Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00

Industry

CPC
H01G2/00

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Industries

Patents Grantslast 30 patents

Information Patent Grant
Capacitor assembly
- Patent number 11,968,784
- Issue date Apr 23, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Michel Alexander Hagenaar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board includin...
- Patent number 11,967,467
- Issue date Apr 23, 2024
- Taiyo Yuden Co., Ltd.
- Fumi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 11,961,682
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sim Chung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System including a bent capacitor bus bar
- Patent number 11,961,670
- Issue date Apr 16, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Rajesh Mittu Ram Yadav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component without external electrodes on top sur...
- Patent number 11,961,680
- Issue date Apr 16, 2024
- Taiyo Yuden Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor including internal electrodes having pores on...
- Patent number 11,961,681
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yu Kwang Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor module and power conversion apparatus
- Patent number 11,961,677
- Issue date Apr 16, 2024
- Denso Corporation
- Mamoru Kuwahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board for mounting the same
- Patent number 11,955,281
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid electrolytic capacitor containing a vapor-deposited barrier film
- Patent number 11,948,756
- Issue date Apr 2, 2024
- KYOCERA AVX Components Corporation
- Jan Petrzilek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component
- Patent number 11,948,743
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,948,745
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Chul Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,948,750
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling electronic components of a vehicle
- Patent number 11,943,903
- Issue date Mar 26, 2024
- BorgWarner Luxembourg Automotive Systems SA
- Pascal David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Busbar structure for capacitor
- Patent number 11,942,275
- Issue date Mar 26, 2024
- Nichicon Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,942,273
- Issue date Mar 26, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tantalum capacitor
- Patent number 11,942,279
- Issue date Mar 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Ho Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film capacitor for power electronics
- Patent number 11,942,274
- Issue date Mar 26, 2024
- Wolfgang Westermann
- Axel Westermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,935,697
- Issue date Mar 19, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor having insert injection-type case with dual material of m...
- Patent number 11,935,696
- Issue date Mar 19, 2024
- NUINTEK CO LTD
- Dae-Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded film capacitor
- Patent number 11,935,699
- Issue date Mar 19, 2024
- KEMET Electronics Corporation
- Evangelista Boni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component including non-conductive resin laye...
- Patent number 11,935,703
- Issue date Mar 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Seok Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagnostic device, energy storage apparatus, and diagnostic method
- Patent number 11,927,636
- Issue date Mar 12, 2024
- GS Yuasa International Ltd.
- Yuki Imanaka
- G01 - MEASURING TESTING
Information Patent Grant
Temperature-dependent capacitor
- Patent number 11,929,390
- Issue date Mar 12, 2024
- International Business Machines Corporation
- Kyle Schoneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method
- Patent number 11,928,412
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component
- Patent number 11,923,141
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic capacitor comprising an anode body having a porous str...
- Patent number 11,923,152
- Issue date Mar 5, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method of manufacturing the same
- Patent number 11,923,149
- Issue date Mar 5, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method of manufacturing multilayer...
- Patent number 11,923,142
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Shinobu Chikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component without external electrodes on top sur...
- Patent number 11,915,881
- Issue date Feb 27, 2024
- Taiyo Yuden Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240136122
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT CAPACITOR
- Publication number 20240120150
- Publication date Apr 11, 2024
- ELNA CO., LTD.
- Tadahiro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING A BENT CAPACITOR BUS BAR
- Publication number 20240120151
- Publication date Apr 11, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Rajesh Mittu Ram YADAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240105386
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
An Improved Tantalum Electrode and Related Methods
- Publication number 20240105392
- Publication date Mar 28, 2024
- BIOTRONIK SE & CO. KG
- Bernd PRETZLAFF
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Low Inductance Electroytic Capacitor
- Publication number 20240105394
- Publication date Mar 28, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20240098881
- Publication date Mar 21, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AN...
- Publication number 20240096558
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dong Yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON
- Publication number 20240096560
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC CAPACITOR
- Publication number 20240096559
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240087808
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Masato KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS
- Publication number 20240087811
- Publication date Mar 14, 2024
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240071689
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Chan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE CAPACITOR
- Publication number 20240071693
- Publication date Feb 29, 2024
- TDK Corporation
- Yuta KAMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSEHOLD ENERGY STORAGE SYSTEM AND MODULE FIXING STRUCTURE THEREOF
- Publication number 20240072361
- Publication date Feb 29, 2024
- Sungrow Energy Storage Technology Co., Ltd.
- Xiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRALLY FORMED THREAD LOCK RETENTION FEATURE
- Publication number 20240068502
- Publication date Feb 29, 2024
- Whirlpool Corporation
- Daniel A. Schurr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR INTEGRATED STRUCTURE AND CAPACITOR UNIT
- Publication number 20240062957
- Publication date Feb 22, 2024
- Powerchip Semiconductor Manufacturing Corporation
- WEI-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND APPARATUS
- Publication number 20240055184
- Publication date Feb 15, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Manabu KANOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICES WITH BUSBARS AND METHOD FOR THEIR FABRICATION
- Publication number 20240055781
- Publication date Feb 15, 2024
- Audi AG
- Benjamin SÖHNLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055188
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyeongjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SWITCHING CELL
- Publication number 20240048063
- Publication date Feb 8, 2024
- MASCHINENFABRIK REINHAUSEN GMBH
- Angus Bryant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC BODY, CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND DE...
- Publication number 20240038452
- Publication date Feb 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hisanori MASHIKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT MOLDED ELECTRIC DEVICE
- Publication number 20240038445
- Publication date Feb 1, 2024
- S&C ELECTRIC COMPANY
- Nicholas Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT INCLUDING A SILICON ORGANIC COMPOUN...
- Publication number 20240038449
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dong Yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS
- Publication number 20240029961
- Publication date Jan 25, 2024
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES...
- Publication number 20240021366
- Publication date Jan 18, 2024
- STATS ChipPAC Pte Ltd.
- KyoWang KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS
- Publication number 20240006126
- Publication date Jan 4, 2024
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240006122
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS

Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Capacitor assembly

Multi-layer ceramic electronic component and circuit board includin...

Multilayer capacitor and board having the same mounted thereon

System including a bent capacitor bus bar

Ceramic electronic component without external electrodes on top sur...

Multilayer capacitor including internal electrodes having pores on...

Capacitor module and power conversion apparatus

Electronic component and board for mounting the same

Solid electrolytic capacitor containing a vapor-deposited barrier film

Electronic component

Multilayer capacitor

Electronic component

Systems and methods for cooling electronic components of a vehicle

Busbar structure for capacitor

Electronic component

Tantalum capacitor

Film capacitor for power electronics

Capacitor

Capacitor having insert injection-type case with dual material of m...

Overmolded film capacitor

Multilayer electronic component including non-conductive resin laye...

Diagnostic device, energy storage apparatus, and diagnostic method

Temperature-dependent capacitor

Method

Electronic component

Electrolytic capacitor comprising an anode body having a porous str...

Multilayer ceramic capacitor and method of manufacturing the same

Structural lead frame

Multilayer ceramic capacitor and method of manufacturing multilayer...

Ceramic electronic component without external electrodes on top sur...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

SURFACE-MOUNT CAPACITOR

SYSTEM INCLUDING A BENT CAPACITOR BUS BAR

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

ELECTRONIC COMPONENT

An Improved Tantalum Electrode and Related Methods

Low Inductance Electroytic Capacitor

ELECTRICAL DEVICE

MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AN...

MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON

MULTI-LAYERED CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

HIGH VOLTAGE CAPACITOR

HOUSEHOLD ENERGY STORAGE SYSTEM AND MODULE FIXING STRUCTURE THEREOF

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

INTEGRALLY FORMED THREAD LOCK RETENTION FEATURE

CAPACITOR INTEGRATED STRUCTURE AND CAPACITOR UNIT

CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND APPARATUS

POWER ELECTRONIC DEVICES WITH BUSBARS AND METHOD FOR THEIR FABRICATION

MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

MODULAR SWITCHING CELL

DIELECTRIC BODY, CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND DE...

DIRECT MOLDED ELECTRIC DEVICE

MULTILAYER ELECTRONIC COMPONENT INCLUDING A SILICON ORGANIC COMPOUN...

CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES...

CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME