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H01L2224/14155

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14155Covering only the peripheral area of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,881,840
- Issue date Jan 23, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate and fabrication method thereof, display panel and d...
- Patent number 11,563,036
- Issue date Jan 24, 2023
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with flexible printed circuits
- Patent number 11,171,170
- Issue date Nov 9, 2021
- Sony Corporation
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 10,854,584
- Issue date Dec 1, 2020
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,714,444
- Issue date Jul 14, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,553,554
- Issue date Feb 4, 2020
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuits packaging with increas...
- Patent number 10,381,326
- Issue date Aug 13, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing endoscope image pickup module, endoscope i...
- Patent number 10,326,919
- Issue date Jun 18, 2019
- Olympus Corporation
- Jumpei Yoneyama
- G02 - OPTICS
Information Patent Grant
Driver IC, display device, and inspection system
- Patent number 9,875,674
- Issue date Jan 23, 2018
- Japan Display Inc.
- Chunhan Zhang
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 9,818,678
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package configurations and methods of making the same
- Patent number 9,799,628
- Issue date Oct 24, 2017
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 9,786,621
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,673,139
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshige Hirano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer level packaging of multiple light emitting diodes (LEDs) on a...
- Patent number 9,666,764
- Issue date May 30, 2017
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 9,653,643
- Issue date May 16, 2017
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of multiple light emitting diodes (LEDs) on a...
- Patent number 9,634,197
- Issue date Apr 25, 2017
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,570,423
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Chul-yong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,524,946
- Issue date Dec 20, 2016
- Murata Manufacturing Co., Ltd.
- Katsumi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method of electronic component and electronic component mo...
- Patent number 9,439,300
- Issue date Sep 6, 2016
- Ricoh Company, Ltd.
- Yuichi Tanida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with bumps and display device module incorpora...
- Patent number 9,385,096
- Issue date Jul 5, 2016
- SYNAPTICS DISPLAY DEVICES GK
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method thereof
- Patent number 9,373,597
- Issue date Jun 21, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact test structure and method
- Patent number 9,368,417
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY PANEL
- Publication number 20240006397
- Publication date Jan 4, 2024
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE
- Publication number 20230307458
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Motoji TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20230187369
- Publication date Jun 15, 2023
- Canon Kabushiki Kaisha
- Nobuaki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...
- Publication number 20220352105
- Publication date Nov 3, 2022
- Rohm Co., Ltd.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20220166407
- Publication date May 26, 2022
- MURATA MANUFACTURING CO., LTD.
- Daisuke MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20210367112
- Publication date Nov 25, 2021
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210203302
- Publication date Jul 1, 2021
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)
- Publication number 20210104503
- Publication date Apr 8, 2021
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...
- Publication number 20200411562
- Publication date Dec 31, 2020
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190244926
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structures in Package Structure
- Publication number 20180047690
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20170271561
- Publication date Sep 21, 2017
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160293575
- Publication date Oct 6, 2016
- MEDIATEK INC.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING UNIT AND MANUFACTURING METHOD OF LIGHT-EMITTING UNIT
- Publication number 20160276322
- Publication date Sep 22, 2016
- TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Keiichi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140291836
- Publication date Oct 2, 2014
- SEIKO EPSON CORPORATION
- Shigehisa TAJIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...
- Publication number 20140218881
- Publication date Aug 7, 2014
- RICOH COMPANY, LTD.
- Yuichi Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140203431
- Publication date Jul 24, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELONGATED BUMP STRUCTURES IN PACKAGE STRUCTURE
- Publication number 20140191391
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20140084430
- Publication date Mar 27, 2014
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140077217
- Publication date Mar 20, 2014
- KABUSHIKI KAISHA TOSHIBA
- Yasunobu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structures for Semiconductor Package
- Publication number 20140061897
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140054765
- Publication date Feb 27, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seo-Hyeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140015111
- Publication date Jan 16, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140008798
- Publication date Jan 9, 2014
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio-frequency module and communication device

Wafer level packaging of light emitting diodes (LEDs)

Method of direct bonding semiconductor components

Array substrate and fabrication method thereof, display panel and d...

Coupling inductors in an IC device using interconnecting elements w...

Image sensor package with flexible printed circuits

Driving chip, display substrate, display device and method for manu...

Wafer level packaging of light emitting diodes (LEDs)

Elongated bump structures in package structure

Method of manufacturing chip-on-chip structure comprising sinterted...

Anisotropic conductive film

Semiconductor package with heat-dissipating structure and method of...

Anisotropic conductive film

Structure and method for integrated circuits packaging with increas...

Method for manufacturing endoscope image pickup module, endoscope i...

Driver IC, display device, and inspection system

Semiconductor device

Stacked package configurations and methods of making the same

Elongated bump structures in package structure

Semiconductor device

Wafer level packaging of multiple light emitting diodes (LEDs) on a...

Wafer level packaging of light emitting diodes (LEDs)

Wafer level packaging of multiple light emitting diodes (LEDs) on a...

Semiconductor device including asymmetric electrode arrangement

Semiconductor package and method of manufacturing the semiconductor...

Electronic device

Mounting method of electronic component and electronic component mo...

Semiconductor device with bumps and display device module incorpora...

Chip package and method thereof

Contact test structure and method

Patents Applicationslast 30 patents

DISPLAY PANEL

INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE

ELECTRONIC MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...

BUMP STRUCTURE OF CHIP

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

MULTILAYER BODY AND METHOD OF MANUFACTURING THE SAME

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)

ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...

ANISOTROPIC CONDUCTIVE FILM

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Elongated Bump Structures in Package Structure

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

SYSTEM-IN-PACKAGE AND FABRICATION METHOD THEREOF

LIGHT-EMITTING UNIT AND MANUFACTURING METHOD OF LIGHT-EMITTING UNIT

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

SEMICONDUCTOR DEVICE

MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

ELONGATED BUMP STRUCTURES IN PACKAGE STRUCTURE

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

SEMICONDUCTOR DEVICE

Bump Structures for Semiconductor Package

DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE