Detaching bump connectors

Industry

CPC
H01L2224/81052

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81052Detaching bump connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device and multiple chips used therein
- Patent number 11,495,565
- Issue date Nov 8, 2022
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable sacrificial connections for semiconductor devices
- Patent number 10,217,677
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable sacrificial connections for semiconductor devices
- Patent number 10,037,925
- Issue date Jul 31, 2018
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with electronic compontent and interconnection...
- Patent number 8,633,584
- Issue date Jan 21, 2014
- SK hynix Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system modules and method of fabrication
- Patent number 8,252,635
- Issue date Aug 28, 2012
- Hynix Semiconductor Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for exchanging semiconductor chip of flip-chip module and fl...
- Patent number 8,084,298
- Issue date Dec 27, 2011
- HTC Beteiligungs GmbH
- Ernst-A Weissbach
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device and manufacturing method
- Patent number 7,993,984
- Issue date Aug 9, 2011
- Panasonic Corporation
- Yasuo Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting structure, manufacturing method, and...
- Patent number 7,969,028
- Issue date Jun 28, 2011
- Panasonic Corporation
- Hisahiko Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for releasing adhered article
- Patent number 7,909,959
- Issue date Mar 22, 2011
- Sekisui Chemical Co., Ltd.
- Toshio Tada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Nail-shaped pillar for wafer-level chip-scale packaging
- Patent number 7,892,962
- Issue date Feb 22, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a matrix for detecting electromagnetic radiati...
- Patent number 7,811,855
- Issue date Oct 12, 2010
- Societe Francaise de Detecteurs Infrarouges-Sofradir
- Bernard Pitault
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system modules and method of fabrication
- Patent number 7,723,156
- Issue date May 25, 2010
- Hynix Semiconductor Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for electronic system modules
- Patent number 7,615,478
- Issue date Nov 10, 2009
- Hynix Semiconductor Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 7,526,854
- Issue date May 5, 2009
- Renesas Technology Corp.
- Haruhiko Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming solder seals for semiconductor fli...
- Patent number 7,479,411
- Issue date Jan 20, 2009
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairable three-dimensional semiconductor subsystem
- Patent number 7,427,809
- Issue date Sep 23, 2008
- Salmon Technologies, LLC
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, device mounting structure, device mounting method, a...
- Patent number 7,411,295
- Issue date Aug 12, 2008
- Fujitsu Limited
- Mitsuo Suehiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for electronic system modules
- Patent number 7,297,572
- Issue date Nov 20, 2007
- Hynix Semiconductor, Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump socket
- Patent number 7,118,389
- Issue date Oct 10, 2006
- Palo Alto Research Center Incorporated
- David K. Fork
- G01 - MEASURING TESTING
Information Patent Grant
System and method for accelerated detection of transient particle i...
- Patent number 7,084,660
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Jerry D. Ackaret
- G01 - MEASURING TESTING
Information Patent Grant
Method and process of contact to a heat softened solder ball array
- Patent number 6,967,307
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming solder seals for semiconductor fli...
- Patent number 6,956,291
- Issue date Oct 18, 2005
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxidized acetals and thioacetals, episulfidized acetals and thioa...
- Patent number 6,887,737
- Issue date May 3, 2005
- Henkel Corporation
- John G. Woods
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Patent number 6,706,971
- Issue date Mar 16, 2004
- Irvine Sensors Corporation
- Douglas M. Albert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable thermosetting resin compositions
- Patent number 6,657,031
- Issue date Dec 2, 2003
- Loctite Corporation
- Lawrence N. Crane
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and process of contact to a heat softened solder ball array
- Patent number 6,614,003
- Issue date Sep 2, 2003
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process of contact to a heat softened solder ball array
- Patent number 6,420,681
- Issue date Jul 16, 2002
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process of contract to a heat softened solder ball array
- Patent number 6,329,637
- Issue date Dec 11, 2001
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND MULTIPLE CHIPS USED THEREIN
- Publication number 20210280546
- Publication date Sep 9, 2021
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES
- Publication number 20180240719
- Publication date Aug 23, 2018
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES
- Publication number 20170256467
- Publication date Sep 7, 2017
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150116970
- Publication date Apr 30, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION
- Publication number 20100297814
- Publication date Nov 25, 2010
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC SYSTEM MODULES
- Publication number 20100007012
- Publication date Jan 14, 2010
- Hynix Semiconductor Inc.
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for Exchanging Semiconductor Chip of Flip-Chip Module and Fl...
- Publication number 20090085203
- Publication date Apr 2, 2009
- HTC BETEILIGUNGS GMBH
- Ernst-A. Weissbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nail-Shaped Pillar for Wafer-Level Chip-Scale Packaging
- Publication number 20090057896
- Publication date Mar 5, 2009
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD
- Publication number 20090014873
- Publication date Jan 15, 2009
- Yasuo Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A MATRIX FOR DETECTING ELECTROMAGNETIC RADIATI...
- Publication number 20090004760
- Publication date Jan 1, 2009
- Societe Francaise De Detecteurs Infrarouges- Sofradir
- Bernard PITAULT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, MANUFACTURING METHOD, AND...
- Publication number 20080308930
- Publication date Dec 18, 2008
- Hisahiko Yoshida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON
- Publication number 20080079140
- Publication date Apr 3, 2008
- HYNIX SEMICONDUCTOR, INC.
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION
- Publication number 20080026557
- Publication date Jan 31, 2008
- HYNIX SEMICONDUCTOR, INC.
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fabrication Method For Electronic System Modules
- Publication number 20070245554
- Publication date Oct 25, 2007
- HYNIX SEMICONDUCTOR, INC.
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Face down type semiconductor device and manufacturing process of fa...
- Publication number 20070152347
- Publication date Jul 5, 2007
- NEC Corporation
- Eiji Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Object and bonding method thereof
- Publication number 20070148950
- Publication date Jun 28, 2007
- DELTA ELECTRONICS, INC.
- Chi-Ming Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making stacked integrated circuits (ICs) using prepackag...
- Publication number 20070102803
- Publication date May 10, 2007
- Irvine Sensors Corporation
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of electronic device
- Publication number 20070053310
- Publication date Mar 8, 2007
- Haruhiko Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for releasing adhered article
- Publication number 20060144515
- Publication date Jul 6, 2006
- Toshio Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Repairable three-dimensional semiconductor subsystem
- Publication number 20060131728
- Publication date Jun 22, 2006
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and process of contact to a heat softened solder ball array
- Publication number 20060081583
- Publication date Apr 20, 2006
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stud bump socket
- Publication number 20050282411
- Publication date Dec 22, 2005
- Palto Alto Research Center Incorporated
- David K. Fork
- G01 - MEASURING TESTING
Information Patent Application
Circuit board, device mounting structure, device mounting method, a...
- Publication number 20050224971
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Mitsuo Suehiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic system modules and method of fabrication
- Publication number 20040092141
- Publication date May 13, 2004
- Peter C. Salmon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and process of contact to a heat softened solder ball array
- Publication number 20040035841
- Publication date Feb 26, 2004
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making stacked integrated circuits (ICs) using prepackag...
- Publication number 20030221313
- Publication date Dec 4, 2003
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and process of contact to a heat softened solder ball array
- Publication number 20020179584
- Publication date Dec 5, 2002
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Stackable microcircuit layer formed from a plastic encapsulated mic...
- Publication number 20020126459
- Publication date Sep 12, 2002
- Douglas M. Albert
- H01 - BASIC ELECTRIC ELEMENTS

Detaching bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device and multiple chips used therein

Mounting structure and method for manufacturing same

Removable sacrificial connections for semiconductor devices

Removable sacrificial connections for semiconductor devices

Mounting structure and method for manufacturing same

Electronic assembly with electronic compontent and interconnection...

Electronic system modules and method of fabrication

Method for exchanging semiconductor chip of flip-chip module and fl...

Electronic device and manufacturing method

Semiconductor device mounting structure, manufacturing method, and...

Method for releasing adhered article

Nail-shaped pillar for wafer-level chip-scale packaging

Method for producing a matrix for detecting electromagnetic radiati...

Electronic system modules and method of fabrication

Fabrication method for electronic system modules

Manufacturing method of electronic device

Apparatus and method for forming solder seals for semiconductor fli...

Repairable three-dimensional semiconductor subsystem

Circuit board, device mounting structure, device mounting method, a...

Fabrication method for electronic system modules

Stud bump socket

System and method for accelerated detection of transient particle i...

Method and process of contact to a heat softened solder ball array

Apparatus and method for forming solder seals for semiconductor fli...

Epoxidized acetals and thioacetals, episulfidized acetals and thioa...

Stackable microcircuit layer formed from a plastic encapsulated mic...

Reworkable thermosetting resin compositions

Method and process of contact to a heat softened solder ball array

Method and process of contact to a heat softened solder ball array

Method and process of contract to a heat softened solder ball array

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

STACKED SEMICONDUCTOR DEVICE AND MULTIPLE CHIPS USED THEREIN

REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION

ELECTRONIC SYSTEM MODULES

Method for Exchanging Semiconductor Chip of Flip-Chip Module and Fl...

Nail-Shaped Pillar for Wafer-Level Chip-Scale Packaging

ELECTRONIC DEVICE AND MANUFACTURING METHOD

METHOD FOR PRODUCING A MATRIX FOR DETECTING ELECTROMAGNETIC RADIATI...

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, MANUFACTURING METHOD, AND...

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION

Fabrication Method For Electronic System Modules

Face down type semiconductor device and manufacturing process of fa...

Object and bonding method thereof

Method for making stacked integrated circuits (ICs) using prepackag...

Manufacturing method of electronic device

Method for releasing adhered article

Repairable three-dimensional semiconductor subsystem

Method and process of contact to a heat softened solder ball array

Stud bump socket

Circuit board, device mounting structure, device mounting method, a...

Electronic system modules and method of fabrication

Method and process of contact to a heat softened solder ball array

Method for making stacked integrated circuits (ICs) using prepackag...

Method and process of contact to a heat softened solder ball array

Stackable microcircuit layer formed from a plastic encapsulated mic...