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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14136Covering only the central area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,848
- Issue date Apr 26, 2022
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and systems for coupling semiconductor substrates
- Patent number 10,971,540
- Issue date Apr 6, 2021
- FLIR Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump structure for semiconductor package assemblies
- Patent number 10,879,203
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures for burn-in testing and methods the...
- Patent number 10,712,382
- Issue date Jul 14, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,658,279
- Issue date May 19, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electro-magnetic interference shie...
- Patent number 10,615,129
- Issue date Apr 7, 2020
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,340,242
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,204,851
- Issue date Feb 12, 2019
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive bumps of varying heights
- Patent number 10,163,844
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 9,922,916
- Issue date Mar 20, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump structure for semiconductor package assemblies
- Patent number 9,768,137
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with polymeric layer and manufactur...
- Patent number 9,711,474
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gia-Her Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount high-frequency circuit
- Patent number 9,691,722
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,640,414
- Issue date May 2, 2017
- Renesas Electronics Corporation
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,589,921
- Issue date Mar 7, 2017
- PS4 Luxco S.A.R.L.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,589,915
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumps for chip scale packaging including under bump metal structure...
- Patent number 9,553,065
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package using the same
- Patent number 9,502,341
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Jik-Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solderable and bondable electrical cont...
- Patent number 9,496,237
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,793
- Issue date Sep 13, 2016
- Panasonic Corporation
- Hiroki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming 3D semiconductor package...
- Patent number 9,391,046
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Yeonglm Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE
- Publication number 20210066379
- Publication date Mar 4, 2021
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190244925
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20190172778
- Publication date Jun 6, 2019
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067231
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20180182696
- Publication date Jun 28, 2018
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP STRUCTURE FOR SEMICONDUCTOR PACKAGE ASSEMBLIES
- Publication number 20180005973
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140264847
- Publication date Sep 18, 2014
- Kabushiki Kaisha Toshiba
- Makoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20140217579
- Publication date Aug 7, 2014
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumps for Chip Scale Packaging
- Publication number 20140191394
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140145331
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- DOO-HEE HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
- Publication number 20140141568
- Publication date May 22, 2014
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103536
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103504
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- HIROKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103544
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- KENJI YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140065767
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140054765
- Publication date Feb 27, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seo-Hyeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING METHOD FOR FLIP CHIP PACKAGE AND APPARATUS USING THE SAME
- Publication number 20140033156
- Publication date Jan 30, 2014
- Synopsys, Inc.
- Chen-Feng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140008798
- Publication date Jan 9, 2014
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING TH...
- Publication number 20140004630
- Publication date Jan 2, 2014
- NATIONAL CHIAO-TUNG UNIVERSITY
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED AND ORIENTED SOLDER JOINTS
- Publication number 20130335939
- Publication date Dec 19, 2013
- Aleksandar Aleksov
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STUD BUMP STRUCTURE FOR SEMICONDUCTOR PACKAGE ASSEMBLIES
- Publication number 20130285238
- Publication date Oct 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the central area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of direct bonding semiconductor components

Manufacturing method of chip package

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Method and systems for coupling semiconductor substrates

Stud bump structure for semiconductor package assemblies

Semiconductor device

Semiconductor device structures for burn-in testing and methods the...

Semiconductor package with heat-dissipating structure and method of...

High density package interconnects

Semiconductor package having an electro-magnetic interference shie...

Semiconductor chip mounted on a packaging substrate

Semiconductor device and method of manufacturing the same

High density package interconnects

Semiconductor device having conductive bumps of varying heights

High density package interconnects

Semiconductor package having stacked chips and a heat dissipation p...

Ball grid array system

Stud bump structure for semiconductor package assemblies

Semiconductor package structure with polymeric layer and manufactur...

Semiconductor packages

Surface mount high-frequency circuit

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Bumps for chip scale packaging including under bump metal structure...

Printed circuit board and semiconductor package using the same

Semiconductor device having solderable and bondable electrical cont...

Semiconductor device

Semiconductor device and method of forming 3D semiconductor package...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

MANUFACTURING METHOD OF CHIP PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

HIGH DENSITY PACKAGE INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH DENSITY PACKAGE INTERCONNECTS

STUD BUMP STRUCTURE FOR SEMICONDUCTOR PACKAGE ASSEMBLIES

Semiconductor Package Configured for Connection to a Board

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

SEMICONDUCTOR DEVICE

HIGH DENSITY PACKAGE INTERCONNECTS

Bumps for Chip Scale Packaging

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME

ROUTING METHOD FOR FLIP CHIP PACKAGE AND APPARATUS USING THE SAME

SEMICONDUCTOR DEVICE

HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING TH...

SHAPED AND ORIENTED SOLDER JOINTS

STUD BUMP STRUCTURE FOR SEMICONDUCTOR PACKAGE ASSEMBLIES

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT