Design considerations for via connections

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H01L2225/06544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06544Design considerations for via connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 12,113,005
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die interface circuit
- Patent number 12,113,051
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tze-Chiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via layout for multi-die integrated circuits
- Patent number 12,107,076
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Wonjun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,735
- Issue date Sep 10, 2024
- SOCIONEXT INC.
- Hirotaka Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
- Patent number 12,087,629
- Issue date Sep 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanofabrication and design techniques for 3D ICs and configurable A...
- Patent number 12,079,557
- Issue date Sep 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices
- Patent number 12,080,691
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sungwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect structures with integrated circuits
- Patent number 12,068,284
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,627
- Issue date Aug 13, 2024
- Renesas Electronics Corporation
- Yoshihiro Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a through-via structure
- Patent number 12,062,594
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Bongjin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EM and RF mitigation silicon structures in stacked die microprocess...
- Patent number 12,057,433
- Issue date Aug 6, 2024
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including guard ring structure and three-dimensio...
- Patent number 12,027,475
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device, structure and methods with connectivity st...
- Patent number 12,021,067
- Issue date Jun 25, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mitigating parasitic capacitance and method of...
- Patent number 12,014,953
- Issue date Jun 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy stacked structures surrounding TSVs and method forming the same
- Patent number 12,014,997
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,009,346
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,984,425
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ji-seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect structures in three-dimensional integrated ci...
- Patent number 11,978,723
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-electrodes
- Patent number 11,961,788
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BANDWIDTH THROUGH VERTICAL CONNECTIONS
- Publication number 20240387388
- Publication date Nov 21, 2024
- Xilinx, Inc.
- Brian C. GAIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387466
- Publication date Nov 21, 2024
- SOCIONEXT INC.
- Hirotaka TAKENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE INTERFACE CIRCUIT
- Publication number 20240387471
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
- Publication number 20240387502
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20240379361
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371758
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME
- Publication number 20240363512
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT STRUCTURES WITH INTEGRATED CIRCUITS
- Publication number 20240363594
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363557
- Publication date Oct 31, 2024
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro OHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240339423
- Publication date Oct 10, 2024
- CXMT Corporation
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240332258
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Da Il RIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20240332034
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321854
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...
- Publication number 20240312931
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME
- Publication number 20240304571
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES
- Publication number 20240274509
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Hyoukyung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258203
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS...
- Publication number 20240258275
- Publication date Aug 1, 2024
- Samsung Electronics Co.,Ltd.
- Duhyoung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240258278
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Hyungchul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250072
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS

Design considerations for via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Semiconductor package

Die on die bonding structure

Chip bonding method and semiconductor chip structure

Packages with Si-substrate-free interposer and method forming same

Microelectronic assemblies

Die to die interface circuit

Through-silicon via layout for multi-die integrated circuits

Nanoscale-aligned three-dimensional stacked integrated circuit

Semiconductor device

Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon

Nanofabrication and design techniques for 3D ICs and configurable A...

Semiconductor devices

Vertical interconnect structures with integrated circuits

Semiconductor device

Integrated circuit device including a through-via structure

EM and RF mitigation silicon structures in stacked die microprocess...

3D semiconductor device and structure with metal layers

Semiconductor device including through via structure

Method for interconnecting stacked semiconductor devices

Semiconductor die including guard ring structure and three-dimensio...

Three-dimensional stacking semiconductor assemblies with near zero...

3D semiconductor device, structure and methods with connectivity st...

Semiconductor device mitigating parasitic capacitance and method of...

Dummy stacked structures surrounding TSVs and method forming the same

Semiconductor device and method of fabricating the same

Semiconductor package

Vertical interconnect structures in three-dimensional integrated ci...

3D semiconductor device and structure with metal layers

Semiconductor device including through-electrodes

Patents Applicationslast 30 patents

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

DIE ON DIE BONDING STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

Semiconductor Package and Method of Manufacturing the Same

MEMORY BANDWIDTH THROUGH VERTICAL CONNECTIONS

SEMICONDUCTOR DEVICE

DIE TO DIE INTERFACE CIRCUIT

METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

VERTICAL INTERCONNECT STRUCTURES WITH INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...

DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE