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MICROELECTRONIC ASSEMBLIES
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Publication number 20250096194
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Publication date Mar 20, 2025
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Intel Corporation
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Shawna M. Liff
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGING STRUCTURE AND PACKAGING METHOD
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Publication number 20250079391
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Publication date Mar 6, 2025
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Semiconductor Manufacturing International (Shanghai) Corporation
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Jisong JIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250062252
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Publication date Feb 20, 2025
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Samsung Electronics Co., Ltd.
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Jaeean LEE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250046728
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Publication date Feb 6, 2025
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Samsung Electronics Co., Ltd.
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Dongwon KANG
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250046769
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Publication date Feb 6, 2025
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Samsung Electronics Co., Ltd.
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Jooyoung CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250046741
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Publication date Feb 6, 2025
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RENESAS ELECTRONICS CORPORATION
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Keita TSUCHIYA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250038094
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Publication date Jan 30, 2025
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Samsung Electronics Co., Ltd.
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Joongsun KIM
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL INTERCONNECT BRIDGE
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Publication number 20250038114
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Publication date Jan 30, 2025
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Intel Corporation
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Srinivas V. Pietambaram
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH-FREQUENCY MODULE
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Publication number 20250022817
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Publication date Jan 16, 2025
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MURATA MANUFACTURING CO., LTD.
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Tetsurou ASHIDA
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H01 - BASIC ELECTRIC ELEMENTS