covering only portions of the surface to be connected

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H01L2224/14154

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14154covering only portions of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
- Patent number 11,217,508
- Issue date Jan 4, 2022
- Sitronix Technology Corp.
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC stacking device and method of manufacture
- Patent number 10,109,613
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,397,059
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,123,788
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring board with semiconductor chip
- Patent number 8,963,327
- Issue date Feb 24, 2015
- Renesas Electronics Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 8,829,673
- Issue date Sep 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting part of semiconductor light emitti...
- Patent number 8,609,444
- Issue date Dec 17, 2013
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, and camera...
- Patent number 7,576,402
- Issue date Aug 18, 2009
- Sanyo Electric Co., LTD
- Takashi Noma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Stacking Device and Method of Manufacture
- Publication number 20170005073
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140377946
- Publication date Dec 25, 2014
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140048929
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140027904
- Publication date Jan 30, 2014
- Keiyo KUSANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130299970
- Publication date Nov 14, 2013
- RENESAS ELECTRONICS CORPORATION
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of mounting part of semiconductor light emitti...
- Publication number 20100219444
- Publication date Sep 2, 2010
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CHECKING ELECTRICAL CONTACT POINTS OF SEMICON...
- Publication number 20090173138
- Publication date Jul 9, 2009
- QIMONDA AG
- Holger Hoppe
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device, method of manufacturing the same, and camera...
- Publication number 20070166955
- Publication date Jul 19, 2007
- Sanyo Electric Co., Ltd.
- Takashi Noma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for packing optimization of semiconductor devices

Method and system for packing optimization of semiconductor devices

Lead structure of circuit with increased gaps between adjacent leads

Bonded structures for package and substrate

Driving chip, display substrate, display device and method for manu...

Method and system for packing optimization of semiconductor devices

Bonded structures for package and substrate

3DIC stacking device and method of manufacture

Assembly of an integrated circuit chip and of a plate

Bonded structures for package and substrate

Bonded structures for package and substrate

Bonded structures for package and substrate

Semiconductor device including wiring board with semiconductor chip

Bonded structures for package and substrate

Manufacturing method of mounting part of semiconductor light emitti...

Semiconductor device, method of manufacturing the same, and camera...

Patents Applicationslast 30 patents

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

Method and System for Packing Optimization of Semiconductor Devices

Method and System for Packing Optimization of Semiconductor Devices

Bonded Structures for Package and Substrate

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

3DIC Stacking Device and Method of Manufacture

Bonded Structures for Package and Substrate

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

Bonded Structures for Package and Substrate

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Manufacturing method of mounting part of semiconductor light emitti...

SYSTEM AND METHOD FOR CHECKING ELECTRICAL CONTACT POINTS OF SEMICON...

Semiconductor device, method of manufacturing the same, and camera...