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SEMICONDUCTOR PACKAGE
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Publication number 20240136329
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Hyuekjae Lee
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H01 - BASIC ELECTRIC ELEMENTS
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TSV AS PAD
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Publication number 20240088101
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Publication date Mar 14, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Guilian Gao
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240088082
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Sang Ho Cha
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240071923
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Publication date Feb 29, 2024
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Samsung Electronics Co., Ltd.
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Minjun SONG
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H01 - BASIC ELECTRIC ELEMENTS
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NON-VOLATILE MEMORY DEVICE
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Publication number 20240055469
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Publication date Feb 15, 2024
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Samsung Electronics Co., Ltd.
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Chang-Bum KIM
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H01 - BASIC ELECTRIC ELEMENTS
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AI MODULE
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Publication number 20240038726
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Publication date Feb 1, 2024
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Panasonic Intellectual Property Management Co., Ltd.
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Koji OBATA
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H01 - BASIC ELECTRIC ELEMENTS
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MEMORY DEVICE
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Publication number 20240038731
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Publication date Feb 1, 2024
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KIOXIA Corporation
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Masayoshi TAGAMI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20240030104
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Publication date Jan 25, 2024
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Samsung Electronics Co., Ltd.
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Chulyong Jang
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H01 - BASIC ELECTRIC ELEMENTS