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Patents Grants
last 30 patents
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Patent Grant
Film covers for sensor packages
Patent number
11,972,994
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Sreenivasan Kalyani Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,972,995
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Dahee Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,967,568
Issue date
Apr 23, 2024
Kabushiki Kaisha Toshiba
Kouta Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and semiconductor apparatus leak inspection...
Patent number
11,967,537
Issue date
Apr 23, 2024
Mitsubishi Electric Corporation
Takayuki Hisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module including semiconductor package and semiconduc...
Patent number
11,953,545
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Seyoung Won
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
Patent number
11,935,756
Issue date
Mar 19, 2024
Baosuo Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extended seal ring structure on wafer-stacking
Patent number
11,894,319
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih-Hsorng Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic semiconductor package seal rings
Patent number
11,881,460
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon nitride metal layer covers
Patent number
11,876,056
Issue date
Jan 16, 2024
Texas Instruments Incorporated
Jonathan Andrew Montoya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for fabricating the same
Patent number
11,877,436
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Tsu-Chieh Ai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with elevated lead and structure extending vertically from...
Patent number
11,862,582
Issue date
Jan 2, 2024
Infineon Technologies AG
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer thinned by stealth lasing
Patent number
11,862,583
Issue date
Jan 2, 2024
Western Digital Technologies, Inc.
Chee Keong Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for detecting defects in semiconductor device
Patent number
11,854,913
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Crackstop with embedded passive radio frequency noise suppressor an...
Patent number
11,855,005
Issue date
Dec 26, 2023
GLOBALFOUNDRIES U.S. Inc.
Nicholas A. Polomoff
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Seal ring structures and methods of forming same
Patent number
11,842,992
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Ming Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a strained semiconductor device and corre...
Patent number
11,837,558
Issue date
Dec 5, 2023
STMicroelectronics S.r.l.
Santo Alessandro Smerzi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Moisture barrier for bond pads and integrated circuit having the same
Patent number
11,830,826
Issue date
Nov 28, 2023
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for sealing a silicon IC
Patent number
11,824,015
Issue date
Nov 21, 2023
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,817,399
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Moisture seal for photonic devices
Patent number
11,810,870
Issue date
Nov 7, 2023
GLOBALFOUNDRIES U.S. Inc.
Asli Sahin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit for detecting crack damage of a die, method for detecting c...
Patent number
11,804,412
Issue date
Oct 31, 2023
Changxin Memory Technologies, Inc.
Lingling Cao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with first and second portions that include si...
Patent number
11,804,415
Issue date
Oct 31, 2023
Infineon Technologies AG
Markus Kahn
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,798,893
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-scale integration with alternative technology wafer processes...
Patent number
11,798,901
Issue date
Oct 24, 2023
AVERY DENNISON RETAIL INFORMATION SERVICES LLC
Ian J. Forster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,791,285
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Hui Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protection structures in semiconductor chips and methods for formin...
Patent number
11,791,229
Issue date
Oct 17, 2023
Yangtze Memory Technologies Co., Ltd.
Jialan He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetic semiconductor packages
Patent number
11,784,102
Issue date
Oct 10, 2023
UTAC HEADQUARTERS PTE. LTD.
Eakkasit Dumsong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power conversion system with enhanced protection for gaseous corros...
Patent number
11,784,554
Issue date
Oct 10, 2023
Rockwell Automation Technologies, Inc.
Garron Morris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
Patent number
11,776,821
Issue date
Oct 3, 2023
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,776,936
Issue date
Oct 3, 2023
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
Publication number
20240136305
Publication date
Apr 25, 2024
Macronix International Co., Ltd.
Cheng-Yu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERSION SYSTEM WITH ENHANCED PROTECTION FOR GASEOUS CORROS...
Publication number
20240136913
Publication date
Apr 25, 2024
Rockwell Automation Technologies, Inc.
Garron Morris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE
Publication number
20240113109
Publication date
Apr 4, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240105502
Publication date
Mar 28, 2024
United Microelectronics Corp.
Tien-Tsai HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240088064
Publication date
Mar 14, 2024
Mitsubishi Electric Corporation
Daichi OTORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MATCHING CIRCUIT, AND FILTER CIRCUIT
Publication number
20240072107
Publication date
Feb 29, 2024
Murata Manufacturing Co., Ltd.
Masatomi HARADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULL WAFER DEVICE WITH MULTIPLE DIRECTIONAL INDICATORS
Publication number
20240071955
Publication date
Feb 29, 2024
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH VIA WITH GUARD RING STRUCTURE
Publication number
20240071956
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
Publication number
20240063147
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE
Publication number
20240055298
Publication date
Feb 15, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
JeongPyo HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
Publication number
20240047383
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND METHOD FOR MA...
Publication number
20240047392
Publication date
Feb 8, 2024
Princo Corp.
Pei-Liang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Kiosk Gift Card System and Method
Publication number
20240047382
Publication date
Feb 8, 2024
James Curtis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240049448
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
Tsu-Chieh AI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240038684
Publication date
Feb 1, 2024
United Microelectronics Corp.
Ming-Hua Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for Sealing a Silicon IC
Publication number
20240038689
Publication date
Feb 1, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240038688
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Zi-Jheng LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038674
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...
Publication number
20240030160
Publication date
Jan 25, 2024
GLOBALFOUNDRIES U.S. Inc.
Nicholas A. Polomoff
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
IGBT MODULE, MOTOR CONTROLLER, AND VEHICLE
Publication number
20240021714
Publication date
Jan 18, 2024
BYD COMPANY LIMITED
Guangming YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240023346
Publication date
Jan 18, 2024
Samsung Electronics Co., Ltd.
Younghun CHEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER MODULE
Publication number
20240021542
Publication date
Jan 18, 2024
Hitachi Energy Switzerland AG
Marco BELLINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240021498
Publication date
Jan 18, 2024
Sony Semiconductor Solutions Corporation
Takushi SHIGETOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
Publication number
20240006356
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
INHYO HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240006348
Publication date
Jan 4, 2024
Taiwan Semiconductor Manfuacturing Company, Ltd.
Meng-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230420391
Publication date
Dec 28, 2023
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
Publication number
20230420392
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lun LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230402432
Publication date
Dec 14, 2023
ROHM CO., LTD.
Kenji HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20230395532
Publication date
Dec 7, 2023
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Structures With Improved Reliability
Publication number
20230395531
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS