Deposition of supra-conductive layers

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H01L21/32058

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/32058Deposition of supra-conductive layers

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Deposition of supra-conductive layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Graded planar buffer for nanowires

Method of forming titanium nitride films with (200) crystallographi...

Through-silicon-via fabrication in planar quantum devices

Microfabricated air bridges for planar microwave resonator circuits

Method for forming a qubit device

Semiconductor device including superconducting metal through-silico...

Buffer layer to prevent etching by photoresist developer

Backside coupling with superconducting partial TSV for transmon qubits

Buffer layer to prevent etching by photoresist developer

Buffer layer to prevent etching by photoresist developer

Low-noise microwave amplifier utilizing superconductor-insulator-su...

Backside coupling with superconducting partial TSV for transmon qubits

Semiconductor device including superconducting metal through-silico...

Backside coupling with superconducting partial TSV for transmon qubits

Microfabricated air bridges for planar microwave resonator circuits

Semiconductor device including superconducting metal through-silico...

Phase-separated, epitaxial composite cap layers for electronic devi...

Substrate for electronic devices, manufacturing method therefor, an...

Method of manufacturing a super conduction field effect transistor

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR NITRIDIZATION OF NIOBIUM TRACES

SUPERCONDUCTING THROUGH SUBSTRATE VIAS

GRADED PLANAR BUFFER FOR NANOWIRES

THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

BACKSIDE COUPLING WITH SUPERCONDUCTING PARTIAL TSV FOR TRANSMON QUBITS

METHOD OF FORMING TITANIUM NITRIDE FILMS WITH (200) CRYSTALLOGRAPHI...

MICROFABRICATED AIR BRIDGES FOR PLANAR MICROWAVE RESONATOR CIRCUITS

METHOD FOR FORMING A QUBIT DEVICE

BACKSIDE COUPLING WITH SUPERCONDUCTING PARTIAL TSV FOR TRANSMON QUBITS

BACKSIDE COUPLING WITH SUPERCONDUCTING PARTIAL TSV FOR TRANSMON QUBITS

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

THROUGH-SILICON VIA WITH INJECTION MOLDED FILL

PHASE-SEPARATED, EPITAXIAL COMPOSITE CAP LAYERS FOR ELECTRONIC DEVI...

Substrate for electronic devices, manufacturing method therefor, an...

Substrate for electronic devices, manufacturing method therefor, an...