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H05K2201/09518

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09518Deep blind vias

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and wire arrangement method thereof
- Patent number 12,200,863
- Issue date Jan 14, 2025
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Jing Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,974
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Dong Hun Joung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate
- Patent number 11,576,261
- Issue date Feb 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joo Hwan Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method of manufacturing the same, and mobile...
- Patent number 11,490,520
- Issue date Nov 1, 2022
- VIVO MOBILE COMMUNICATION CO., LTD.
- Houxun Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered circuit board
- Patent number 11,297,722
- Issue date Apr 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method for manufacturing the same
- Patent number 11,234,331
- Issue date Jan 25, 2022
- HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,224,123
- Issue date Jan 11, 2022
- VITESCO TECHNOLOGIES GERMANY GMBH
- Thomas Rumrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing holes in component carrier material
- Patent number 11,039,535
- Issue date Jun 15, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered circuit board and method for manufacturing the same
- Patent number 10,881,008
- Issue date Dec 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards
- Patent number 10,524,366
- Issue date Dec 31, 2019
- Printed Circuits, LLC
- Kenneth Richard Tannehill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,219,374
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for embedding a discrete electrical device in a printed circ...
- Patent number 10,149,388
- Issue date Dec 4, 2018
- International Business Machines, Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with optical and electrical vias
- Patent number 9,995,894
- Issue date Jun 12, 2018
- AMS AG
- Jochen Kraft
- G02 - OPTICS
Information Patent Grant
Laminated coil component, module component, and method of manufactu...
- Patent number 9,972,432
- Issue date May 15, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihiro Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,763,319
- Issue date Sep 12, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board with metal foil wiring layer, wire wiring l...
- Patent number 9,668,345
- Issue date May 30, 2017
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module
- Patent number 9,534,751
- Issue date Jan 3, 2017
- Mag Instruments, Inc.
- Anthony Maglica
- F21 - LIGHTING
Information Patent Grant
Circuit substrate
- Patent number 9,425,066
- Issue date Aug 23, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 9,332,658
- Issue date May 3, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating a circuit substrate
- Patent number 9,324,580
- Issue date Apr 26, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed pluggable rigid-end flex circuit
- Patent number 9,204,537
- Issue date Dec 1, 2015
- Finisar Corporation
- Henry Meyer Daghighian
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded capacitive stack
- Patent number 9,161,447
- Issue date Oct 13, 2015
- Sanmina-SCI Corporation
- George Dudnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board design system and method
- Patent number 9,098,646
- Issue date Aug 4, 2015
- Kyocera Corporation
- Mumtaz Y. Bora
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 9,101,070
- Issue date Aug 4, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module
- Patent number 9,022,612
- Issue date May 5, 2015
- MAG Instrument, Inc.
- Anthony Maglica
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250016917
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANELS AND DISPLAY DEVICES
- Publication number 20250008644
- Publication date Jan 2, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Liwang SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
- Publication number 20240324104
- Publication date Sep 26, 2024
- Japan Tobacco Inc.
- Keiji MARUBASHI
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240298406
- Publication date Sep 5, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20230319978
- Publication date Oct 5, 2023
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230309233
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Satoru FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF
- Publication number 20230164916
- Publication date May 25, 2023
- Celestica Technology Consultancy (Shanghai) Co. Ltd.
- Jing LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230049806
- Publication date Feb 16, 2023
- LG Innotek Co., Ltd.
- Dong Hun JOUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS
- Publication number 20220394848
- Publication date Dec 8, 2022
- STEERING SOLUTIONS IP HOLDING CORPORATION
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multilayer Circuit Board
- Publication number 20220217851
- Publication date Jul 7, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE EMBEDDED SUBSTRATE
- Publication number 20220192020
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Joo Hwan JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210337665
- Publication date Oct 28, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD
- Publication number 20210136926
- Publication date May 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- ZHI GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board, Method Of Manufacturing The Same, And Mobile...
- Publication number 20210045248
- Publication date Feb 11, 2021
- VIVO MOBILE COMMUNICATION CO., LTD.
- Houxun TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Holes In Component Carrier Material
- Publication number 20200253051
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Manufacturing Printed Circuit Boards
- Publication number 20200084895
- Publication date Mar 12, 2020
- Kenneth Richard Tannehill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Manufacturing Printed Circuit Boards
- Publication number 20180206347
- Publication date Jul 19, 2018
- Printed Circuits, Inc.
- Kenneth Richard Tannehill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT CONTAINMENT ROUTING
- Publication number 20150264801
- Publication date Sep 17, 2015
- Honeywell International Inc.
- Kenneth Lee Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20140374150
- Publication date Dec 25, 2014
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20140077357
- Publication date Mar 20, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT
- Publication number 20140079403
- Publication date Mar 20, 2014
- Finisar Corporation
- Henry Daghighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...
- Publication number 20130256010
- Publication date Oct 3, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae Youb JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Interposer and Opposing...
- Publication number 20130241080
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120302010
- Publication date Nov 29, 2012
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
- Publication number 20120234591
- Publication date Sep 20, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Deep blind vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and wire arrangement method thereof

Circuit board

Micro-ground vias for improved signal integrity for high-speed seri...

Method for manufacturing multilayer printed circuit board

Printed circuit boards with plated blind slots for improved vertica...

Multilayer circuit board

Connection structure embedded substrate

Printed circuit board, method of manufacturing the same, and mobile...

Multi-layered circuit board

Multilayer printed circuit board and method for manufacturing the same

Circuit board

Manufacturing holes in component carrier material

Multi-layered circuit board and method for manufacturing the same

Methods of manufacturing printed circuit boards

Via and skip via structures

Printed wiring board

Method for embedding a discrete electrical device in a printed circ...

Semiconductor device with optical and electrical vias

Laminated coil component, module component, and method of manufactu...

Package substrate and method for manufacturing package substrate

Multilayer wiring board with metal foil wiring layer, wire wiring l...

LED module

Circuit substrate

Wiring board, semiconductor device, and method for manufacturing wi...

Process for fabricating a circuit substrate

High-speed pluggable rigid-end flex circuit

Embedded capacitive stack

Printed circuit board design system and method

Method for manufacturing multilayer printed wiring board

LED module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

DISPLAY PANELS AND DISPLAY DEVICES

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

PRINTED WIRING BOARD

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF

CIRCUIT BOARD

SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS

Multilayer Circuit Board

CONNECTION STRUCTURE EMBEDDED SUBSTRATE

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYERED CIRCUIT BOARD

Printed Circuit Board, Method Of Manufacturing The Same, And Mobile...

Manufacturing Holes In Component Carrier Material

Methods of Manufacturing Printed Circuit Boards

VIA AND SKIP VIA STRUCTURES

Methods of Manufacturing Printed Circuit Boards

FAULT CONTAINMENT ROUTING

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME

HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT

METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...

Semiconductor Device and Method of Forming Interposer and Opposing...

MULTILAYER PRINTED WIRING BOARD

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD