Cross section geometry

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H01L23/49548

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49548Cross section geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,249,560
- Issue date Mar 11, 2025
- Rohm Co., Ltd
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top circuit and an IC with a gap over th...
- Patent number 12,237,247
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate with 3-sided w...
- Patent number 12,176,273
- Issue date Dec 24, 2024
- Semtech Corporation
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection method
- Patent number 12,169,216
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Tsuyoshi Tachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,165,880
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module leadless package
- Patent number 12,142,550
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
- Publication number 20250112114
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ninad Shahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250112131
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Konosuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250105024
- Publication date Mar 27, 2025
- STMicroelectronics S.r.l
- Fulvio Vittorio FONTANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105105
- Publication date Mar 27, 2025
- LAPIS SEMICONDUCTOR CO., LTD.
- Ryo SEKIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250096078
- Publication date Mar 20, 2025
- RENESAS ELECTRONICS CORPORATION
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Management Integrated Circuit (PMIC) and Power Management System
- Publication number 20250079270
- Publication date Mar 6, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Cheng-Han Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...
- Publication number 20250079271
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...
- Publication number 20250079273
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
- Publication number 20250062197
- Publication date Feb 20, 2025
- SEMTECH CORPORATION
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20250054845
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER
- Publication number 20250054842
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Rowel TABAJONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20250038009
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD LOCK
- Publication number 20250038077
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- CHU-YUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20250038075
- Publication date Jan 30, 2025
- Huawei Technologies Co., Ltd
- Weichuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS
- Publication number 20250038082
- Publication date Jan 30, 2025
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20250029899
- Publication date Jan 23, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Kyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022779
- Publication date Jan 16, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE LEADLESS PACKAGE
- Publication number 20250022781
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...
- Publication number 20250006597
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alternating Lead Configuration for Semiconductor Package
- Publication number 20250006599
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dolores P. Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR
- Publication number 20250006598
- Publication date Jan 2, 2025
- NXP B.V.
- Yao Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS

Cross section geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method for manufacturing electronic device

Packaged electronic device with film isolated power stack

Semiconductor package with top circuit and an IC with a gap over th...

Semiconductor device having cavities at an interface of an encapsul...

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Semiconductor device

Semiconductor device

Semiconductor device and method of forming substrate with 3-sided w...

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor device and inspection method

Semiconductor device

Semiconductor light emitting device and method for manufacturing th...

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor device including a semiconductor element having elect...

Flat no-lead package with surface mounted structure

High performance semiconductor device

Multi-chip module leadless package

Semiconductor device

Electronic package structure with reduced vertical stress regions

Methods and apparatus for an improved integrated circuit package

Semiconductor package

Semiconductor packages with roughened conductive components

Lead frame assembly having a plurality of dicing holes

Leadframe package with pre-applied filler material

Semiconductor device and mounting structure thereof

Flat no-lead package with surface mounted structure

Semiconductor package having routable encapsulated conductive subst...

Packaging of a semiconductor device with a plurality of leads

Mechanical couplings designed to resolve process constraints

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Power Management Integrated Circuit (PMIC) and Power Management System

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...

BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...

Semiconductor Device and Method of Forming Substrate with 3-Sided W...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER

STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE WITH LEAD LOCK

CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE

PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS

ELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MULTI-CHIP MODULE LEADLESS PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...

Alternating Lead Configuration for Semiconductor Package

SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS