Deformation absorbing parts in the lead frame plane

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H01L23/49544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49544Deformation absorbing parts in the lead frame plane

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with die pads and leads
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Semiconductor device comprising first and second lead frames
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Method for making semiconductor device with sidewall recess and rel...
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Wire bond clamp design and lead frame capable of engaging with same
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- Issue date Dec 8, 2020
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Semiconductor systems having dual leadframes
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Semiconductor systems having premolded dual leadframes
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- Texas Instruments Incorporated
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Information Patent Grant
Lead frame and method for manufacturing the same
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- Issue date May 28, 2019
- OHKUCHI MATERIALS CO., LTD.
- Jun Fukuzaki
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Lead frame and method of producing a chip housing
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Semiconductor package including a device and lead frame used for th...
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Lead frame including a plurality of units connected together and se...
- Patent number 10,096,758
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Method for making semiconductor device with sidewall recess and rel...
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Packaged semiconductor devices with laser grooved wettable flank an...
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Wiring circuit board and method of manufacturing the same
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Lead frame, method for manufacturing lead frame, semiconductor devi...
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Semiconductor package
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Semiconductor component and method of manufacture
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- Balaji Padmanabhan
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Non-planar inductive electrical elements in semiconductor package l...
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- Issue date Jul 11, 2017
- SOLANTRO SEMICONDUCTOR CORP.
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Patents Applicationslast 30 patents

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LEAD FRAME AND PACKAGE METHOD
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LEAD FRAME AND PACKAGING METHOD
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SEMICONDUCTOR DEVICE
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- Kabushiki Kaisha Toshiba
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SEMICONDUCTOR DEVICE
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- Kabushiki Kaisha Toshiba
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ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...
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SEMICONDUCTOR DEVICE
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POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
- Publication number 20210343620
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- Semiconductor Components Industries, LLC
- Yushuang YAO
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LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
- Publication number 20210183737
- Publication date Jun 17, 2021
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- ROHM CO., LTD.
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PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...
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- Fairchild Semiconductor Corporation
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- ABLIC Inc.
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WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
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- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
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- Fairchild Semiconductor Corporation
- Aira Lourdes VILLAMOR
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LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME
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- SH MATERIALS CO., LTD.
- Jun FUKUZAKI
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POWER SEMICONDUCTOR MODULE
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- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
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METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...
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- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
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LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
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- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
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LEAD FRAME AND METHOD OF PRODUCING A CHIP HOUSING
- Publication number 20180005924
- Publication date Jan 4, 2018
- Osram Opto Semiconductors GmbH
- Martin Brandl
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LEAD FRAME AND SEMICONDUCTOR DEVICE
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- Nichia Corporation.
- Takuya NAKABAYASHI
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- NHK SPRING CO., LTD
- Yukie YAMADA
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LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20170133300
- Publication date May 11, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
- Publication number 20170125324
- Publication date May 4, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
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- Publication date Apr 27, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
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LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
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- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Deformation absorbing parts in the lead frame plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with die pads and leads

Semiconductor device comprising first and second lead frames

Semiconductor device

Method for manufacturing a semiconductor device having a semiconduc...

Packaged device having selective lead pullback for dimple depth con...

Power module package casing with protrusion supports

Electronic device with die pad and leads, and method of manufacturing

Method for making semiconductor device with sidewall recess and rel...

Wire bond clamp design and lead frame capable of engaging with same

Packaged semiconductor devices with laser grooved wettable flank an...

Semiconductor memory device

Leadframe

Semiconductor systems having dual leadframes

Packaged semiconductor devices with laser grooved wettable flank an...

Semiconductor device

Power semiconductor module

Strengthened LED package and method therefor

Semiconductor systems having premolded dual leadframes

Lead frame and method for manufacturing the same

Lead frame and method of producing a chip housing

Semiconductor package

Semiconductor package including a device and lead frame used for th...

Lead frame including a plurality of units connected together and se...

Method for making semiconductor device with sidewall recess and rel...

Packaged semiconductor devices with laser grooved wettable flank an...

Wiring circuit board and method of manufacturing the same

Lead frame, method for manufacturing lead frame, semiconductor devi...

Semiconductor package

Semiconductor component and method of manufacture

Non-planar inductive electrical elements in semiconductor package l...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

LEAD FRAME AND PACKAGE METHOD

LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A S...

LEAD FRAME AND PACKAGING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS

LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...

PACKAGED DEVICE HAVING SELECTIVE LEAD PULLBACK FOR DIMPLE DEPTH CON...

RESIN ENCAPSULATING MOLD AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...

LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...

LEAD FRAME AND METHOD OF PRODUCING A CHIP HOUSING

LEAD FRAME AND SEMICONDUCTOR DEVICE

WIRING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LEADFRAME AND SEMICONDUCTOR DEVICE

Semiconductor Systems Having Premolded Dual Leadframes

LEADFRAME

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...