Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

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CPC
H05K2201/20

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Opto-electric hybrid board
- Patent number 12,366,715
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component
- Patent number 12,369,254
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly and electronic device
- Patent number 12,369,249
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Hongbin Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and display device
- Patent number 12,369,255
- Issue date Jul 22, 2025
- Beijing Boe Display Technology Co., Ltd.
- Yuanye Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module carrying a plurality of electronic devices
- Patent number 12,349,302
- Issue date Jul 1, 2025
- STMicroelectronics S.r.l.
- Luca Maggi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of a curved electronic device using differential heatin...
- Patent number 12,349,272
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit assembly wound with reels
- Patent number 12,336,122
- Issue date Jun 17, 2025
- HONOR DEVICE CO., LTD.
- Wenhao Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting assembly comprising flexible printed circuit board and e...
- Patent number 12,317,418
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Wonho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including bonding layer, having conductive pa...
- Patent number 12,295,100
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yoon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,284,758
- Issue date Apr 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling systems with a flexible printed circuit tensio...
- Patent number 12,279,375
- Issue date Apr 15, 2025
- Dell Products L.P.
- Chris A. Torres
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting structure of electronic component
- Patent number 12,267,956
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Noboru Serita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer element for a printed circuit board assembly
- Patent number 12,267,977
- Issue date Apr 1, 2025
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,256,492
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic device
- Patent number 12,245,364
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device for a motor vehicle
- Patent number 12,241,610
- Issue date Mar 4, 2025
- HELLA GMBH & CO. KGAA
- Marc Kaup
- F21 - LIGHTING
Information Patent Grant
Interface card assembly and circuit board module using the same
- Patent number 12,237,618
- Issue date Feb 25, 2025
- ASUSTeK COMPUTER Inc.
- Po-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening member with fastening portions
- Patent number 12,228,168
- Issue date Feb 18, 2025
- FIVETECH TECHNOLOGY INC.
- Ting-Jui Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Damper system for a lidless integrated circuit
- Patent number 12,219,690
- Issue date Feb 4, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display assembly and display device each including flexible circuit...
- Patent number 12,219,697
- Issue date Feb 4, 2025
- BOE Technology Group Co., Ltd.
- Xiao Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 12,213,246
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 12,213,255
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transmission module, electronic unit, and electronic device
- Patent number 12,213,244
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electro-optical apparatus
- Patent number 12,210,250
- Issue date Jan 28, 2025
- TRIVALE TECHNOLOGIES
- Takahiro Ueno
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Implantable medical device with relative motion control
- Patent number 12,172,022
- Issue date Dec 24, 2024
- Cardiac Pacemakers, Inc.
- Joel Becklund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE BOARD, LIQUID JET HEAD, AND LIQUID JET RECORDING APPARATUS
- Publication number 20250229532
- Publication date Jul 17, 2025
- SII PRINTEK INC.
- Yukihiro SAGA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SOLDER WALL
- Publication number 20250227852
- Publication date Jul 10, 2025
- Samsung Electronics Co., LTD
- Eun-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250216614
- Publication date Jul 3, 2025
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DOCK PRINTED CIRCUIT BOARD
- Publication number 20250203778
- Publication date Jun 19, 2025
- Weathered Security, LLC
- Dale Robert Wooden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250194010
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS
- Publication number 20250168987
- Publication date May 22, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FASTENING MEMBER WITH FASTENING PORTIONS
- Publication number 20250146517
- Publication date May 8, 2025
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250142729
- Publication date May 1, 2025
- SAMSUNG DISPLAY CO., LTD.
- Youngjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OPTICAL APPARATUS
- Publication number 20250130464
- Publication date Apr 24, 2025
- Trivale Technologies
- Takahiro UENO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20250133659
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250126712
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF FOR CIRCUIT CARD ASSEMBLIES
- Publication number 20250120033
- Publication date Apr 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Sanjay Kumarapuram Anantharaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250107000
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jun HO HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250106991
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...
- Publication number 20250098064
- Publication date Mar 20, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Nianqi YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE DEVICE
- Publication number 20250089170
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Suin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081338
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250081334
- Publication date Mar 6, 2025
- IBIDEN CO., LTD.
- Katsuyuki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPING STRUCTURE
- Publication number 20250071888
- Publication date Feb 27, 2025
- Apple Inc.
- Shawn X. ARNOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH PASSIVE VIBRATION DAMPING
- Publication number 20250056714
- Publication date Feb 13, 2025
- Continental Automotive Technologies GmbH
- Ralf Scheib
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250056723
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Opto-electric hybrid board

Method of manufacturing electronic component

Printed circuit board assembly and electronic device

Display module and display device

Printed wiring board and method for manufacturing printed wiring board

Recyclable electronic device

Electronic module carrying a plurality of electronic devices

Manufacture of a curved electronic device using differential heatin...

Printed circuit board

Flexible printed circuit assembly wound with reels

Methods and apparatus for package with interposers

Connecting assembly comprising flexible printed circuit board and e...

Printed circuit board including bonding layer, having conductive pa...

Printed circuit board

Information handling systems with a flexible printed circuit tensio...

Substrate frame design for three-dimensional stacked electronic ass...

Mounting structure of electronic component

Spacer element for a printed circuit board assembly

Printed circuit board

Wiring board and electronic device

Lighting device for a motor vehicle

Interface card assembly and circuit board module using the same

Fastening member with fastening portions

Damper system for a lidless integrated circuit

Display assembly and display device each including flexible circuit...

Electronic device including flexible printed circuit board

Device for fixing camera module circuit board, and camera module

Transmission module, electronic unit, and electronic device

Electro-optical apparatus

Implantable medical device with relative motion control

Patents Applicationslast 30 patents

FLEXIBLE BOARD, LIQUID JET HEAD, AND LIQUID JET RECORDING APPARATUS

ELECTRONIC DEVICE COMPRISING SOLDER WALL

WIRING SUBSTRATE

MULTI-DOCK PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS

PRINTED CIRCUIT BOARD ASSEMBLY

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

FASTENING MEMBER WITH FASTENING PORTIONS

ELECTRONIC DEVICE

ELECTRO-OPTICAL APPARATUS

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

STANDOFF FOR CIRCUIT CARD ASSEMBLIES

FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...

STORAGE DEVICE

CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD

DAMPING STRUCTURE

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD WITH PASSIVE VIBRATION DAMPING

ELECTRONIC DEVICE INCLUDING INTERPOSER