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H01L2225/1047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1047Details of electrical connections between containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked package module including the same
- Patent number 12,176,328
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems-in-packages having multiple shielding components
- Patent number 11,900,197
- Issue date Feb 13, 2024
- Amazon Technologies, Inc.
- Kun Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,791,301
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked package module including the same
- Patent number 11,769,762
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional blocks implemented by integrated circuit
- Patent number 11,764,212
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices and methods thereof involving a vertical switched filter...
- Patent number 11,437,696
- Issue date Sep 6, 2022
- Knowles Cazenovia, Inc.
- David Bates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,430,670
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 11,355,474
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical switched filter bank
- Patent number 11,355,829
- Issue date Jun 7, 2022
- Knowles Cazenovia, Inc.
- David Bates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,239,194
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,239,233
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device package with organic reinforcement structure
- Patent number 11,189,587
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,588
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,587
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,101,253
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 10,872,885
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,867,974
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 10,847,383
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional blocks implemented by 3D stacked integrated circuit
- Patent number 10,840,240
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20250218876
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
- Publication number 20250125317
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Daeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20240178078
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...
- Publication number 20240030174
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
- Publication number 20230387090
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Daeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20220344223
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
- Publication number 20210407971
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Daeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210134752
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL BLOCKS IMPLEMENTED BY INTEGRATED CIRCUIT
- Publication number 20210050347
- Publication date Feb 18, 2021
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210013189
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200312791
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200144202
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Functional Blocks Implemented by 3D Stacked Integrated Circuit
- Publication number 20200135719
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
- Publication number 20200066548
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200013764
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200006274
- Publication date Jan 2, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20180350756
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-tier conductive circuits free of supporting substrate with in...
- Publication number 20180343749
- Publication date Nov 29, 2018
- Bo Gosta Nystedt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip Monolithically Integrated wit...
- Publication number 20170317001
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170263527
- Publication date Sep 14, 2017
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND BONDED STRUCTURE
- Publication number 20170053902
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...
- Publication number 20160027710
- Publication date Jan 28, 2016
- GE Energy Power Conversion Technology Ltd.
- Fei XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Multiple Semiconductor Chips and Multiple Carriers
- Publication number 20150303128
- Publication date Oct 22, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Details of electrical connections between containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device test circuits and methods of use

Semiconductor package and method manufacturing the same

Chip package structure having molding layer

Semiconductor package and stacked package module including the same

Semiconductor package and method manufacturing the same

Stacked semiconductor devices and methods of forming same

Package and package-on-package structure having elliptical columns...

Stacked semiconductor device test circuits and methods of use

Systems-in-packages having multiple shielding components

Stacked semiconductor devices and methods of forming same

Chip package structure

Semiconductor package and stacked package module including the same

Functional blocks implemented by integrated circuit

Package and package-on-package structure having elliptical columns...

Bump-on-trace design for enlarge bump-to-trace distance

RF devices and methods thereof involving a vertical switched filter...

Stacked semiconductor devices and methods of forming same

Package and package-on-package structure having elliptical columns...

Semiconductor package and method manufacturing the same

Vertical switched filter bank

Chip package structure

Integrated circuit packages and methods of forming same

Semiconductor device package with organic reinforcement structure

Packaged semiconductor devices, methods of packaging semiconductor...

Packaged semiconductor devices, methods of packaging semiconductor...

Semiconductor package

Integrated circuit packages and methods of forming same

Semiconductor package and method of fabricating the same

Stacked semiconductor devices and methods of forming same

Functional blocks implemented by 3D stacked integrated circuit

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

INTEGRATED CIRCUIT PACKAGES AND METHODS

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

FUNCTIONAL BLOCKS IMPLEMENTED BY INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

Functional Blocks Implemented by 3D Stacked Integrated Circuit

Stacked Semiconductor Devices and Methods of Forming Same

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

Multi-tier conductive circuits free of supporting substrate with in...

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

Device Including a Semiconductor Chip Monolithically Integrated wit...

SEMICONDUCTOR MODULE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND BONDED STRUCTURE

SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...

Device Including Multiple Semiconductor Chips and Multiple Carriers