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CPC
C25D17/007

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/007Current conducting devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus having conductive liquid and plating method
- Patent number 12,104,266
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Choi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of electroplating a target electrode
- Patent number 12,104,270
- Issue date Oct 1, 2024
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 12,024,785
- Issue date Jul 2, 2024
- Maxeon Solar Pte. Ltd.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Array substrate, method for preparing array substrate, and backligh...
- Patent number 11,894,394
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhanfeng Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,851,781
- Issue date Dec 26, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Preparation method of copper-based graphene composite with high the...
- Patent number 11,834,751
- Issue date Dec 5, 2023
- CHANGZHOU UNIVERSITY
- Wei Wei
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,725,297
- Issue date Aug 15, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,686,008
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,686,009
- Issue date Jun 27, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical-deposition apparatuses and associated methods of el...
- Patent number 11,680,330
- Issue date Jun 20, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for creating a chromium-plated surface with a matte finish
- Patent number 11,643,747
- Issue date May 9, 2023
- Kings Mountain International, Inc
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High resistance virtual anode for electroplating cell
- Patent number 11,608,566
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Wei Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 11,598,018
- Issue date Mar 7, 2023
- SunPower Corporation
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for plating
- Patent number 11,591,709
- Issue date Feb 28, 2023
- Ebara Corporation
- Naoto Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,578,422
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of preparing articles by electrodeposition and additive man...
- Patent number 11,560,629
- Issue date Jan 24, 2023
- Modumetal, Inc.
- John D. Whitaker
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Masking and sealing system for multi-step surface treatment
- Patent number 11,453,954
- Issue date Sep 27, 2022
- Honeywell International Inc.
- Joseph William Mintzer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic processing jig and electrolytic processing method
- Patent number 11,427,920
- Issue date Aug 30, 2022
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 11,401,624
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,332,838
- Issue date May 17, 2022
- Ebara Corporation
- Gaku Yamasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Non-permeable substrate carrier for electroplating
- Patent number 11,280,019
- Issue date Mar 22, 2022
- SunPower Corporation
- Emmanuel Chua Abas
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating device
- Patent number 11,280,020
- Issue date Mar 22, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,268,207
- Issue date Mar 8, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,268,208
- Issue date Mar 8, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating processing apparatus
- Patent number 11,230,790
- Issue date Jan 25, 2022
- SUMITOMO ELECTRIC TOYAMA CO., LTD.
- Hitoshi Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Magnetic structure for metal plating control
- Patent number 11,230,791
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chin Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,180,864
- Issue date Nov 23, 2021
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Manufacturing apparatus and manufacturing method for semiconductor...
- Patent number 11,111,592
- Issue date Sep 7, 2021
- Tokyo Electron Limited
- Tomohisa Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS
- Publication number 20240368800
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Shigeyuki NAKAHAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
- Publication number 20240279838
- Publication date Aug 22, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESISTOR AND PLATING APPARATUS
- Publication number 20240279837
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240254648
- Publication date Aug 1, 2024
- EBARA CORPORATION
- Yusui GOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating Device
- Publication number 20240240350
- Publication date Jul 18, 2024
- Tyco Electronics (Suzhou) Ltd.
- Daiqiong (Diana) Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for electrolytically coating a steel strip by mea...
- Publication number 20240229276
- Publication date Jul 11, 2024
- SMS group GMBH
- Henry GÖRTZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR...
- Publication number 20240011180
- Publication date Jan 11, 2024
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
- Publication number 20230295830
- Publication date Sep 21, 2023
- Kings Mountain International, Inc.
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS
- Publication number 20230279579
- Publication date Sep 7, 2023
- EBARA CORPORATION
- Tsubasa ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROPLATING A TARGET ELECTRODE
- Publication number 20230272545
- Publication date Aug 31, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
- Publication number 20230193503
- Publication date Jun 22, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
- Publication number 20230193502
- Publication date Jun 22, 2023
- Maxeon Solar Pte. Ltd
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD
- Publication number 20230183881
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Jaewon CHOI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20230167573
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF PLATING
- Publication number 20230146732
- Publication date May 11, 2023
- EBARA CORPORATION
- Kazuma IDEGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND METHOD FOR PRODUCING WIRE RO...
- Publication number 20230120376
- Publication date Apr 20, 2023
- TEIKOKU ION CO., LTD.
- Takashi Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER COPPER FOIL, METHOD FOR MANUFACTURING SAME, AND ELECTROP...
- Publication number 20230047101
- Publication date Feb 16, 2023
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Hyo Jong LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL-DEPOSITION APPARATUSES AND ASSOCIATED METHODS OF EL...
- Publication number 20230029051
- Publication date Jan 26, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
- Publication number 20230008513
- Publication date Jan 12, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND METHOD FOR ELECTROPLATING WAFER
- Publication number 20220356594
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for electrolytically coating a steel strip by mea...
- Publication number 20220275530
- Publication date Sep 1, 2022
- SMS group GMBH
- Henry GÖRTZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING JIG AND METHOD FOR MANUFACTURING...
- Publication number 20220267920
- Publication date Aug 25, 2022
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPARATION METHOD OF COPPER-BASED GRAPHENE COMPOSITE WITH HIGH THE...
- Publication number 20220162764
- Publication date May 26, 2022
- CHANGZHOU UNIVERSITY
- Wei WEI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Continuously Applying Nanolaminate Metal C...
- Publication number 20220154357
- Publication date May 19, 2022
- Modumetal, Inc.
- Christina A. LOMASNEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
- Publication number 20220154363
- Publication date May 19, 2022
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20220145489
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20220119981
- Publication date Apr 21, 2022
- EBARA CORPORATION
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASKING AND SEALING SYSTEM FOR MULTI-STEP SURFACE TREATMENT
- Publication number 20220106699
- Publication date Apr 7, 2022
- Honeywell International Inc.
- Joseph William Mintzer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Current conducting devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus having conductive liquid and plating method

Methods of electroplating a target electrode

Dual wafer plating fixture for a continuous plating line

Electroplating system

Array substrate, method for preparing array substrate, and backligh...

Method and apparatus for continuously applying nanolaminate metal c...

Preparation method of copper-based graphene composite with high the...

Plating apparatus

Electroplating apparatus and electroplating method

Regulation plate, anode holder, and substrate holder

Electrochemical-deposition apparatuses and associated methods of el...

Method for creating a chromium-plated surface with a matte finish

High resistance virtual anode for electroplating cell

Dual wafer plating fixture for a continuous plating line

Apparatus for plating

Electroplating system

Methods of preparing articles by electrodeposition and additive man...

Electroplating apparatus for tailored uniformity profile

Masking and sealing system for multi-step surface treatment

Electrolytic processing jig and electrolytic processing method

Plating apparatus and method for electroplating wafer

Plating apparatus

Non-permeable substrate carrier for electroplating

Substrate holder and plating device

Regulation plate, anode holder, and substrate holder

Electroplating system

Plating processing apparatus

Magnetic structure for metal plating control

Method and apparatus for continuously applying nanolaminate metal c...

Manufacturing apparatus and manufacturing method for semiconductor...

Patents Applicationslast 30 patents

PLATING APPARATUS

ELECTROPLATING DEVICE AND ELECTROPLATING METHOD

RESISTOR AND PLATING APPARATUS

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

PLATING APPARATUS AND PLATING METHOD

Electroplating Device

Method and system for electrolytically coating a steel strip by mea...

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR...

METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH

PLATING APPARATUS

METHODS OF ELECTROPLATING A TARGET ELECTRODE

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...

DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE

PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD

ELECTROPLATING SYSTEM

APPARATUS FOR PLATING AND METHOD OF PLATING

PLATING APPARATUS, PLATING METHOD, AND METHOD FOR PRODUCING WIRE RO...

MULTILAYER COPPER FOIL, METHOD FOR MANUFACTURING SAME, AND ELECTROP...

ELECTROCHEMICAL-DEPOSITION APPARATUSES AND ASSOCIATED METHODS OF EL...

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...

PLATING APPARATUS AND METHOD FOR ELECTROPLATING WAFER

Method and system for electrolytically coating a steel strip by mea...

SEMICONDUCTOR DEVICE MANUFACTURING JIG AND METHOD FOR MANUFACTURING...

PREPARATION METHOD OF COPPER-BASED GRAPHENE COMPOSITE WITH HIGH THE...

Method and Apparatus for Continuously Applying Nanolaminate Metal C...

REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER

ELECTROPLATING SYSTEM

PLATING APPARATUS

MASKING AND SEALING SYSTEM FOR MULTI-STEP SURFACE TREATMENT