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  • H01L2224/09155
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09155Covering only the peripheral area of the surface to be connected
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230044711
    • Publication date Feb 9, 2023
    • Fuji Electric Co., Ltd.
    • Tomofumi OOSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE
    • Publication number 20200395340
    • Publication date Dec 17, 2020
    • SK HYNIX INC.
    • Seung Yeop LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
    • Publication number 20200185350
    • Publication date Jun 11, 2020
    • AZUREWAVE TECHNOLOGIES, INC.
    • Chuan Jin
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGE
    • Publication number 20190333907
    • Publication date Oct 31, 2019
    • Samsung Electronics Co., Ltd.
    • Dong-ha LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGE
    • Publication number 20180130782
    • Publication date May 10, 2018
    • Samsung Electronics Co., Ltd.
    • Dong-ha LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EXPOSED SIDE-WALL AND LGA ASSEMBLY
    • Publication number 20170372989
    • Publication date Dec 28, 2017
    • QUALCOMM Incorporated
    • Daeik Daniel Kim
    • H01 - BASIC ELECTRIC ELEMENTS