Curing and solidification

Industry

CPC
H01L2224/03515

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03515Curing and solidification

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,020,951
- Issue date Jun 25, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a photoresist over a bond pad to mitigate bond pa...
- Patent number 11,222,857
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured film formed by curing photosensitive resin composition and me...
- Patent number 10,545,406
- Issue date Jan 28, 2020
- Toray Industries, Inc.
- Yu Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 10,522,406
- Issue date Dec 31, 2019
- International Busniess Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 9,935,009
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20240282592
- Publication date Aug 22, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20220189790
- Publication date Jun 16, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...
- Publication number 20210265291
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING
- Publication number 20190172814
- Publication date Jun 6, 2019
- LBSEMICON CO., LTD.
- Do Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURED FILM AND METHOD FOR MANUFACTURING SAME
- Publication number 20180203353
- Publication date Jul 19, 2018
- TORAY INDUSTRIES, INC.
- Yu SHOJI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20180182672
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECH...
- Publication number 20140057369
- Publication date Feb 27, 2014
- SK HYNIX INC.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
- Publication number 20130341785
- Publication date Dec 26, 2013
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

Curing and solidification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for forming microwave tunable composited thin-film dielectr...

Methods for registration of circuit dies and electrical interconnects

IR assisted fan-out wafer level packaging using silicon handler

Method of forming a photoresist over a bond pad to mitigate bond pa...

Semiconductor chip package with resilient conductive paste post and...

Cured film formed by curing photosensitive resin composition and me...

IR assisted fan-out wafer level packaging using silicon handler

IR assisted fan-out wafer level packaging using silicon handler

Electronic component mounting structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING

CURED FILM AND METHOD FOR MANUFACTURING SAME

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECH...

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

ELECTRONIC COMPONENT MOUNTING STRUCTURE