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H01L2224/06135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06135Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of recesses and molding m...
- Patent number 12,057,357
- Issue date Aug 6, 2024
- Samsung Electronics Co, Ltd.
- Kyong Hwan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,057,462
- Issue date Aug 6, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Horikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,862,645
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- So Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,043
- Issue date Nov 21, 2023
- Samsung Electronics Co, Ltd.
- Hyunjun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive adhesive layer
- Patent number 11,805,685
- Issue date Oct 31, 2023
- Samsung Display Co., Ltd.
- Youngmin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,657,953
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor using a boosting capacitor and a negative bias voltage
- Patent number 11,637,979
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Kyungho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,374
- Issue date Apr 11, 2023
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor dies of differing size...
- Patent number 11,552,050
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Ahmad Zarif Bin Azahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,351
- Issue date Sep 6, 2022
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having a plurality of pad terminals including connec...
- Patent number 11,393,851
- Issue date Jul 19, 2022
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,387,172
- Issue date Jul 12, 2022
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347401
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304526
- Publication date Sep 12, 2024
- RENESAS ELECTRONICS CORPORATION
- Masato NUMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306303
- Publication date Sep 12, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR BONDED WAFER BARRIER
- Publication number 20240282716
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES
- Publication number 20240282730
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kishan Chanumolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240268025
- Publication date Aug 8, 2024
- Yunnan Invensight Optoelectronics Technology Co., Ltd.
- Xiao BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...
- Publication number 20240257863
- Publication date Aug 1, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20240249982
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE SEMICONDUCTOR DEVICE
- Publication number 20240243101
- Publication date Jul 18, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Receiving Element and Light Receiving Circuit
- Publication number 20240222532
- Publication date Jul 4, 2024
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240179925
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jaekyu SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170421
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, DISPLAY PANEL, FLEXIBLE CIRCUIT BOARD AND DISPLA...
- Publication number 20240128278
- Publication date Apr 18, 2024
- HEFEI VISIONOX TECHNOLOGY CO., LTD.
- Fengjie XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
- Publication number 20240038295
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Um
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411354
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Chihong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
- Publication number 20230245942
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230131531
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Hyunseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Type of bumpless and wireless semiconductor device
- Publication number 20230097173
- Publication date Mar 30, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Folded Source Driver Outputs of a Display Panel Having a...
- Publication number 20230045931
- Publication date Feb 16, 2023
- PARADE TECHNOLOGIES, LTD.
- You Ben Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZE...
- Publication number 20220230992
- Publication date Jul 21, 2022
- Western Digital Technologies, Inc.
- Ahmad Zarif Bin Azahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Sensor package structure

Bonded structures

Display device including connection pad part and electronic compone...

Semiconductor package including plurality of recesses and molding m...

Solid-state imaging device and electronic apparatus

Radio-frequency switching devices having improved voltage handling...

Semiconductor structure

Pad structure design in fan-out package

Memories and memory components with interconnected and redundant da...

Semiconductor package and method of fabricating the same

Methods related to radio-frequency switching devices having improve...

Display device

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor package

Display device including adhesive film with conductive ball

Electronic device including conductive adhesive layer

Display panel and manufacturing method for same

Bonded structures

Semiconductor package including stacked semiconductor chips

Semiconductor device and semiconductor module

Semiconductor package for improving bonding reliability

Image sensor using a boosting capacitor and a negative bias voltage

Semiconductor device

Semiconductor device including semiconductor dies of differing size...

Semiconductor structure and method for forming the same

Semiconductor device

Pad structure design in fan-out package

Display device having a plurality of pad terminals including connec...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

STRUCTURE AND METHOD FOR BONDED WAFER BARRIER

INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES

DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

STACKED CHIP SCALE SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Light-Receiving Element and Light Receiving Circuit

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

BONDING STRUCTURE, DISPLAY PANEL, FLEXIBLE CIRCUIT BOARD AND DISPLA...

SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...

SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG

SEMICONDUCTOR PACKAGE

Type of bumpless and wireless semiconductor device

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Dual-Side Folded Source Driver Outputs of a Display Panel Having a...

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

SEMICONDUCTOR STRUCTURE

Pad Structure Design in Fan-Out Package

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZE...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF