Cross section geometry

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H01L23/49548

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49548Cross section geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection method
- Patent number 12,169,216
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Tsuyoshi Tachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,165,880
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module leadless package
- Patent number 12,142,550
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,009,317
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact leadframe package
- Patent number 11,948,868
- Issue date Apr 2, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,948,869
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Naoki Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of floated singulation
- Patent number 11,935,789
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Chang-Yen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421046
- Publication date Dec 19, 2024
- Kabushiki Kaisha Toshiba
- Yoshiki ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240421050
- Publication date Dec 19, 2024
- Shinko Electric Industries Co., Ltd.
- Etsuo UEMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413059
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Lei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
- Publication number 20240363499
- Publication date Oct 31, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363502
- Publication date Oct 31, 2024
- Infineon Technlolgies AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355713
- Publication date Oct 24, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240339384
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ymarson Algamas Bangaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332250
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Antonio BELLIZZI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...
- Publication number 20240332136
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321769
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVI...
- Publication number 20240321695
- Publication date Sep 26, 2024
- NXP USA, Inc.
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240297102
- Publication date Sep 5, 2024
- ROHM CO., LTD.
- Masato IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF
- Publication number 20240290631
- Publication date Aug 29, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240266263
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Mamoru TOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...
- Publication number 20240234262
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Junichi NITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...
- Publication number 20240222139
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240213207
- Publication date Jun 27, 2024
- Panasonic Holdings Corporation
- Masato MAEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME INCLUDING LEAD WITH GROOVE FORMED THEREIN
- Publication number 20240194571
- Publication date Jun 13, 2024
- HAESUNG DS CO., LTD
- Do Yeon WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20240194572
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170373
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Cross section geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor device and inspection method

Semiconductor device

Semiconductor light emitting device and method for manufacturing th...

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor device including a semiconductor element having elect...

Flat no-lead package with surface mounted structure

High performance semiconductor device

Multi-chip module leadless package

Semiconductor device

Electronic package structure with reduced vertical stress regions

Methods and apparatus for an improved integrated circuit package

Semiconductor package

Semiconductor packages with roughened conductive components

Lead frame assembly having a plurality of dicing holes

Leadframe package with pre-applied filler material

Semiconductor device and mounting structure thereof

Flat no-lead package with surface mounted structure

Semiconductor package having routable encapsulated conductive subst...

Packaging of a semiconductor device with a plurality of leads

Mechanical couplings designed to resolve process constraints

Semiconductor package structure and method for manufacturing the same

Semiconductor device including an embedded semiconductor die

Plurality of overlapping power terminals in a semiconductor module

Tie bar removal for semiconductor device packaging

Compact leadframe package

Semiconductor device and method for manufacturing the same

Circuit module having a plurality of lead frames connected to a sub...

Method of floated singulation

Flip chip package assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

LEADFRAME AND SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF

SEMICONDUCTOR APPARATUS

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...

MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LEAD FRAME INCLUDING LEAD WITH GROOVE FORMED THEREIN

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE