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Deposition of metallic or metal-silicide layers
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/32051
Deposition of metallic or metal-silicide layers
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Method of manufacturing semiconductor device, substrate processing...
Patent number
11,967,500
Issue date
Apr 23, 2024
Kokusai Electric Corporation
Arito Ogawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
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Directional deposition for semiconductor fabrication
Patent number
11,955,338
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih-Chun Huang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Regulator circuit package techniques
Patent number
11,955,437
Issue date
Apr 9, 2024
Analog Devices International Unlimited Company
Leonard Shtargot
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for fabricating the same
Patent number
11,935,926
Issue date
Mar 19, 2024
SK Hynix Inc.
Hyeng-Woo Eom
H01 - BASIC ELECTRIC ELEMENTS
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Apparatus and method of manufacturing a semiconductor device
Patent number
11,935,728
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Cheng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Methods of manufacturing an integrated circuit having stress tuning...
Patent number
11,935,842
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
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Backside metal patterning die singulation system and related methods
Patent number
11,929,285
Issue date
Mar 12, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and manufacturing method thereof
Patent number
11,915,936
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Wei Su
H01 - BASIC ELECTRIC ELEMENTS
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Substrate processing apparatus, method of manufacturing semiconduct...
Patent number
11,898,247
Issue date
Feb 13, 2024
Kokusai Electric Corporation
Hidenari Yoshida
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Methods and systems for depositing a layer comprising vanadium, nit...
Patent number
11,887,857
Issue date
Jan 30, 2024
ASM IP Holding B.V.
Dieter Pierreux
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Enhanced spatial ALD of metals through controlled precursor mixing
Patent number
11,887,856
Issue date
Jan 30, 2024
Applied Materials, Inc.
Kelvin Chan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Methods for depositing fluorine/carbon-free conformal tungsten
Patent number
11,887,855
Issue date
Jan 30, 2024
Applied Materials, Inc.
Xinyu Fu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method and system for manufacturing semiconductor layer
Patent number
11,876,001
Issue date
Jan 16, 2024
NEXCHIP SEMICONDUCTOR CORPORATION
Baoyou Gong
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Semiconductor device and method
Patent number
11,862,468
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Kuei-Lun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Polysilicon structure including protective layer
Patent number
11,855,086
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Shao Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, method and machine of manufacture
Patent number
11,851,749
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Chun Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Thermally conductive wafer layer
Patent number
11,854,933
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
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Transistors with different threshold voltages
Patent number
11,848,368
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Lung-Kun Chu
H01 - BASIC ELECTRIC ELEMENTS
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Packaged semiconductor devices with wireless charging means
Patent number
11,837,517
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Method of cleaning a structure and method of depositing a capping l...
Patent number
11,830,725
Issue date
Nov 28, 2023
Applied Materials, Inc.
Naomi Yoshida
B08 - CLEANING
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Method of manufacturing ruthenium-containing thin film and rutheniu...
Patent number
11,827,650
Issue date
Nov 28, 2023
DNF Co., Ltd.
Myong Woon Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Systems and methods for homogenous intermixing of precursors in all...
Patent number
11,827,976
Issue date
Nov 28, 2023
Lam Research Corporation
Ilanit Fisher
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Methods for seamless gap filling of dielectric material
Patent number
11,830,728
Issue date
Nov 28, 2023
Applied Materials, Inc.
Chengyu Liu
H01 - BASIC ELECTRIC ELEMENTS
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Selective capping processes and structures formed thereby
Patent number
11,830,742
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chien Chi
H01 - BASIC ELECTRIC ELEMENTS
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CVD based oxide-metal multi structure for 3D NAND memory devices
Patent number
11,817,320
Issue date
Nov 14, 2023
Applied Materials, Inc.
Susmit Singha Roy
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Group VI precursor compounds
Patent number
11,807,653
Issue date
Nov 7, 2023
Entegris, Inc.
David M. Ermert
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuits having protruding interconnect conductors
Patent number
11,728,397
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hung Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Devices for fabrication of shielded modules
Patent number
11,682,585
Issue date
Jun 20, 2023
Skyworks Solutions, Inc.
Yi Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Structures for aligning a semiconductor wafer for singulation
Patent number
11,676,863
Issue date
Jun 13, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
Publication number
20240145300
Publication date
May 2, 2024
Sahil PATEL
H01 - BASIC ELECTRIC ELEMENTS
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AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...
Publication number
20240136175
Publication date
Apr 25, 2024
SOULBRAIN CO., LTD.
Jae Sun JUNG
H01 - BASIC ELECTRIC ELEMENTS
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VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
Publication number
20240136407
Publication date
Apr 25, 2024
ROBERT BOSCH GmbH
Kevin Dannecker
H01 - BASIC ELECTRIC ELEMENTS
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SKIP VIA WITH LATERAL LINE CONNECTION
Publication number
20240120271
Publication date
Apr 11, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240105463
Publication date
Mar 28, 2024
Kokusai Electric Corporation
Koei KURIBAYASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
Semiconductor Device, Method and Machine of Manufacture
Publication number
20240093357
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jen-Chun Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
Publication number
20240096884
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Shao CHENG
H01 - BASIC ELECTRIC ELEMENTS
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SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...
Publication number
20240084443
Publication date
Mar 14, 2024
LAM RESEARCH CORPORATION
Ilanit FISHER
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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FORMING A PARTIALLY SILICIDED ELEMENT
Publication number
20240087886
Publication date
Mar 14, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Yaojian Leng
H01 - BASIC ELECTRIC ELEMENTS
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GROUP VI PRECURSOR COMPOUNDS
Publication number
20240034745
Publication date
Feb 1, 2024
Entegris, Inc.
David M. ERMERT
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20240038850
Publication date
Feb 1, 2024
Kabushiki Kaisha Toshiba
Masatsugu NAGAI
H01 - BASIC ELECTRIC ELEMENTS
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METALLIZATION OF SEMICONDUCTOR WAFER
Publication number
20240030039
Publication date
Jan 25, 2024
Heraeus Deutschland GmbH & Co. KG
Erwei LIU
H01 - BASIC ELECTRIC ELEMENTS
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PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
Publication number
20240014013
Publication date
Jan 11, 2024
TOKYO ELECTRON LIMITED
Nobuo MATSUKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SHIELDED MODULE FABRICATION METHODS AND DEVICES
Publication number
20230420301
Publication date
Dec 28, 2023
Skyworks Solutions, Inc.
Yi LIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF DEPOSITING ATOMIC LAYER AND METHOD OF MANUFACTURING SEMIC...
Publication number
20230420248
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
Hyunjun AHN
H01 - BASIC ELECTRIC ELEMENTS
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METAL OXIDE PRECLEANING PRIOR TO METAL FILLING
Publication number
20230411142
Publication date
Dec 21, 2023
TOKYO ELECTRON LIMITED
Ryota Yonezawa
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD
Publication number
20230377891
Publication date
Nov 23, 2023
Taiwan Semiconducor Manufacturing Co., Ltd.
Kuei-Lun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Integrated Circuits Having Protruding Interconnect Conductors
Publication number
20230369427
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Chen-Hung Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Silicidation Process for Semiconductor Devices
Publication number
20230326764
Publication date
Oct 12, 2023
TOKYO ELECTRON LIMITED
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS AND METHODS FOR DEPOSITION OF MOLYBDENUM FOR SOURCE/DRAIN C...
Publication number
20230298902
Publication date
Sep 21, 2023
ASM IP HOLDING B.V.
Jiyeon Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHANT COMPOSITION FOR TITANIUM-CONTAINING METAL LAYER AND ETCHING...
Publication number
20230287574
Publication date
Sep 14, 2023
ENF TECHNOLOGY CO., LTD.
Sang Seung PARK
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
ETCHING COMPOSITION FOR ETCHING MOLYBDENUM FILM AND METHOD OF MANUF...
Publication number
20230272278
Publication date
Aug 31, 2023
SOULBRAIN CO., LTD
Changjun PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VAPOR DEPOSITION PROCESSES AND A DEPOSITION ASSEMBLY
Publication number
20230245899
Publication date
Aug 3, 2023
ASM IP HOLDING, B.V.
Georgi Popov
H01 - BASIC ELECTRIC ELEMENTS
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ENHANCEMENT-MODE HEMT AND MANUFACTURING PROCESS OF THE SAME
Publication number
20230246100
Publication date
Aug 3, 2023
STMicroelectronics S.r.l.
Ferdinando IUCOLANO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20230238244
Publication date
Jul 27, 2023
Kokusai Electric Corporation
Koei KURIBAYASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
Publication number
20230238250
Publication date
Jul 27, 2023
TOKYO ELECTRON LIMITED
Mizuki MATSUO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE
Publication number
20230230936
Publication date
Jul 20, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
PING-HENG WU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
Publication number
20230230845
Publication date
Jul 20, 2023
Kokusai Electric Corporation
Koei KURIBAYASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
METHOD AND DEVICE FOR FORMING TUNGSTEN FILM, AND DEVICE FOR FORMING...
Publication number
20230212738
Publication date
Jul 6, 2023
Tokyo Electron Limited
Kensaku NARUSHIMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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TRENCH-TYPE POWER DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230215943
Publication date
Jul 6, 2023
Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
Xiao Yang
H01 - BASIC ELECTRIC ELEMENTS