Device type

Industry

CPC
H01L2924/11

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/11Device type

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,882,660
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,553,596
- Issue date Jan 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,032,911
- Issue date Jun 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 10,757,813
- Issue date Aug 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with multiple electronic components
- Patent number 10,573,623
- Issue date Feb 25, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,269,775
- Issue date Apr 23, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral cooling for multi-chip packages
- Patent number 10,147,666
- Issue date Dec 4, 2018
- Xilinx, Inc.
- Stephen M. Trimberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio-frequency device package and method for fabricating the same
- Patent number 9,607,894
- Issue date Mar 28, 2017
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making semiconductor device
- Patent number 9,601,455
- Issue date Mar 21, 2017
- Rohm Co., Ltd.
- Yuto Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency device package and method for fabricating the same
- Patent number 9,425,098
- Issue date Aug 23, 2016
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor device with gel retainer
- Patent number 9,214,402
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kee Cheong Fam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional high surface area electrodes
- Patent number 9,177,933
- Issue date Nov 3, 2015
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240164021
- Publication date May 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230164920
- Publication date May 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210298176
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200359502
- Publication date Nov 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE EL...
- Publication number 20200152607
- Publication date May 14, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200120804
- Publication date Apr 16, 2020
- ASE Embedded Electronics Inc.
- Chien-Fan CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180219004
- Publication date Aug 2, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
- Publication number 20180061809
- Publication date Mar 1, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE
- Publication number 20160005708
- Publication date Jan 7, 2016
- ROHM CO., LTD.
- Yuto NISHIYAMA
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR DEVICE WITH GEL RETAINER
- Publication number 20150200180
- Publication date Jul 16, 2015
- Kee Cheong Fam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES
- Publication number 20150187718
- Publication date Jul 2, 2015
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150162267
- Publication date Jun 11, 2015
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES
- Publication number 20140167257
- Publication date Jun 19, 2014
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140070346
- Publication date Mar 13, 2014
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS

Device type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Electronic package structure with multiple electronic components

Semiconductor device and method for manufacturing semiconductor device

Lateral cooling for multi-chip packages

Radio-frequency device package and method for fabricating the same

Semiconductor device and method for making semiconductor device

Radio-frequency device package and method for fabricating the same

Pressure sensor device with gel retainer

Three-dimensional high surface area electrodes

Patents Applicationslast 30 patents

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE EL...

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE

PRESSURE SENSOR DEVICE WITH GEL RETAINER

THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES

RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

FABRICATION OF THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES

RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME