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H01L2224/14135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14135Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 12,027,492
- Issue date Jul 2, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 11,848,247
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an input/output circuit
- Patent number 11,688,686
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Woonki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip power supply system, chip, PCB, and computer device
- Patent number 11,387,226
- Issue date Jul 12, 2022
- Huawei Technologies Co., Ltd.
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,848
- Issue date Apr 26, 2022
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
- Patent number 11,251,154
- Issue date Feb 15, 2022
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,244,919
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 11,037,854
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,037,819
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and systems for coupling semiconductor substrates
- Patent number 10,971,540
- Issue date Apr 6, 2021
- FLIR Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bump
- Patent number 10,879,185
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump structure for semiconductor package assemblies
- Patent number 10,879,203
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 10,763,286
- Issue date Sep 1, 2020
- Sony Corporation
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including a plurality of pads
- Patent number 10,756,059
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Kwanyeob Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package for improving freedom of arrangement of...
- Patent number 10,714,402
- Issue date Jul 14, 2020
- Sony Corporation
- Hiroyuki Shigeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device structures for burn-in testing and methods the...
- Patent number 10,712,382
- Issue date Jul 14, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- G01 - MEASURING TESTING
Information Patent Grant
Anisotropic conductive film
- Patent number 10,714,444
- Issue date Jul 14, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057349
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20230245923
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20230197632
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS
- Publication number 20220361339
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Junghwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20220028828
- Publication date Jan 27, 2022
- AISIN CORPORATION
- Takanobu NARUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220020682
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Woonki LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407948
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Young Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20210305086
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20210287957
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE
- Publication number 20210143141
- Publication date May 13, 2021
- Huawei Technologies Co., Ltd
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BUMP
- Publication number 20210118804
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200321326
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20200294845
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...
- Publication number 20200279827
- Publication date Sep 3, 2020
- STATS ChipPAC Pte Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20200152543
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE STRUCTURE WITH BUMP
- Publication number 20200135651
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200006311
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190371754
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20190267305
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190244925
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20190172778
- Publication date Jun 6, 2019
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190139927
- Publication date May 9, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
- Publication number 20190123017
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...
- Publication number 20190096861
- Publication date Mar 28, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stress reduction apparatus and method

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor module and semiconductor device

Method and system for packing optimization of semiconductor devices

Thermal dissipation through seal rings in 3DIC structure

Integrated chip and semiconductor package including the same

Semiconductor device including an input/output circuit

Wafer level chip scale packaging intermediate structure apparatus a...

Coupling inductors in an IC device using interconnecting elements w...

Semiconductor package and manufacturing method thereof

Chip power supply system, chip, PCB, and computer device

Semiconductor device and method of manufacturing semiconductor device

Thin 3D fan-out embedded wafer level package (EWLB) for application...

Stress reduction apparatus and method

Package structure and method of fabricating the same

Method and system for packing optimization of semiconductor devices

Thermal dissipation through seal rings in 3DIC structure

Wafer level chip scale packaging intermediate structure apparatus a...

Method and systems for coupling semiconductor substrates

Package structure with bump

Stud bump structure for semiconductor package assemblies

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor device

Semiconductor device, manufacturing method thereof, and electronic...

Semiconductor chip including a plurality of pads

Method and system for packing optimization of semiconductor devices

Method of manufacturing chip-on-chip structure comprising sinterted...

Semiconductor chip package for improving freedom of arrangement of...

Semiconductor device structures for burn-in testing and methods the...

Anisotropic conductive film

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...

SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

Thermal Dissipation Through Seal Rings in 3DIC Structure

CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE

PACKAGE STRUCTURE WITH BUMP

Method and System for Packing Optimization of Semiconductor Devices

Stress Reduction Apparatus and Method

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Thermal Dissipation Through Seal Rings in 3DIC Structure

ANISOTROPIC CONDUCTIVE FILM

PACKAGE STRUCTURE WITH BUMP

Stress Reduction Apparatus and Method

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Thermal Dissipation Through Seal Rings in 3DIC Structure

SEMICONDUCTOR DEVICE

HIGH DENSITY PACKAGE INTERCONNECTS

ANISOTROPIC CONDUCTIVE FILM

Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...