Design considerations for via connections

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H01L2225/06544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06544Design considerations for via connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density through silicon conductive structures
- Patent number 12,237,244
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure, semiconductor structure and manufacturing met...
- Patent number 12,224,206
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure and method for manufac...
- Patent number 12,199,015
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,185,534
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 12,113,005
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die interface circuit
- Patent number 12,113,051
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tze-Chiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via layout for multi-die integrated circuits
- Patent number 12,107,076
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Wonjun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,735
- Issue date Sep 10, 2024
- SOCIONEXT INC.
- Hirotaka Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
- Patent number 12,087,629
- Issue date Sep 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanofabrication and design techniques for 3D ICs and configurable A...
- Patent number 12,079,557
- Issue date Sep 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices
- Patent number 12,080,691
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sungwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect structures with integrated circuits
- Patent number 12,068,284
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,627
- Issue date Aug 13, 2024
- Renesas Electronics Corporation
- Yoshihiro Ohara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, CHIP STACKED STRUCTURE, AND MEMORY
- Publication number 20250079406
- Publication date Mar 6, 2025
- CXMT Corporation
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250062304
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- SEOKGEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054913
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...
- Publication number 20250054910
- Publication date Feb 13, 2025
- Meta Platforms Technologies, LLC
- Huseyin Ekin Sumbul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS
- Publication number 20250038151
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Kyuha Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
- Publication number 20250029877
- Publication date Jan 23, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...
- Publication number 20250022868
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Publication number 20250006704
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20250006706
- Publication date Jan 2, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...
- Publication number 20240429128
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429129
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
- Publication number 20240429100
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421012
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sangsick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240421089
- Publication date Dec 19, 2024
- SOCIONEXT INC.
- Yoshiki ISHIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND MEMORY DEVICE INCLUDING SPIRAL TSV CONNECTION
- Publication number 20240413123
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- WATARU NOBEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND MEMORY DEVICE INCLUDING SPIRAL TSV CONNECTION
- Publication number 20240413124
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- WATARU NOBEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20240395670
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Design considerations for via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including penetration via structure

Offset pads over TSV

Semiconductor package

High density through silicon conductive structures

Shield structure for backside through substrate vias (TSVs)

Stacked semiconductor device assembly in computer system

Three-dimensional stacking structure and manufacturing method thereof

Conductive structure, semiconductor structure and manufacturing met...

TSV as pad

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor device including via structure and method for manufac...

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor device and method for producing the same

Integrated circuit device

Scan testable through silicon VIAs

Semiconductor device and method having a through substrate via and...

Semiconductor package

Die on die bonding structure

Chip bonding method and semiconductor chip structure

Packages with Si-substrate-free interposer and method forming same

Microelectronic assemblies

Die to die interface circuit

Through-silicon via layout for multi-die integrated circuits

Nanoscale-aligned three-dimensional stacked integrated circuit

Semiconductor device

Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon

Nanofabrication and design techniques for 3D ICs and configurable A...

Semiconductor devices

Vertical interconnect structures with integrated circuits

Semiconductor device

Patents Applicationslast 30 patents

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

MEMORY CHIP, CHIP STACKED STRUCTURE, AND MEMORY

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS

THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON

MICROELECTRONIC ASSEMBLIES

STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE

Backside Integrated Voltage Regulator For Integrated Circuits

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

APPARATUS AND MEMORY DEVICE INCLUDING SPIRAL TSV CONNECTION

APPARATUS AND MEMORY DEVICE INCLUDING SPIRAL TSV CONNECTION

SEMICONDUCTOR PACKAGE

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

METHOD OF MAKING SEMICONDUCTOR DEVICE

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

DIE ON DIE BONDING STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

Semiconductor Package and Method of Manufacturing the Same