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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/3512Cracking
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
    • Publication number 20240387317
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Chen Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE
    • Publication number 20240387347
    • Publication date Nov 21, 2024
    • MEDIATEK INC.
    • Tai-Hao PENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
    • Publication number 20240387349
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chin-Hua WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
    • Publication number 20240387419
    • Publication date Nov 21, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Pawel Mrozek
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240387474
    • Publication date Nov 21, 2024
    • DENSO CORPORATION
    • TOSHIHIRO NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PASSIVATION LAYERS WITH ROUNDED CORNERS
    • Publication number 20240387244
    • Publication date Nov 21, 2024
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    • Mingni CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
    • Publication number 20240387430
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chang-Jung Hsueh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
    • Publication number 20240379602
    • Publication date Nov 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wen-Chih Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF CRACKS IN PASSIVATION LAYER
    • Publication number 20240379593
    • Publication date Nov 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Kuo-An Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME
    • Publication number 20240379618
    • Publication date Nov 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hsien-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
    • Publication number 20240371780
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Li-Hsien Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20240371739
    • Publication date Nov 7, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Pin-Yao CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE
    • Publication number 20240363483
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • TING-YU YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
    • Publication number 20240363473
    • Publication date Oct 31, 2024
    • Avago Technologies International Sales Pte. Limited
    • Hyunsuk Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...
    • Publication number 20240363561
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shu-Wei Chung
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
    • Publication number 20240355696
    • Publication date Oct 24, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hang CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method of Manufacture
    • Publication number 20240355762
    • Publication date Oct 24, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
    • Publication number 20240347407
    • Publication date Oct 17, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Chen LAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240347426
    • Publication date Oct 17, 2024
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240347494
    • Publication date Oct 17, 2024
    • Murata Manufacturing Co., Ltd.
    • Mari SAJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SILICON CARBIDE SEMICONDUCTOR DEVICE
    • Publication number 20240339419
    • Publication date Oct 10, 2024
    • Sumitomo Electric Industries, Ltd.
    • Shota SAMBONSUGE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240339425
    • Publication date Oct 10, 2024
    • Murata Manufacturing Co., Ltd.
    • Mari SAJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240332109
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Shinichiro SEKIJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20240321692
    • Publication date Sep 26, 2024
    • AMOSENSE CO., LTD.
    • Jinhyuck BIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240321811
    • Publication date Sep 26, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PAD AND PACKAGE INCLUDING SAME
    • Publication number 20240321788
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Wenjun WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
    • Publication number 20240321774
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Kitae Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321815
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Soohyun NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240321675
    • Publication date Sep 26, 2024
    • Fuji Electric Co., Ltd.
    • Satoshi KANEKO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240312947
    • Publication date Sep 19, 2024
    • Kabushiki Kaisha Toshiba
    • Tomohiro IGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS