Deposition of conductive or insulating materials for electrodes conducting electric current

Industry

CPC
H01L21/283

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current

Industries

Patents Grantslast 30 patents

Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside and sidewall metallization of semiconductor devices
- Patent number 11,935,753
- Issue date Mar 19, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming diodes
- Patent number 11,916,129
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 11,887,858
- Issue date Jan 30, 2024
- Kabushiki Kaisha Toshiba
- Shinji Nunotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 11,887,891
- Issue date Jan 30, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,855,085
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact feature and method of fabricati...
- Patent number 11,855,155
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switch circuit, IC structure of power switch circuit, and met...
- Patent number 11,855,619
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzung-Yo Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contacts to group IV semiconductors by inserting interfacial...
- Patent number 11,804,533
- Issue date Oct 31, 2023
- ACORN SEMI, LLC
- Walter A. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact with air spacer
- Patent number 11,798,996
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including gate spacer with gap or void and methods of formi...
- Patent number 11,784,241
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased-transparency photovoltaic device
- Patent number 11,758,742
- Issue date Sep 12, 2023
- OXFORD PHOTOVOLTAICS LIMITED
- Terence Alan Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,735,662
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Sheng Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride device having an ohmic contact
- Patent number 11,728,389
- Issue date Aug 15, 2023
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal gate fill structure
- Patent number 11,728,171
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal gate electrode of a semiconductor device
- Patent number 11,670,711
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jr-Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill void and connection structures
- Patent number 11,651,992
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Haigou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,621,273
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 11,616,129
- Issue date Mar 28, 2023
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contacts to group IV semiconductors by inserting interfacial...
- Patent number 11,610,974
- Issue date Mar 21, 2023
- ACORN SEMI, LLC
- Walter A. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 11,600,524
- Issue date Mar 7, 2023
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist composition, its manufacturing method, and manufacturin...
- Patent number 11,592,742
- Issue date Feb 28, 2023
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with stop lay...
- Patent number 11,594,634
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including gate spacer with gap or void and methods of formi...
- Patent number 11,594,619
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-cavity surface-emitting laser fabrication on large wafer
- Patent number 11,588,299
- Issue date Feb 21, 2023
- Mellanox Technologies, Ltd.
- Vladimir Iakovlev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device with a field electrode that includes two layers
- Patent number 11,581,409
- Issue date Feb 14, 2023
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistance contact plugs and method forming same
- Patent number 11,532,504
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,488,784
- Issue date Nov 1, 2022
- Murata Manufacturing Co., Ltd.
- Yasuhiro Murase
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A FERROELECTRIC DEVICE
- Publication number 20240128308
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Dina Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240113157
- Publication date Apr 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113113
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20240096971
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SWITCH CIRCUIT, IC STRUCTURE OF POWER SWITCH CIRCUIT, AND MET...
- Publication number 20240056074
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TZUNG-YO HUNG
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL...
- Publication number 20240030306
- Publication date Jan 25, 2024
- Acorn Semi, LLC
- Walter A. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20240030067
- Publication date Jan 25, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL GATE FILL STRUCTURE
- Publication number 20230369057
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE CONTACT WITH AIR SPACER
- Publication number 20230369419
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230343872
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Sheng LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABLE WORK FUNCTION FOR NARROW-PITCH DEVICES
- Publication number 20230299170
- Publication date Sep 21, 2023
- TESSERA, LLC
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL...
- Publication number 20230207657
- Publication date Jun 29, 2023
- Acorn Semi, LLC
- Walter A. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES
- Publication number 20230187211
- Publication date Jun 15, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20230154793
- Publication date May 18, 2023
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Contact Plugs and Method Forming Same
- Publication number 20230123827
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230104297
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS
- Publication number 20230028568
- Publication date Jan 26, 2023
- Intel Corporation
- Sameer S. Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ARRAY STRUCTURE OF COLUMNAR CAPACITOR AND SE...
- Publication number 20230015120
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Qiang WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH A PAD STRUCTURE INCLUDING A BARRI...
- Publication number 20220415705
- Publication date Dec 29, 2022
- STMicroelectronics S.r.l.
- Daria DORIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...
- Publication number 20220375856
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT WITH AIR SPACER
- Publication number 20220359672
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20220359510
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING NANOGAP METHOD AND DEVICE
- Publication number 20220336597
- Publication date Oct 20, 2022
- King Abdullah University of Science and Technology
- Thomas D. ANTHOPOULOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Including Gate Spacer with Gap or Void and Methods of Formi...
- Publication number 20220310826
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20220246734
- Publication date Aug 4, 2022
- Kabushiki Kaisha Toshiba
- Shinji NUNOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE, AND RELATED MICROELECT...
- Publication number 20220246736
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Sandeep Ramasamudra Suresha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Contact With Air Spacer
- Publication number 20220238659
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20220238661
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE DEVICE HAVING AN OHMIC CONTACT
- Publication number 20220208972
- Publication date Jun 30, 2022
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Deposition of conductive or insulating materials for electrodes conducting electric current

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Subtractive etch resolution implementing a functional thin metal re...

Backside and sidewall metallization of semiconductor devices

Methods of forming diodes

Semiconductor device and method of manufacturing same

Self-aligned contacts

Semiconductor structure cutting process and structures formed thereby

Semiconductor device having contact feature and method of fabricati...

Power switch circuit, IC structure of power switch circuit, and met...

Semiconductor device with a passivation layer and method for produc...

Integrated assemblies and methods of forming integrated assemblies

Metal contacts to group IV semiconductors by inserting interfacial...

Backside contact with air spacer

Devices including gate spacer with gap or void and methods of formi...

Increased-transparency photovoltaic device

Semiconductor device and manufacturing method thereof

Group III nitride device having an ohmic contact

Semiconductor device with metal gate fill structure

Metal gate electrode of a semiconductor device

Gap fill void and connection structures

Integrated assemblies and methods of forming integrated assemblies

Contact photolithography-based nanopatterning using photoresist fea...

Metal contacts to group IV semiconductors by inserting interfacial...

Self-aligned contacts

Photoresist composition, its manufacturing method, and manufacturin...

Fin field effect transistor (FinFET) device structure with stop lay...

Devices including gate spacer with gap or void and methods of formi...

Vertical-cavity surface-emitting laser fabrication on large wafer

Transistor device with a field electrode that includes two layers

Low-resistance contact plugs and method forming same

Capacitor

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A FERROELECTRIC DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

Integrated Assemblies and Methods of Forming Integrated Assemblies

POWER SWITCH CIRCUIT, IC STRUCTURE OF POWER SWITCH CIRCUIT, AND MET...

METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL...

SELF-ALIGNED CONTACTS

SEMICONDUCTOR DEVICE WITH METAL GATE FILL STRUCTURE

BACKSIDE CONTACT WITH AIR SPACER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STABLE WORK FUNCTION FOR NARROW-PITCH DEVICES

METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL...

BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES

SELF-ALIGNED CONTACTS

Low-Resistance Contact Plugs and Method Forming Same

Integrated Assemblies and Methods of Forming Integrated Assemblies

SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS

METHOD FOR FABRICATING ARRAY STRUCTURE OF COLUMNAR CAPACITOR AND SE...

INTEGRATED ELECTRONIC DEVICE WITH A PAD STRUCTURE INCLUDING A BARRI...

INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...

BACKSIDE CONTACT WITH AIR SPACER

Semiconductor Structure Cutting Process and Structures Formed Thereby

SELF-FORMING NANOGAP METHOD AND DEVICE

Devices Including Gate Spacer with Gap or Void and Methods of Formi...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHODS OF FORMING A MICROELECTRONIC DEVICE, AND RELATED MICROELECT...

Backside Contact With Air Spacer

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

GROUP III NITRIDE DEVICE HAVING AN OHMIC CONTACT