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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10Details of semiconductor or other solid state devices to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated circuit for short wavelengths
- Patent number 12,159,841
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Daniel N. Carothers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a die
- Patent number 12,136,587
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
SiC semiconductor device
- Patent number 12,125,882
- Issue date Oct 22, 2024
- Rohm Co., Ltd.
- Toshio Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,113,040
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Tomoyuki Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- Publication number 20240418951
- Publication date Dec 19, 2024
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...
- Publication number 20240421092
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Tobias Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240404883
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240395692
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379579
- Publication date Nov 14, 2024
- Dynax Semiconductor, Inc.
- Yi PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS

Details of semiconductor or other solid state devices to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

3D semiconductor device and structure with logic circuits and memor...

Half-bridge module for an inverter of an electric drive of an elect...

Semiconductor device and temperature measurement method

RF amplifier devices including top side contacts and methods of man...

Semiconductor packages

Heterogeneous integrated circuit for short wavelengths

Silicon carbide composite wafer and manufacturing method thereof

Frame design in embedded die package

Methods for producing a 3D semiconductor memory device and structure

Gallium nitride (GAN) three-dimensional integrated circuit technology

Package including multiple semiconductor devices

Power amplifier modules including semiconductor resistor and tantal...

3D semiconductor device and structure with single-crystal layers

Lead frame for a die

3D semiconductor device and structure with metal layers and memory...

SiC semiconductor device

Semiconductor module with a first substrate, a second substrate and...

Semiconductor device assemblies with molded support substrates

Bonding member for semiconductor device

Package structure with protective lid

Semiconductor device and a method of manufacturing thereof

Encapsulated light emitting diodes for selective fluidic assembly

Package having an electronic component and an encapsulant encapsula...

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor device

Structure of micro light-emitting device and method of transferring...

Power module with graphite plate

Apparatus for stacking substrates and method for the same

Methods for producing a 3D semiconductor device and structure with...

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR PACKAGE

Semiconductor Package

OPTOELECTRONIC SYSTEM

INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

NITRIDE SEMICONDUCTOR MODULE

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Integrated Circuit Packages and Methods

Method for Forming a Semiconductor Device Having TSV Formed Through...

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...