Covering only the central area of the surface to be connected

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H01L2224/14166

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14166Covering only the central area of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for aligning IC die to package substrate
- Patent number 7,052,968
- Issue date May 30, 2006
- Advanced Micro Devices, Inc.
- Swee Peng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20130105993
- Publication date May 2, 2013
- GENERAL ELECTRIC COMPANY
- Raj BAHADUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level compliant packages for rear-face illuminated solid stat...
- Publication number 20100053407
- Publication date Mar 4, 2010
- Tessera, Inc.
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS