Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

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H05K2201/20

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector structure and connector
- Patent number 12,170,423
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film and display apparatus having the same
- Patent number 12,167,538
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Jun Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded interconnect system
- Patent number 12,167,582
- Issue date Dec 10, 2024
- GITech, Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,144,108
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including a conductive portion and contact member...
- Patent number 12,133,342
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Geuna Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-OLED display module thermal management
- Patent number 12,127,430
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and printed circuit board package
- Patent number 12,108,535
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mainboard connection structure and guiding device
- Patent number 12,052,823
- Issue date Jul 30, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Chia-Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and methods for reduced mechanical ringing
- Patent number 12,038,549
- Issue date Jul 16, 2024
- Halliburton Energy Services, Inc.
- Chang S. Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display unit and electronic apparatus
- Patent number 12,033,985
- Issue date Jul 9, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,997,794
- Issue date May 28, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Shuang Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,997,837
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Taketo Nishiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board with a meandering shape section
- Patent number 11,968,777
- Issue date Apr 23, 2024
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit mounted article and device
- Patent number 11,963,558
- Issue date Apr 23, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- A41 - WEARING APPAREL
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,963,298
- Issue date Apr 16, 2024
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with a sandwich plate construction
- Patent number 11,963,335
- Issue date Apr 16, 2024
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Crimp terminal-equipped flexible printed circuit board and method f...
- Patent number 11,942,708
- Issue date Mar 26, 2024
- Nippon Mektron, Ltd.
- Masanori Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and system for communication to an access po...
- Patent number 11,937,393
- Issue date Mar 19, 2024
- ARINC Incorporated
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 11,930,592
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing device
- Patent number 11,917,784
- Issue date Feb 27, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing device incorporating electronic circuit-board unit includi...
- Patent number 11,904,611
- Issue date Feb 20, 2024
- Brother Kogyo Kabushiki Kaisha
- Yusuke Ikemoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER STRUCTURE FOR POWER MODULES
- Publication number 20240413118
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...
- Publication number 20240397616
- Publication date Nov 28, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD
- Publication number 20240381524
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- MyungJin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20240357737
- Publication date Oct 24, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Jaeyong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Structure and Printed Circuit Board Detection...
- Publication number 20240341030
- Publication date Oct 10, 2024
- Advanced ACEBIOTEK CO., LTD.
- Yi-Ping Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB
- Publication number 20240314923
- Publication date Sep 19, 2024
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF
- Publication number 20240314918
- Publication date Sep 19, 2024
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAT FLEXIBLE PRINTED CIRCUIT
- Publication number 20240306301
- Publication date Sep 12, 2024
- Samkee Ev Co., Ltd.
- Gyu Sik CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240306320
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- SEON-KYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIBRATION DAMPENING FOR HIGH-DENSITY STORAGE SYSTEM STRUCTURE
- Publication number 20240292521
- Publication date Aug 29, 2024
- Hyve Solutions Corporation
- Jayarama Narayan Shenoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIO...
- Publication number 20240292542
- Publication date Aug 29, 2024
- Dell Products L.P.
- Chris A. Torres
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY MODULE AND METHOD OF ASSEMBLY
- Publication number 20240276649
- Publication date Aug 15, 2024
- Advanced Energy Industries, Inc.
- Antonios Tzimas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240268023
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20240251502
- Publication date Jul 25, 2024
- DAIKIN INDUSTRIES, LTD.
- Kazuma TANIMUKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...
- Publication number 20240244761
- Publication date Jul 18, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Zhiyang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...
- Publication number 20240237232
- Publication date Jul 11, 2024
- HANNSTAR DISPLAY CORPORATION
- Pei-Hao Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...
- Publication number 20240224410
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jeongseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION ASSEMBLY AND ELECTRIC DEVICE THEREOF
- Publication number 20240224470
- Publication date Jul 4, 2024
- GIGA-BYTE TECHNOLOGY CO., LTD.
- Chih-Ming Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR-EQUIPPED FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20240213698
- Publication date Jun 27, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20240206055
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seonghun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- Publication number 20240188225
- Publication date Jun 6, 2024
- Intel Corporation
- Vinith BEJUGAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHTING DEVICE FOR A MOTOR VEHICLE, COMPRISING AN ILLUMINATED SCREEN
- Publication number 20240181960
- Publication date Jun 6, 2024
- Valeo Vision
- Antoine DE-LAMBERTERIE
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240179843
- Publication date May 30, 2024
- SONY GROUP CORPORATION
- Yoshihiro KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector structure and connector

Flexible circuit film and display apparatus having the same

Shielded interconnect system

Wiring board and method for manufacturing wiring board

Electronic device including a conductive portion and contact member...

Micro-OLED display module thermal management

Printed circuit board

Printed circuit board and printed circuit board package

Circuit board assembly

Electronic assembly including cable modules

Mainboard connection structure and guiding device

Electronic assembly for a vehicle display

Tools and methods for reduced mechanical ringing

Camera module and array camera module based on integral packaging t...

Display unit and electronic apparatus

Display device

Power semiconductor module and power converter

Method of fabricating a substrate with metal reflection layer

Method for manufacturing wiring board with a meandering shape section

Circuit mounted article and device

Fabric-based items with electrical component arrays

Printed wiring board and method for manufacturing printed wiring board

Heatsink with a sandwich plate construction

Solid state relay

Crimp terminal-equipped flexible printed circuit board and method f...

Method for manufacturing a substrate structure with high reflectance

Circuit board assembly and system for communication to an access po...

Electronic device including flexible printed circuit board

Fixing device

Printing device incorporating electronic circuit-board unit includi...

Patents Applicationslast 30 patents

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

SOLDER BARRIER STRUCTURE FOR POWER MODULES

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...

SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD

SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME

Printed Circuit Board Structure and Printed Circuit Board Detection...

PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB

ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF

FLAT FLEXIBLE PRINTED CIRCUIT

DISPLAY DEVICE

PRINTED WIRING BOARD

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

VIBRATION DAMPENING FOR HIGH-DENSITY STORAGE SYSTEM STRUCTURE

INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIO...

POWER SUPPLY MODULE AND METHOD OF ASSEMBLY

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

SUBSTRATE STRUCTURE

PRINTED WIRING BOARD

PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...

ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...

HEAT DISSIPATION ASSEMBLY AND ELECTRIC DEVICE THEREOF

CONNECTOR-EQUIPPED FLEXIBLE PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

LIGHTING DEVICE FOR A MOTOR VEHICLE, COMPRISING AN ILLUMINATED SCREEN

ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE