Deformation absorbing parts in the lead frame plane

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H01L23/49544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49544Deformation absorbing parts in the lead frame plane

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising first and second lead frames
- Patent number 11,929,306
- Issue date Mar 12, 2024
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,444
- Issue date Jan 23, 2024
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device having selective lead pullback for dimple depth con...
- Patent number 11,600,557
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package casing with protrusion supports
- Patent number 11,482,468
- Issue date Oct 25, 2022
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with die pad and leads, and method of manufacturing
- Patent number 11,404,356
- Issue date Aug 2, 2022
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device with sidewall recess and rel...
- Patent number 10,943,885
- Issue date Mar 9, 2021
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with laser grooved wettable flank an...
- Patent number 10,818,582
- Issue date Oct 27, 2020
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Aira Lourdes Villamor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,777,479
- Issue date Sep 15, 2020
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe
- Patent number 10,573,581
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor systems having dual leadframes
- Patent number 10,573,582
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with laser grooved wettable flank an...
- Patent number 10,483,192
- Issue date Nov 19, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Aira Lourdes Villamor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,431,528
- Issue date Oct 1, 2019
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,381,283
- Issue date Aug 13, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strengthened LED package and method therefor
- Patent number 10,367,125
- Issue date Jul 30, 2019
- Lumileds, LLC
- Chee Weng Soong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor systems having premolded dual leadframes
- Patent number 10,312,184
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for manufacturing the same
- Patent number 10,304,760
- Issue date May 28, 2019
- OHKUCHI MATERIALS CO., LTD.
- Jun Fukuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of producing a chip housing
- Patent number 10,297,537
- Issue date May 21, 2019
- Osram Opto Semiconductors GmbH
- Martin Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,211,134
- Issue date Feb 19, 2019
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a device and lead frame used for th...
- Patent number 10,199,300
- Issue date Feb 5, 2019
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame including a plurality of units connected together and se...
- Patent number 10,096,758
- Issue date Oct 9, 2018
- Nichia Corporation
- Takuya Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device with sidewall recess and rel...
- Patent number 10,008,472
- Issue date Jun 26, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with laser grooved wettable flank an...
- Patent number 9,978,668
- Issue date May 22, 2018
- Fairchild Semiconductor Corporation
- Aira Lourdes Villamor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and method of manufacturing the same
- Patent number 9,905,496
- Issue date Feb 27, 2018
- NHK Spring Co., Ltd.
- Yukie Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,870,983
- Issue date Jan 16, 2018
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,852,966
- Issue date Dec 26, 2017
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,818,674
- Issue date Nov 14, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar inductive electrical elements in semiconductor package l...
- Patent number 9,704,639
- Issue date Jul 11, 2017
- SOLANTRO SEMICONDUCTOR CORP.
- Raymond Kenneth Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame used for the same
- Patent number 9,589,870
- Issue date Mar 7, 2017
- Kabushiki Kaisha Toshiba
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME AND PACKAGING METHOD
- Publication number 20230098393
- Publication date Mar 30, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301986
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301987
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...
- Publication number 20220238420
- Publication date Jul 28, 2022
- ROHM CO., LTD.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220148946
- Publication date May 12, 2022
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
- Publication number 20210343620
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
- Publication number 20210183737
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...
- Publication number 20200312750
- Publication date Oct 1, 2020
- ROHM CO., LTD.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...
- Publication number 20200083148
- Publication date Mar 12, 2020
- Fairchild Semiconductor Corporation
- Aira Lourdes VILLAMOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING SELECTIVE LEAD PULLBACK FOR DIMPLE DEPTH CON...
- Publication number 20200066618
- Publication date Feb 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN ENCAPSULATING MOLD AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
- Publication number 20200020617
- Publication date Jan 16, 2020
- ABLIC Inc.
- Yuta KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...
- Publication number 20180269138
- Publication date Sep 20, 2018
- Fairchild Semiconductor Corporation
- Aira Lourdes VILLAMOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180226327
- Publication date Aug 9, 2018
- SH MATERIALS CO., LTD.
- Jun FUKUZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180218957
- Publication date Aug 2, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180151480
- Publication date May 31, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Mitsumasa Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...
- Publication number 20180130767
- Publication date May 10, 2018
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
- Publication number 20180047588
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF PRODUCING A CHIP HOUSING
- Publication number 20180005924
- Publication date Jan 4, 2018
- Osram Opto Semiconductors GmbH
- Martin Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20170229627
- Publication date Aug 10, 2017
- Nichia Corporation.
- Takuya NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170179005
- Publication date Jun 22, 2017
- NHK SPRING CO., LTD
- Yukie YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20170133300
- Publication date May 11, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
- Publication number 20170125324
- Publication date May 4, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20170117210
- Publication date Apr 27, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20170077011
- Publication date Mar 16, 2017
- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170062314
- Publication date Mar 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Akihiko IWAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20160218051
- Publication date Jul 28, 2016
- SH MATERIALS CO., LTD.
- Katsuyuki Doumae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD
- Publication number 20150371933
- Publication date Dec 24, 2015
- Amkor Technology, Inc.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20150243587
- Publication date Aug 27, 2015
- Anova Technologies Co., Ltd.
- Wei-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS

Deformation absorbing parts in the lead frame plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device comprising first and second lead frames

Semiconductor device

Method for manufacturing a semiconductor device having a semiconduc...

Packaged device having selective lead pullback for dimple depth con...

Power module package casing with protrusion supports

Electronic device with die pad and leads, and method of manufacturing

Method for making semiconductor device with sidewall recess and rel...

Wire bond clamp design and lead frame capable of engaging with same

Packaged semiconductor devices with laser grooved wettable flank an...

Semiconductor memory device

Leadframe

Semiconductor systems having dual leadframes

Packaged semiconductor devices with laser grooved wettable flank an...

Semiconductor device

Power semiconductor module

Strengthened LED package and method therefor

Semiconductor systems having premolded dual leadframes

Lead frame and method for manufacturing the same

Lead frame and method of producing a chip housing

Semiconductor package

Semiconductor package including a device and lead frame used for th...

Lead frame including a plurality of units connected together and se...

Method for making semiconductor device with sidewall recess and rel...

Packaged semiconductor devices with laser grooved wettable flank an...

Wiring circuit board and method of manufacturing the same

Lead frame, method for manufacturing lead frame, semiconductor devi...

Semiconductor package

Semiconductor component and method of manufacture

Non-planar inductive electrical elements in semiconductor package l...

Semiconductor device and lead frame used for the same

Patents Applicationslast 30 patents

LEAD FRAME AND PACKAGING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS

LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...

PACKAGED DEVICE HAVING SELECTIVE LEAD PULLBACK FOR DIMPLE DEPTH CON...

RESIN ENCAPSULATING MOLD AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

PACKAGED SEMICONDUCTOR DEVICES WITH LASER GROOVED WETTABLE FLANK AN...

LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...

LEAD FRAME AND METHOD OF PRODUCING A CHIP HOUSING

LEAD FRAME AND SEMICONDUCTOR DEVICE

WIRING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LEADFRAME AND SEMICONDUCTOR DEVICE

Semiconductor Systems Having Premolded Dual Leadframes

LEADFRAME

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE

LEAD FRAME

MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD

HIGH RELIABILITY SEMICONDUCTOR PACKAGE STRUCTURE