Dielectric layers

Industry

CPC
H05K2201/0183

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0183Dielectric layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low dielectric resin composition, molded article, film, multilayer...
- Patent number 11,993,740
- Issue date May 28, 2024
- Kaneka Corporation
- Yuichi Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device with edge bond dam
- Patent number 11,765,836
- Issue date Sep 19, 2023
- Xilinx, Inc.
- Bhavesh Patel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,737,209
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Add-in card connector edge finger optimization for high-speed signa...
- Patent number 11,683,887
- Issue date Jun 20, 2023
- Dell Products L.P.
- Malikarjun Vasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing embedded circuit board, embedded circuit b...
- Patent number 11,632,861
- Issue date Apr 18, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,612,057
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method for manufacturing the same
- Patent number 11,606,862
- Issue date Mar 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Po-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical integration device
- Patent number 11,487,129
- Issue date Nov 1, 2022
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Jia-Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,470,720
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a dielectric element placed in a cavity and...
- Patent number 11,445,612
- Issue date Sep 13, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick Lenhardt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device comprising multi-directional antennas coupled through a flex...
- Patent number 11,399,435
- Issue date Jul 26, 2022
- QUALCOMM Incorporated
- Jaehyun Yeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate equipped with antenna and antenna module
- Patent number 11,322,830
- Issue date May 3, 2022
- Murata Manufacturing Co., Ltd.
- Yoshitaka Echikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board biosensing garment connector
- Patent number 11,101,586
- Issue date Aug 24, 2021
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Thierry Dumont
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 10,939,551
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 10,757,816
- Issue date Aug 25, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit assemblies and related methods
- Patent number 10,631,398
- Issue date Apr 21, 2020
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric composite and uses thereof
- Patent number 10,575,401
- Issue date Feb 25, 2020
- Taiwan Union Technology Corporation
- Shur-Fen Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a high-current printed circuit board
- Patent number 10,561,026
- Issue date Feb 11, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board biosensing garment connector
- Patent number 10,530,083
- Issue date Jan 7, 2020
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Thierry Dumont
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Via fill substrate, production method therefor, and precursor therefor
- Patent number 10,517,178
- Issue date Dec 24, 2019
- Mitsuboshi Belting Ltd.
- Osamu Mamezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 10,492,309
- Issue date Nov 26, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit assemblies and related methods
- Patent number 10,368,432
- Issue date Jul 30, 2019
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compensating for intra-pair skew in differential signaling
- Patent number 10,349,514
- Issue date Jul 9, 2019
- Fujitsu Limited
- Yasuo Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal coating materials
- Patent number 10,257,940
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Sarah K. Czaplewski
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 10,165,682
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assemblies and related methods
- Patent number 9,999,122
- Issue date Jun 12, 2018
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 9,961,767
- Issue date May 1, 2018
- SHINKO ELECTRIC INDUSTIRES CO., LTD.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation film and method for making insulation film
- Patent number 9,942,989
- Issue date Apr 10, 2018
- Illinois Tool Works Inc.
- Hongchuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,775,237
- Issue date Sep 26, 2017
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CARRIER BOARD
- Publication number 20240292517
- Publication date Aug 29, 2024
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Build UP Film Curable Compositions
- Publication number 20240174802
- Publication date May 30, 2024
- AGC Multi Material America, Inc.
- Preeya Kuray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UWB BANDPASS FILTER
- Publication number 20240120630
- Publication date Apr 11, 2024
- HELLA GmbH & Co. KGaA
- Joerg SCHRAPE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230397338
- Publication date Dec 7, 2023
- TDK Corporation
- Atsuhiro TSUYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH EDGE BOND DAM
- Publication number 20230240020
- Publication date Jul 27, 2023
- Xilinx, Inc.
- Bhavesh PATEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20230209730
- Publication date Jun 29, 2023
- Murata Manufacturing Co., Ltd.
- Norikazu FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADD-IN CARD CONNECTOR EDGE FINGER OPTIMIZATION FOR HIGH-SPEED SIGNA...
- Publication number 20230025833
- Publication date Jan 26, 2023
- Dell Products L.P.
- Malikarjun Vasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME
- Publication number 20220369467
- Publication date Nov 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- PO-YUAN CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220279648
- Publication date Sep 1, 2022
- SHENNAN CIRCUITS CO., LTD.
- LIXIANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220240369
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...
- Publication number 20210345492
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A FLEXIBLE ELECTRONICS ASSEMBLY
- Publication number 20210315099
- Publication date Oct 7, 2021
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Dielectric Element Placed in a Cavity and...
- Publication number 20210307173
- Publication date Sep 30, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick Lenhardt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE EQUIPPED WITH ANTENNA AND ANTENNA MODULE
- Publication number 20200350667
- Publication date Nov 5, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshitaka ECHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PANEL-MOLDED ELECTRONIC ASSEMBLIES
- Publication number 20200253060
- Publication date Aug 6, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20200245463
- Publication date Jul 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD BIOSENSING GARMENT CONNECTOR
- Publication number 20200112116
- Publication date Apr 9, 2020
- Honeywell Safety Products USA, Inc.
- Thierry DUMONT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DIELECTRIC COMPOSITE AND USES THEREOF
- Publication number 20200053877
- Publication date Feb 13, 2020
- Taiwan Union Technology Corporation
- Shur-Fen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20200045815
- Publication date Feb 6, 2020
- Canon Kabushiki Kaisha
- Takehiro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Assemblies And Related Methods
- Publication number 20190350075
- Publication date Nov 14, 2019
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD
- Publication number 20190289726
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...
- Publication number 20190098756
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXOTHERMIC REACTION ELECTRODE STRUCTURE USING PCB AND SEMICONDUCTOR...
- Publication number 20190098760
- Publication date Mar 28, 2019
- IH IP Holdings Limited
- Joseph A. Murray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190069417
- Publication date Feb 28, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- G11 - INFORMATION STORAGE
Information Patent Application
Circuit Assemblies And Related Methods
- Publication number 20180295713
- Publication date Oct 11, 2018
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Fill Substrate, Production Method Therefor, and Precursor Therefor
- Publication number 20180249581
- Publication date Aug 30, 2018
- MITSUBOSHI BELTING LTD.
- Osamu Mamezaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD BIOSENSING GARMENT CONNECTOR
- Publication number 20180138616
- Publication date May 17, 2018
- OMsignal Inc.
- Thierry DUMONT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT ASSEMBLIES AND RELATED METHODS
- Publication number 20180042103
- Publication date Feb 8, 2018
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170231100
- Publication date Aug 10, 2017
- ICHIA TECHNOLOGIES,INC.
- Yung-Hsiang SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectric layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low dielectric resin composition, molded article, film, multilayer...

Integrated circuit device with edge bond dam

Panel-molded electronic assemblies

Circuit board and manufacturing method thereof and electronic device

Add-in card connector edge finger optimization for high-speed signa...

Method for manufacturing embedded circuit board, embedded circuit b...

Opening in the pad for bonding integrated passive device in InFO pa...

Circuit board, method for manufacturing the same

Optical integration device

Opening in the pad for bonding integrated passive device in InFO pa...

Component carrier with a dielectric element placed in a cavity and...

Device comprising multi-directional antennas coupled through a flex...

Substrate equipped with antenna and antenna module

Printed circuit board biosensing garment connector

Opening in the pad for bonding integrated passive device in InFO pa...

Panel-molded electronic assemblies

Circuit assemblies and related methods

Dielectric composite and uses thereof

Method for manufacturing a high-current printed circuit board

Printed circuit board biosensing garment connector

Via fill substrate, production method therefor, and precursor therefor

Printed circuit board and method for manufacturing the same

Circuit assemblies and related methods

Compensating for intra-pair skew in differential signaling

Conformal coating materials

Opening in the pad for bonding integrated passive device in InFO pa...

Circuit assemblies and related methods

Circuit board and method of manufacturing circuit board

Insulation film and method for making insulation film

Wiring substrate and method for manufacturing the same

Patents Applicationslast 30 patents

CIRCUIT CARRIER BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Build UP Film Curable Compositions

UWB BANDPASS FILTER

ELECTRONIC COMPONENT

INTEGRATED CIRCUIT DEVICE WITH EDGE BOND DAM

MULTILAYER DIELECTRIC SUBSTRATE AND METHOD FOR MANUFACTURING MULTIL...

ADD-IN CARD CONNECTOR EDGE FINGER OPTIMIZATION FOR HIGH-SPEED SIGNA...

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...

METHOD OF FORMING A FLEXIBLE ELECTRONICS ASSEMBLY

Component Carrier With a Dielectric Element Placed in a Cavity and...

SUBSTRATE EQUIPPED WITH ANTENNA AND ANTENNA MODULE

PANEL-MOLDED ELECTRONIC ASSEMBLIES

CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS

PRINTED CIRCUIT BOARD BIOSENSING GARMENT CONNECTOR

DIELECTRIC COMPOSITE AND USES THEREOF

CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

Circuit Assemblies And Related Methods

METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD

Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...

EXOTHERMIC REACTION ELECTRODE STRUCTURE USING PCB AND SEMICONDUCTOR...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Circuit Assemblies And Related Methods

Via Fill Substrate, Production Method Therefor, and Precursor Therefor

PRINTED CIRCUIT BOARD BIOSENSING GARMENT CONNECTOR

CIRCUIT ASSEMBLIES AND RELATED METHODS

CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME