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H01L2224/37012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37012Cross-sectional shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using same
- Patent number 11,694,948
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Masashi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with three leads
- Patent number 11,688,714
- Issue date Jun 27, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module for PCB embedding
- Patent number 11,404,392
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,289,441
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe assembly for a semiconductor device
- Patent number 10,714,413
- Issue date Jul 14, 2020
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,656
- Issue date Jan 7, 2020
- Mitsubishi Electric Corporation
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Die package component with jumper structure
- Patent number 10,312,183
- Issue date Jun 4, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package component with jumper structure and manufacturing metho...
- Patent number 10,297,535
- Issue date May 21, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common contact leadframe for multiphase applications
- Patent number 10,128,173
- Issue date Nov 13, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of semiconductor chips,...
- Patent number 9,460,938
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Hiroyasu Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240234360
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240136319
- Publication date Apr 25, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105666
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Daisuke Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
- Publication number 20240096763
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRIC...
- Publication number 20240063105
- Publication date Feb 22, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240038637
- Publication date Feb 1, 2024
- NEXPERIA B.V.
- Jia Yunn Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230411359
- Publication date Dec 21, 2023
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP APPLIED TO POWER MODULE
- Publication number 20230395554
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343755
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230223441
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY
- Publication number 20220216175
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Sung Chul JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE MODULE FOR AN INVERTER OF AN ELECTRIC DRIVE OF AN ELECT...
- Publication number 20210313296
- Publication date Oct 7, 2021
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Processes for Increasing Semiconductor Device Reliability
- Publication number 20210111144
- Publication date Apr 15, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210013170
- Publication date Jan 14, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20200194354
- Publication date Jun 18, 2020
- NEXPERIA B.V.
- Ricardo Lagmay YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20200168575
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON CONTACT LEADFRAME FOR MULTIPHASE APPLICATIONS
- Publication number 20180102307
- Publication date Apr 12, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Cross-sectional shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with adjustable clip

Semiconductor device having a contact clip with a contact region ha...

Systems and processes for increasing semiconductor device reliability

Method for processing a semiconductor wafer, semiconductor wafer, c...

Semiconductor device and semiconductor module using same

Semiconductor package with three leads

High voltage semiconductor package with pin fit leads

Electronic module, method of manufacturing connector, and method of...

Molded semiconductor module for PCB embedding

Method for die and clip attachment

Systems and processes for increasing semiconductor device reliability

Semiconductor device and method for fabricating a semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Leadframe assembly for a semiconductor device

Electronic device

Semiconductor device

Semiconductor devices and methods of making the same

Semiconductor devices and methods of making the same

Semiconductor device, and alternator and power conversion device wh...

Die package component with jumper structure

Die package component with jumper structure and manufacturing metho...

Common contact leadframe for multiphase applications

Clip and related methods

Clip and related methods

Packaging solutions for devices and systems comprising lateral GaN...

Semiconductor package with conductive clip

Power module and method of manufacturing power module

Semiconductor device and structure therefor

Semiconductor device including a plurality of semiconductor chips,...

Electric power semiconductor device

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR

SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRIC...

CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

METAL CLIP APPLIED TO POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS

SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

HALF-BRIDGE MODULE FOR AN INVERTER OF AN ELECTRIC DRIVE OF AN ELECT...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

Systems and Processes for Increasing Semiconductor Device Reliability

SEMICONDUCTOR DEVICE

LEADFRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Fabricating a Semiconductor Device

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

CLIP AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

COMMON CONTACT LEADFRAME FOR MULTIPHASE APPLICATIONS