Deposition of non-insulating-

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H01L21/3205

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3205Deposition of non-insulating-

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional deposition for semiconductor fabrication
- Patent number 11,955,338
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chun Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,935,926
- Issue date Mar 19, 2024
- SK Hynix Inc.
- Hyeng-Woo Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing a semiconductor device
- Patent number 11,935,728
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,915,976
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor chip, and kit
- Patent number 11,914,300
- Issue date Feb 27, 2024
- FUJIFILM Corporation
- Tetsuya Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a vertical thin-film transistor that serves as...
- Patent number 11,910,612
- Issue date Feb 20, 2024
- SUNRISE MEMORY CORPORATION
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 11,898,247
- Issue date Feb 13, 2024
- Kokusai Electric Corporation
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for depositing a layer comprising vanadium, nit...
- Patent number 11,887,857
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Dieter Pierreux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced spatial ALD of metals through controlled precursor mixing
- Patent number 11,887,856
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Kelvin Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 11,887,855
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for manufacturing semiconductor layer
- Patent number 11,876,001
- Issue date Jan 16, 2024
- NEXCHIP SEMICONDUCTOR CORPORATION
- Baoyou Gong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,468
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon structure including protective layer
- Patent number 11,855,086
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Shao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermally conductive wafer layer
- Patent number 11,854,933
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for Si gap fill by PECVD
- Patent number 11,848,232
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Xin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transistors with different threshold voltages
- Patent number 11,848,368
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung-Kun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with wireless charging means
- Patent number 11,837,517
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning a structure and method of depositing a capping l...
- Patent number 11,830,725
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Naomi Yoshida
- B08 - CLEANING
Information Patent Grant
Method of manufacturing ruthenium-containing thin film and rutheniu...
- Patent number 11,827,650
- Issue date Nov 28, 2023
- DNF Co., Ltd.
- Myong Woon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for homogenous intermixing of precursors in all...
- Patent number 11,827,976
- Issue date Nov 28, 2023
- Lam Research Corporation
- Ilanit Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for seamless gap filling of dielectric material
- Patent number 11,830,728
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Chengyu Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BLOCKING DIELECTRIC SURFACES USING BLOCKING MOLECULES TO...
- Publication number 20240145242
- Publication date May 2, 2024
- Applied Materials, Inc.
- Geetika BAJAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
- Publication number 20240145300
- Publication date May 2, 2024
- Sahil PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...
- Publication number 20240136175
- Publication date Apr 25, 2024
- SOULBRAIN CO., LTD.
- Jae Sun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
- Publication number 20240136407
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20240136226
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA WITH LATERAL LINE CONNECTION
- Publication number 20240120271
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS
- Publication number 20240105635
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105463
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Koei KURIBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105465
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Takahiro MIYAKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REDUCING CONTACT RESISTANCE
- Publication number 20240105464
- Publication date Mar 28, 2024
- Shanghai Huali Integrated Circuit Corporation
- Wensheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
- Publication number 20240096884
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A PARTIALLY SILICIDED ELEMENT
- Publication number 20240087886
- Publication date Mar 14, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...
- Publication number 20240084443
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Ilanit FISHER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...
- Publication number 20240079456
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES
- Publication number 20240071959
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...
- Publication number 20240055465
- Publication date Feb 15, 2024
- Sony Semiconductor Solutions Corporation
- Kenichi MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES
- Publication number 20240044003
- Publication date Feb 8, 2024
- ASM IP HOLDING B.V.
- Dieter Pierreux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20240047359
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20240047358
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP VI PRECURSOR COMPOUNDS
- Publication number 20240034745
- Publication date Feb 1, 2024
- Entegris, Inc.
- David M. ERMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240038850
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Masatsugu NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION OF SEMICONDUCTOR WAFER
- Publication number 20240030039
- Publication date Jan 25, 2024
- Heraeus Deutschland GmbH & Co. KG
- Erwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR
- Publication number 20240021376
- Publication date Jan 18, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takashi IMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A NOVEL TRANSISTOR DEVICE
- Publication number 20240021712
- Publication date Jan 18, 2024
- Search For The Next, LTD.
- David SUMMERLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...
- Publication number 20240014038
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...
- Publication number 20240014040
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHIN...
- Publication number 20240014044
- Publication date Jan 11, 2024
- SK hynix, Inc.
- Eun Seok OH
- H01 - BASIC ELECTRIC ELEMENTS

Deposition of non-insulating-

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D NAND gate stack reinforcement

Method of manufacturing semiconductor device, substrate processing...

Devices and methods related to dual-sided radio-frequency package w...

Directional deposition for semiconductor fabrication

Regulator circuit package techniques

Semiconductor device and method for fabricating the same

Apparatus and method of manufacturing a semiconductor device

Methods of manufacturing an integrated circuit having stress tuning...

Backside metal patterning die singulation system and related methods

Semiconductor structure and manufacturing method thereof

Semiconductor device pre-cleaning

Manufacturing method of semiconductor chip, and kit

Process for forming a vertical thin-film transistor that serves as...

Substrate processing apparatus, method of manufacturing semiconduct...

Methods and systems for depositing a layer comprising vanadium, nit...

Enhanced spatial ALD of metals through controlled precursor mixing

Methods for depositing fluorine/carbon-free conformal tungsten

Method and system for manufacturing semiconductor layer

Method for fabricating interconnection using graphene

Semiconductor device and method

Polysilicon structure including protective layer

Semiconductor device, method and machine of manufacture

Thermally conductive wafer layer

Method for Si gap fill by PECVD

Transistors with different threshold voltages

Packaged semiconductor devices with wireless charging means

Method of cleaning a structure and method of depositing a capping l...

Method of manufacturing ruthenium-containing thin film and rutheniu...

Systems and methods for homogenous intermixing of precursors in all...

Methods for seamless gap filling of dielectric material

Patents Applicationslast 30 patents

METHOD OF BLOCKING DIELECTRIC SURFACES USING BLOCKING MOLECULES TO...

Buffer Layer for Dielectric Protection in Physical Vapor Deposition...

AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...

SEMICONDUCTOR DEVICE PRE-CLEANING

SKIP VIA WITH LATERAL LINE CONNECTION

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES

SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD FOR REDUCING CONTACT RESISTANCE

Semiconductor Device, Method and Machine of Manufacture

METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER

FORMING A PARTIALLY SILICIDED ELEMENT

SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...

MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES

PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...

WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

GROUP VI PRECURSOR COMPOUNDS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METALLIZATION OF SEMICONDUCTOR WAFER

METHOD FOR MANUFACTURING CAPACITOR

A NOVEL TRANSISTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...

ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHIN...