Covering only the peripheral area of the surface to be connected

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CPC
H01L2224/33135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33135Covering only the peripheral area of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for package reinforcement using molding underfill
- Patent number 9,287,143
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Package Reinforcement
- Publication number 20140159223
- Publication date Jun 12, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS