TREA

Deep blind vias

Follow

Industry

  • CPC
  • H05K2201/09518
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09518Deep blind vias
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
    • Publication number 20250081348
    • Publication date Mar 6, 2025
    • Intel Corporation
    • Arumanayagam RAJASEKAR
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071887
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • In Gun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250071897
    • Publication date Feb 27, 2025
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250016917
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY PANELS AND DISPLAY DEVICES
    • Publication number 20250008644
    • Publication date Jan 2, 2025
    • Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    • Liwang SONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
    • Publication number 20240389219
    • Publication date Nov 21, 2024
    • Dell Products L.P.
    • William Andrew Smith
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
    • Publication number 20240324104
    • Publication date Sep 26, 2024
    • Japan Tobacco Inc.
    • Keiji MARUBASHI
    • A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
  • Information Patent Application

    PACKAGING SUBSTRATES HAVING RINGLESS VIAS
    • Publication number 20240314940
    • Publication date Sep 19, 2024
    • Skyworks Solutions, Inc.
    • Ki Wook LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
    • Publication number 20240121897
    • Publication date Apr 11, 2024
    • NXP B.V.
    • Abdellatif Zanati
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
    • Publication number 20230319978
    • Publication date Oct 5, 2023
    • Dell Products L.P.
    • William Andrew Smith
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230309233
    • Publication date Sep 28, 2023
    • KIOXIA Corporation
    • Satoru FUKUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF
    • Publication number 20230164916
    • Publication date May 25, 2023
    • Celestica Technology Consultancy (Shanghai) Co. Ltd.
    • Jing LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230049806
    • Publication date Feb 16, 2023
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS
    • Publication number 20220394848
    • Publication date Dec 8, 2022
    • STEERING SOLUTIONS IP HOLDING CORPORATION
    • Ryan D. Yaklin
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Multilayer Circuit Board
    • Publication number 20220217851
    • Publication date Jul 7, 2022
    • INNOGRIT TECHNOLOGIES CO., LTD
    • Yanwen BAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION STRUCTURE EMBEDDED SUBSTRATE
    • Publication number 20220192020
    • Publication date Jun 16, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Joo Hwan JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
    • Publication number 20220095451
    • Publication date Mar 24, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHENG-JIA LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20210337665
    • Publication date Oct 28, 2021
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHENG-JIA LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYERED CIRCUIT BOARD
    • Publication number 20210136926
    • Publication date May 6, 2021
    • Avary Holding (Shenzhen) Co., Limited.
    • ZHI GUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed Circuit Board, Method Of Manufacturing The Same, And Mobile...
    • Publication number 20210045248
    • Publication date Feb 11, 2021
    • VIVO MOBILE COMMUNICATION CO., LTD.
    • Houxun TANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing Holes In Component Carrier Material
    • Publication number 20200253051
    • Publication date Aug 6, 2020
    • AT&S (China) Co. Ltd.
    • Seok Kim Tay
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Methods of Manufacturing Printed Circuit Boards
    • Publication number 20200084895
    • Publication date Mar 12, 2020
    • Kenneth Richard Tannehill
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND SKIP VIA STRUCTURES
    • Publication number 20190021176
    • Publication date Jan 17, 2019
    • GLOBALFOUNDRIES INC.
    • Shao Beng Law
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Methods of Manufacturing Printed Circuit Boards
    • Publication number 20180206347
    • Publication date Jul 19, 2018
    • Printed Circuits, Inc.
    • Kenneth Richard Tannehill
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAULT CONTAINMENT ROUTING
    • Publication number 20150264801
    • Publication date Sep 17, 2015
    • Honeywell International Inc.
    • Kenneth Lee Martin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
    • Publication number 20140374150
    • Publication date Dec 25, 2014
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME
    • Publication number 20140077357
    • Publication date Mar 20, 2014
    • VIA TECHNOLOGIES, INC.
    • Chen-Yueh Kung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT
    • Publication number 20140079403
    • Publication date Mar 20, 2014
    • Finisar Corporation
    • Henry Daghighian
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...
    • Publication number 20130256010
    • Publication date Oct 3, 2013
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Youb JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR