
- Taiyo Yuden Co., Ltd.
- Motoi YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS
- Publication number 20180337161
- Publication date Nov 22, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20180240775
- Publication date Aug 23, 2018
- FUJITSU COMPONENT LIMITED
- Rie Tsudome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20170287939
- Publication date Oct 5, 2017
- Japan Display Inc.
- Tetsuya OKAMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...
- Publication number 20170271284
- Publication date Sep 21, 2017
- Rohm Co., Ltd.
- Tsuguto MARUKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO PACKAGING OF RADIO-FREQUENCY DEVICES...
- Publication number 20170149466
- Publication date May 25, 2017
- SKYWORKS SOLUTIONS, INC.
- Anthony James LOBIANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING GAP IN INTERCONNECTION TERMINALS A...
- Publication number 20160043057
- Publication date Feb 11, 2016
- JUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...
- Publication number 20150340335
- Publication date Nov 26, 2015
- Rohm Co., Ltd.
- Tsuguto MARUKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE DESIGN IN FAN-OUT PACKAGE
- Publication number 20150200185
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH METAL INTERCONNECT STRUCTURE IMPLEMENTED BETWEEN ME...
- Publication number 20150187690
- Publication date Jul 2, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Brian Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MULTIPLE PLANE I/O STRUCTURE
- Publication number 20150187721
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20150171043
- Publication date Jun 18, 2015
- ADVANCED MICRO DEVICES (SHANGHAI) CO. LTD
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Corner adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Uniform chip gaps via injection-molded solder pillars

Quantum processor design to increase control footprint

Pad structure design in fan-out package

Semiconductor structure including a semiconductor wafer and a surfa...

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device and data transferring method for semiconductor...

Quantum processor design to increase control footprint

Semiconductor structure including a first surface mount component a...

Package-on-package assembly with wire bonds to encapsulation surface

Pad structure design in fan-out package

Package-on-package assembly with wire bonds to encapsulation surface

Devices and methods related to packaging of radio-frequency devices...

Quantum processor design to increase control footprint

Semiconductor method for forming semiconductor structure having bum...

Package-on-package assembly with wire bonds to encapsulation surface

Electronic component

Display device

Pad structure design in fan-out package

Method of yield prejudgment and bump re-assignment and computer rea...

Semiconductor structure having bump on tilting upper corner surface

Semiconductor device including conductive bump interconnections

Semiconductor package, printed circuit board substrate and semicond...

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device and semiconductor manufacturing process

Package with multiple plane I/O structure

Semiconductor package, printed circuit board substrate and semicond...

Package-on-package assembly with wire bonds to encapsulation surface

Pad structure design in fan-out package

Chip package and packaging method

Semiconductor package, printed circuit board substrate and semicond...

Patents Applicationslast 30 patents

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Pad Structure Design in Fan-Out Package

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Pad Structure Design in Fan-Out Package

ELECTRONIC COMPONENT

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...

DEVICES AND METHODS RELATED TO PACKAGING OF RADIO-FREQUENCY DEVICES...

SEMICONDUCTOR PACKAGES INCLUDING GAP IN INTERCONNECTION TERMINALS A...

SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...

PAD STRUCTURE DESIGN IN FAN-OUT PACKAGE

IC PACKAGE WITH METAL INTERCONNECT STRUCTURE IMPLEMENTED BETWEEN ME...

PACKAGE WITH MULTIPLE PLANE I/O STRUCTURE

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME