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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/564Details not otherwise provided for

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Patents Grantslast 30 patents

Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film packaging structure including stacked SiOxNy layers
- Patent number 12,144,197
- Issue date Nov 12, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhiliang Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit device and fabrication method thereof
- Patent number 12,132,011
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,132,012
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Nianwang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-coated, polymer-encapsulated electronics modules and methods...
- Patent number 12,132,010
- Issue date Oct 29, 2024
- GM Global Technology Operations LLC
- Anthony M. Coppola
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Environmentally protected photonic integrated circuit
- Patent number 12,125,805
- Issue date Oct 22, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kiosk gift card system and method
- Patent number 12,125,807
- Issue date Oct 22, 2024
- James Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced bonding between III-V material and oxide material
- Patent number 12,119,309
- Issue date Oct 15, 2024
- OpenLight Photonics, Inc.
- Avi Feshali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,094,758
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Tien-Tsai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including groove in termination region
- Patent number 12,087,706
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Takaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component with pad for a bump and manufacturing method the...
- Patent number 12,074,120
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Robert Felix Bywalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of manufacturing thereof
- Patent number 12,068,263
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a curved profile interface corresponding t...
- Patent number 12,069,886
- Issue date Aug 20, 2024
- Innolux Corporation
- Ardour Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip encapsulation structure and encapsulation method
- Patent number 12,057,361
- Issue date Aug 6, 2024
- Epicmems (Xiamen) Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device protection using an anti-reflective layer
- Patent number 12,046,509
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contaminant collection on SOI
- Patent number 12,046,602
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with through silicon vias, guard rings and methods of makin...
- Patent number 12,046,566
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,040,226
- Issue date Jul 16, 2024
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including semiconductor package and semiconduc...
- Patent number 12,025,656
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Seyoung Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture hermetic guard ring for semiconductor on insulator devices
- Patent number 12,014,996
- Issue date Jun 18, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion system with enhanced protection for gaseous corros...
- Patent number 12,009,740
- Issue date Jun 11, 2024
- Rockwell Automation Technologies, Inc.
- Garron Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD
- Publication number 20240421000
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A SEAL RING
- Publication number 20240413245
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- In Namgung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Seal Ring Structure on Wafer-Stacking
- Publication number 20240387403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING REINFORCEMENT
- Publication number 20240379587
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A CURVED PROFILE INTERFACE CORRESPONDING T...
- Publication number 20240373666
- Publication date Nov 7, 2024
- InnoLux Corporation
- Ardour CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP
- Publication number 20240361545
- Publication date Oct 31, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240363555
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOISTURE PASSING GAP IN POWER OR GROUN...
- Publication number 20240347479
- Publication date Oct 17, 2024
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT COLLECTION ON SOI
- Publication number 20240339457
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240339490
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...
- Publication number 20240332216
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332217
- Publication date Oct 3, 2024
- Morningrich Technology Co., Ltd.
- Chiu-Lang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332218
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332219
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...
- Publication number 20240312925
- Publication date Sep 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ping Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPENING IN WALL BETWEEN INPUT/OUTPUT OPENINGS OF IC CHIP
- Publication number 20240304570
- Publication date Sep 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING LEADFRAME, LEADFRAME COMPOSITE, BOX AND OUTSI...
- Publication number 20240294322
- Publication date Sep 5, 2024
- ADVANCED ASSEMBLY MATERIALS ANHUI LIMITED
- Ching Leung Lawrence KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240297127
- Publication date Sep 5, 2024
- Infineon Technologies Austria AG
- Mohamed Salleh Mohamed Saheed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20240258249
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Shunsuke Akasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20240248058
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240249990
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS

Details not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through wafer trench isolation between transistors in an integrated...

Housing, semiconductor module and methods for producing the same

Forming large chips through stitching

Thin film packaging structure including stacked SiOxNy layers

Sensor having tubular walled sensing cavity

Three-dimensional memory devices and fabricating methods thereof

Hermetic metallized via with improved reliability

Integrated circuit device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Metal-coated, polymer-encapsulated electronics modules and methods...

Environmentally protected photonic integrated circuit

Electronic device packages with internal moisture barriers

Kiosk gift card system and method

Enhanced bonding between III-V material and oxide material

Semiconductor structure and method for manufacturing the same

Semiconductor device including groove in termination region

Method for fabricating an integrated circuit device

Electric component with pad for a bump and manufacturing method the...

Semiconductor memory devices and methods of manufacturing thereof

Electronic device having a curved profile interface corresponding t...

Chip encapsulation structure and encapsulation method

Semiconductor device protection using an anti-reflective layer

Contaminant collection on SOI

Devices with through silicon vias, guard rings and methods of makin...

Conformal low temperature hermetic dielectric diffusion barriers

Chip package and method of forming a chip package

Semiconductor module including semiconductor package and semiconduc...

Moisture hermetic guard ring for semiconductor on insulator devices

Power conversion system with enhanced protection for gaseous corros...

Passivation scheme for pad openings and trenches

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

METHOD FOR FORMING A LID OF A HOUSING

SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

SEMICONDUCTOR DEVICES HAVING A SEAL RING

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Extended Seal Ring Structure on Wafer-Stacking

SEAL RING REINFORCEMENT

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

ELECTRONIC DEVICE HAVING A CURVED PROFILE INTERFACE CORRESPONDING T...

METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE HAVING MOISTURE PASSING GAP IN POWER OR GROUN...

CONTAMINANT COLLECTION ON SOI

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...

SEMICONDUCTOR DEVICE

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...

OPENING IN WALL BETWEEN INPUT/OUTPUT OPENINGS OF IC CHIP

METHOD FOR PROTECTING LEADFRAME, LEADFRAME COMPOSITE, BOX AND OUTSI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...