covering only portions of the surface to be connected

Industry

CPC
H01L2224/17134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17134covering only portions of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including power connection lines
- Patent number 11,830,813
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jisoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,636,760
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 10,090,263
- Issue date Oct 2, 2018
- Rohm Co., Ltd.
- Tsuguto Maruko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 9,698,111
- Issue date Jul 4, 2017
- Rohm Co., Ltd.
- Tsuguto Maruko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, printed circuit board substrate and semicond...
- Patent number 9,418,957
- Issue date Aug 16, 2016
- Rohm Co., Ltd.
- Tsuguto Maruko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 9,214,438
- Issue date Dec 15, 2015
- Advanced Micro Devices (Shanghai) Co., Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,171,814
- Issue date Oct 27, 2015
- Renesas Electronics Corporation
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20230317673
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING POWER CONNECTION LINES
- Publication number 20220045004
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Jisoo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Tier Processor/Memory Package
- Publication number 20210358894
- Publication date Nov 18, 2021
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...
- Publication number 20170271284
- Publication date Sep 21, 2017
- Rohm Co., Ltd.
- Tsuguto MARUKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...
- Publication number 20150340335
- Publication date Nov 26, 2015
- Rohm Co., Ltd.
- Tsuguto MARUKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS
- Publication number 20150200008
- Publication date Jul 16, 2015
- KABUSHIKI KAISHA TOSHIBA
- Isao OZAWA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150187720
- Publication date Jul 2, 2015
- Renesas Electronics Corporation
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20150171043
- Publication date Jun 18, 2015
- ADVANCED MICRO DEVICES (SHANGHAI) CO. LTD
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140306338
- Publication date Oct 16, 2014
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140284789
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110058348
- Publication date Mar 10, 2011
- IBIDEN CO., LTD.
- Atsushi SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Semiconductor devices including power connection lines

Semiconductor packages

Structure and formation method of chip package structure

Electronic device, method for manufacturing the electronic device,...

Semiconductor package, printed circuit board substrate and semicond...

Semiconductor package, printed circuit board substrate and semicond...

Semiconductor package, printed circuit board substrate and semicond...

Die-die stacking structure and method for making the same

Method of manufacturing semiconductor device and semiconductor device

Patents Applicationslast 30 patents

FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES INCLUDING POWER CONNECTION LINES

Multi-Tier Processor/Memory Package

SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...

SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICOND...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE