Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industry

CPC
H05K2201/20

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board with a meandering shape section
- Patent number 11,968,777
- Issue date Apr 23, 2024
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit mounted article and device
- Patent number 11,963,558
- Issue date Apr 23, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- A41 - WEARING APPAREL
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,963,298
- Issue date Apr 16, 2024
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with a sandwich plate construction
- Patent number 11,963,335
- Issue date Apr 16, 2024
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Crimp terminal-equipped flexible printed circuit board and method f...
- Patent number 11,942,708
- Issue date Mar 26, 2024
- Nippon Mektron, Ltd.
- Masanori Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and system for communication to an access po...
- Patent number 11,937,393
- Issue date Mar 19, 2024
- ARINC Incorporated
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 11,930,592
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing device
- Patent number 11,917,784
- Issue date Feb 27, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing device incorporating electronic circuit-board unit includi...
- Patent number 11,904,611
- Issue date Feb 20, 2024
- Brother Kogyo Kabushiki Kaisha
- Yusuke Ikemoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Display device
- Patent number 11,882,649
- Issue date Jan 23, 2024
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable PCB for solid state light source application
- Patent number 11,882,651
- Issue date Jan 23, 2024
- SIGNIFY HOLDING B.V.
- Rifat Ata Mustafa Hikmet
- F21 - LIGHTING
Information Patent Grant
Printed circuit board
- Patent number 11,882,652
- Issue date Jan 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 11,856,697
- Issue date Dec 26, 2023
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite wiring board, package, and electronic device
- Patent number 11,849,538
- Issue date Dec 19, 2023
- NGK Electronics Devices, Inc.
- Noboru Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device with connector structure
- Patent number 11,839,027
- Issue date Dec 5, 2023
- Wistron NeWeb Corp.
- Yan-Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical energy absorbing bracket apparatus
- Patent number 11,832,410
- Issue date Nov 28, 2023
- PURE STORAGE, INC.
- Dominique Brych
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board assembly
- Patent number 11,825,604
- Issue date Nov 21, 2023
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise capacitors
- Patent number 11,817,262
- Issue date Nov 14, 2023
- KYOCERA AVX Components Corporation
- Andrew P. Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Stretchable display device
- Patent number 11,810,906
- Issue date Nov 7, 2023
- LG Display Co., Ltd.
- Seulki Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Backlight unit and display apparatus comprising same
- Patent number 11,803,082
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Yasuhiro Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector having contact array
- Patent number 11,799,225
- Issue date Oct 24, 2023
- Apple Inc.
- George Tziviskos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, composite substrate, and electric device
- Patent number 11,778,747
- Issue date Oct 3, 2023
- Kyocera Corporation
- Toshifumi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 11,765,834
- Issue date Sep 19, 2023
- Samsung Display Co., Ltd.
- In-Su Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240155764
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OPTICAL APPARATUS
- Publication number 20240152008
- Publication date May 9, 2024
- Trivale Technologies
- Takahiro UENO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD
- Publication number 20240147613
- Publication date May 2, 2024
- FICT LIMITED
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147622
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20240121891
- Publication date Apr 11, 2024
- Mitsubishi Electric Corporation
- Takuro SHINADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
- Publication number 20240114615
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20240098900
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun HO HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INVERTER MODULE
- Publication number 20240090114
- Publication date Mar 14, 2024
- LS ELECTRIC CO., LTD.
- Jae Moon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20240080983
- Publication date Mar 7, 2024
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074049
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION CIRCUIT UNIT AND METHOD OF BONDING LEAD PORTIONS AND PRO...
- Publication number 20240074061
- Publication date Feb 29, 2024
- LG ENERGY SOLUTION, LTD.
- Sang Jin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING BATTERY
- Publication number 20240064912
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Chungik LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE
- Publication number 20240028134
- Publication date Jan 25, 2024
- Lite-On Technology Corporation
- SHAN-HUI CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING MODULE
- Publication number 20230422395
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20230413441
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20230397358
- Publication date Dec 7, 2023
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MODULE
- Publication number 20230389188
- Publication date Nov 30, 2023
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387026
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- SEONGHO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MODULE
- Publication number 20230389187
- Publication date Nov 30, 2023
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20230371170
- Publication date Nov 16, 2023
- LG Innotek Co., Ltd.
- Won Seob SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20230371171
- Publication date Nov 16, 2023
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Yuanye Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230354520
- Publication date Nov 2, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Smoking Device Comprising a Rigidised Flexible PCB
- Publication number 20230301347
- Publication date Sep 28, 2023
- JT INTERNATIONAL S.A.
- Kyle Adair
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
PACKAGING STRUCTURE, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20230309237
- Publication date Sep 28, 2023
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- HSIN-YEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230254978
- Publication date Aug 10, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Shuang ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO-OLED DISPLAY MODULE THERMAL MANAGEMENT
- Publication number 20230247861
- Publication date Aug 3, 2023
- Facebook Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY REFLECTIVE PCB
- Publication number 20230240004
- Publication date Jul 27, 2023
- Panasonic Automotive Systems Company of America, Division of Panasonic Corpor...
- EDO OMANOVIC
- B60 - VEHICLES IN GENERAL

Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a substrate with metal reflection layer

Method for manufacturing wiring board with a meandering shape section

Circuit mounted article and device

Fabric-based items with electrical component arrays

Printed wiring board and method for manufacturing printed wiring board

Heatsink with a sandwich plate construction

Solid state relay

Crimp terminal-equipped flexible printed circuit board and method f...

Method for manufacturing a substrate structure with high reflectance

Circuit board assembly and system for communication to an access po...

Electronic device including flexible printed circuit board

Fixing device

Printing device incorporating electronic circuit-board unit includi...

Display device

Stable PCB for solid state light source application

Printed circuit board

Package structure

Device for fixing camera module circuit board, and camera module

Composite wiring board, package, and electronic device

Flexible printed circuit board and display touch apparatus

Electronic device with connector structure

Mechanical energy absorbing bracket apparatus

Circuit board assembly

Low noise capacitors

Power electronics assembly

Stretchable display device

Backlight unit and display apparatus comprising same

Connector having contact array

Wiring board, composite substrate, and electric device

Electronic module and method of manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE

ELECTRO-OPTICAL APPARATUS

MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD

PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED BOARD

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME

INVERTER MODULE

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

PRINTED CIRCUIT BOARD

PROTECTION CIRCUIT UNIT AND METHOD OF BONDING LEAD PORTIONS AND PRO...

ELECTRONIC DEVICE INCLUDING BATTERY

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE

LIGHT-EMITTING MODULE

CIRCUIT BOARD ASSEMBLY

SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY

CONDUCTIVE MODULE

SEMICONDUCTOR PACKAGE

CONDUCTIVE MODULE

CAMERA MODULE

DISPLAY MODULE AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD

Electronic Smoking Device Comprising a Rigidised Flexible PCB

PACKAGING STRUCTURE, LENS MODULE, AND ELECTRONIC DEVICE

DISPLAY DEVICE

MICRO-OLED DISPLAY MODULE THERMAL MANAGEMENT

OPTICALLY REFLECTIVE PCB