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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/564Details not otherwise provided for

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,368,116
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a porous structure
- Patent number 12,362,290
- Issue date Jul 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,292
- Issue date Jul 15, 2025
- Mitsubishi Electric Corporation
- Daisuke Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,342,526
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including seal ring structure
- Patent number 12,315,827
- Issue date May 27, 2025
- United Microelectronics Corp.
- Hui-Lung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 12,218,146
- Issue date Feb 4, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Tiaomei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element housing package and electronic apparatus
- Patent number 12,198,992
- Issue date Jan 14, 2025
- Kyocera Corporation
- Masanori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,183,691
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film packaging structure including stacked SiOxNy layers
- Patent number 12,144,197
- Issue date Nov 12, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhiliang Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit device and fabrication method thereof
- Patent number 12,132,011
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,132,012
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Nianwang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-coated, polymer-encapsulated electronics modules and methods...
- Patent number 12,132,010
- Issue date Oct 29, 2024
- GM Global Technology Operations LLC
- Anthony M. Coppola
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Environmentally protected photonic integrated circuit
- Patent number 12,125,805
- Issue date Oct 22, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kiosk gift card system and method
- Patent number 12,125,807
- Issue date Oct 22, 2024
- James Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced bonding between III-V material and oxide material
- Patent number 12,119,309
- Issue date Oct 15, 2024
- OpenLight Photonics, Inc.
- Avi Feshali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,094,758
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Tien-Tsai Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218875
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Cing-Yao JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250220927
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT COMPOSITION AND METHOD FOR PRODUCING WAFER
- Publication number 20250210375
- Publication date Jun 26, 2025
- Central Glass Company, Limited
- Yuzo OKUMURA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OPTICAL S...
- Publication number 20250201735
- Publication date Jun 19, 2025
- Sumitomo Electric Industries, Ltd.
- Munetaka KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT
- Publication number 20250201737
- Publication date Jun 19, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Houngchi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192027
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PIXEL MOISTURE PROTECTION (SPMP)
- Publication number 20250174579
- Publication date May 29, 2025
- dpiX, LLC
- Sara Chahid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250174533
- Publication date May 29, 2025
- MEDIATEK INC.
- Yih-Ting SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169123
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Seong Seok Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE RESISTANT SEMICONDUTOR DEVICE
- Publication number 20250140713
- Publication date May 1, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Shesh Mani Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132269
- Publication date Apr 24, 2025
- Murata Manufacturing Co., Ltd.
- Shinya MASUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...
- Publication number 20250112177
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DUMMY FILL STRUCTURES BETWEEN A THROUGH...
- Publication number 20250079339
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250079341
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...
- Publication number 20250079340
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...
- Publication number 20250079392
- Publication date Mar 6, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...
- Publication number 20250054851
- Publication date Feb 13, 2025
- TSINGHUA UNIVERSITY
- Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250046663
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046734
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMAGNET FOR SPIN-BASED QUANTUM-DOT QUBIT
- Publication number 20250037917
- Publication date Jan 30, 2025
- The Boeing Company
- Antonio Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250029937
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Substrate, Display Panel and Display Device
- Publication number 20250031447
- Publication date Jan 23, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhengliang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Alignment Mark
- Publication number 20250029880
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250022807
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Joon Seuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20250020610
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- G01 - MEASURING TESTING

Details not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and manufacturing method thereof

Semiconductor structure with a porous structure

Semiconductor device

Chip package assembly, electronic device, and preparation method of...

Semiconductor device and method for fabricating the same

Semiconductor structure including seal ring structure

Conformal low temperature hermetic dielectric diffusion barriers

Semiconductor device including cumulative sealing structures

Extended seal ring structure on wafer-stacking

Structure and method for sealing a silicon IC

Array substrate, display panel and display device

Semiconductor package and manufacturing method thereof

Electronic element housing package and electronic apparatus

Semiconductor structure and manufacturing method of semiconductor s...

Semiconductor structure and method of forming the same

Through wafer trench isolation between transistors in an integrated...

Housing, semiconductor module and methods for producing the same

Forming large chips through stitching

Thin film packaging structure including stacked SiOxNy layers

Sensor having tubular walled sensing cavity

Three-dimensional memory devices and fabricating methods thereof

Hermetic metallized via with improved reliability

Integrated circuit device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Metal-coated, polymer-encapsulated electronics modules and methods...

Environmentally protected photonic integrated circuit

Electronic device packages with internal moisture barriers

Kiosk gift card system and method

Enhanced bonding between III-V material and oxide material

Semiconductor structure and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SURFACE TREATMENT COMPOSITION AND METHOD FOR PRODUCING WAFER

OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OPTICAL S...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SINGLE PIXEL MOISTURE PROTECTION (SPMP)

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

MOISTURE RESISTANT SEMICONDUTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...

SEMICONDUCTOR DEVICES WITH DUMMY FILL STRUCTURES BETWEEN A THROUGH...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...

HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

FORMING LARGE CHIPS THROUGH STITCHING

Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

NANOMAGNET FOR SPIN-BASED QUANTUM-DOT QUBIT

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Display Substrate, Display Panel and Display Device

Seal Ring Structure with Alignment Mark

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SENSOR HAVING TUBULAR WALLED SENSING CAVITY