Deposition of non-insulating-

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H01L21/3205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3205Deposition of non-insulating-

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Group VI precursor compounds
- Patent number 12,258,356
- Issue date Mar 25, 2025
- Entegris, Inc.
- David M. Ermert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,250,833
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium aluminum and tantalum aluminum thin films
- Patent number 12,237,392
- Issue date Feb 25, 2025
- ASM IP Holding B.V.
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium film forming method and substrate processing system
- Patent number 12,227,841
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a MEMS switch having an embedded metal con...
- Patent number 12,230,457
- Issue date Feb 18, 2025
- Robert Bosch GmbH
- Jochen Reinmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal grid, thin film sensor and manufactur...
- Patent number 12,224,234
- Issue date Feb 11, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive contacts of differen...
- Patent number 12,218,055
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, display panel and manufacturing method of displa...
- Patent number 12,205,961
- Issue date Jan 21, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Chunge Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing gap filling including filling trenches between...
- Patent number 12,183,590
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,176,216
- Issue date Dec 24, 2024
- Kokusai Electric Corporation
- Motomu Degai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tuning threshold voltage through meta stable plasma treatment
- Patent number 12,148,620
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacks of electrically resistive materials and related systems and...
- Patent number 12,148,789
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Ahmed N. Noemaun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam removal in high aspect ratio gap-fill
- Patent number 12,142,480
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 12,112,954
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for increasing the surface roughness of a metal layer
- Patent number 12,094,722
- Issue date Sep 17, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Pollet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous silicon forming composition comprising block copolymer an...
- Patent number 12,091,323
- Issue date Sep 17, 2024
- Marck Patent GmbH
- Naoko Nakamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-layer solid-state devices and methods for forming the same
- Patent number 12,094,721
- Issue date Sep 17, 2024
- University of Maryland, College Park
- Gary W. Rubloff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing amorphous silicon sacrifice film and amorphous...
- Patent number 12,060,276
- Issue date Aug 13, 2024
- Merck Patent GmbH
- Naoko Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,058,858
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film curing using H2 plasma
- Patent number 12,054,827
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Shishi Jiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of fabricating the same
- Patent number 12,057,469
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chiun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250101593
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Yukinao KAGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250105020
- Publication date Mar 27, 2025
- Hitachi High-Tech Corporation
- Masaya IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR-SHAPED RESISTOR
- Publication number 20250089347
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250087600
- Publication date Mar 13, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS
- Publication number 20250079239
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Jiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20250079351
- Publication date Mar 6, 2025
- DB HiTek Co., Ltd.
- Hyun Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250079184
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Jason MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...
- Publication number 20250070043
- Publication date Feb 27, 2025
- Heraeus Electronics GmbH & Co. KG
- Ming Hung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20250070049
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-C...
- Publication number 20250069948
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- David Joseph MANDIA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MANUFACTURING RESISTOR DEVICES
- Publication number 20250072014
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Ahmed N. Noemaun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250069891
- Publication date Feb 27, 2025
- Kokusai Electric Corporation
- Motomu DEGAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHDOS AND SYSTEMS FOR FILLING A GAP
- Publication number 20250051925
- Publication date Feb 13, 2025
- ASM IP HOLDING B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
- Publication number 20250054758
- Publication date Feb 13, 2025
- Samsung SDI Co., Ltd.
- Dong Wan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Release Layer for IR Laser Lift-Off Process
- Publication number 20250054904
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MOLYBDENUM SILICIDE LAYER ON A SURFACE OF A SU...
- Publication number 20250038006
- Publication date Jan 30, 2025
- Didem Ernur
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250040213
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Yi-Hsiang Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL
- Publication number 20250037996
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION
- Publication number 20250003054
- Publication date Jan 2, 2025
- Blue Origin, LLC
- Alexander lmbault
- C01 - INORGANIC CHEMISTRY
Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS
- Publication number 20240412981
- Publication date Dec 12, 2024
- Entegris, Inc.
- Phil S.H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...
- Publication number 20240412980
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SOLID-STATE DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240404838
- Publication date Dec 5, 2024
- University of Maryland, College Park
- Gary W. Rubloff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Homoleptic Bismuth Precursors For Depositing Bismuth Oxide Containi...
- Publication number 20240392433
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Sergei V. Ivanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE
- Publication number 20240384400
- Publication date Nov 21, 2024
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Rocio Alejandra ARTEAGA MULLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Deposition of non-insulating-

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Group VI precursor compounds

Method for manufacturing semiconductor device structure

Semiconductor device with electromagnetic interference film and met...

Titanium aluminum and tantalum aluminum thin films

Ruthenium film forming method and substrate processing system

Method for manufacturing a MEMS switch having an embedded metal con...

Manufacturing method of metal grid, thin film sensor and manufactur...

Deep trench intersections

Semiconductor device structure with conductive contacts of differen...

Display substrate, display panel and manufacturing method of displa...

Antenna with graded dielectirc and method of making the same

Method of performing gap filling including filling trenches between...

Method of manufacturing semiconductor device, substrate processing...

Method of processing substrate, method of manufacturing semiconduct...

Tuning threshold voltage through meta stable plasma treatment

Stacks of electrically resistive materials and related systems and...

Method of forming semiconductor device

Seam removal in high aspect ratio gap-fill

Single chamber flowable film formation and treatments

Method for manufacturing ferromagnetic-dielectric composite material

Selective liquid sliding surface and method of fabricating the same

Etching method, substrate processing apparatus, and substrate proce...

Selective silicon deposition

Method for increasing the surface roughness of a metal layer

Amorphous silicon forming composition comprising block copolymer an...

Multi-layer solid-state devices and methods for forming the same

Method for producing amorphous silicon sacrifice film and amorphous...

Three-dimensional memory devices and methods for forming the same

Flowable film curing using H2 plasma

Semiconductor device and a method of fabricating the same

Patents Applicationslast 30 patents

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

PLASMA PROCESSING METHOD

CIRCULAR-SHAPED RESISTOR

SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF

SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS

RF SWITCH DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...

SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME

DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-C...

METHODS OF MANUFACTURING RESISTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHDOS AND SYSTEMS FOR FILLING A GAP

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...

Release Layer for IR Laser Lift-Off Process

METHOD FOR FORMING A MOLYBDENUM SILICIDE LAYER ON A SURFACE OF A SU...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION

COPPER REFLOW BY SURFACE MODIFICATION

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...

MULTI-LAYER SOLID-STATE DEVICES AND METHODS FOR FORMING THE SAME

Homoleptic Bismuth Precursors For Depositing Bismuth Oxide Containi...

Method for Metal Gapfill

METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE