Dielectric or adhesive layers comprising a plurality of layers

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CPC
H05K2201/0195

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,127,343
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for reducing power noise and electronic devic...
- Patent number 12,108,523
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Kwangmo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board comprising via portions
- Patent number 12,089,329
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure surface modifications by passivating agents
- Patent number 12,036,578
- Issue date Jul 16, 2024
- Intel Corporation
- Florian Gstrein
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 12,035,461
- Issue date Jul 9, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Coating for electrical components of surgical devices
- Patent number 12,016,124
- Issue date Jun 18, 2024
- Covidien LP
- David N. Fowler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,974,389
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Materials for printed circuit boards
- Patent number 11,930,596
- Issue date Mar 12, 2024
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor module including the same
- Patent number 11,903,145
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seung-Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate integrated waveguide transition including an impedance tr...
- Patent number 11,894,595
- Issue date Feb 6, 2024
- Waymo LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned glass layers in electronic devices
- Patent number 11,864,304
- Issue date Jan 2, 2024
- Apple Inc.
- James R. Wilson
- G02 - OPTICS
Information Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
- Patent number 11,840,047
- Issue date Dec 12, 2023
- Taiwan Union Technology Corporation
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate and manufacturing method of the same
- Patent number 11,818,838
- Issue date Nov 14, 2023
- Taiwan Union Technology Corporation
- Wen-Ren Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,812,556
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated passive component
- Patent number 11,800,635
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Jyou Kikura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
- Publication number 20240343027
- Publication date Oct 17, 2024
- LG ELECTRONICS INC.
- Takashi KINO
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
- Publication number 20230317614
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR PRINTED CIRCUIT BOARDS
- Publication number 20230309221
- Publication date Sep 28, 2023
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN SHEET AND PRINTED WIRING BOARD
- Publication number 20230257576
- Publication date Aug 17, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Eiichiro SAITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230262890
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20230247759
- Publication date Aug 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...
- Publication number 20230239997
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230156918
- Publication date May 18, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepregs and Laminates Having a UV Curable Resin Layer
- Publication number 20230127186
- Publication date Apr 27, 2023
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Application
Substrate Integrated Waveguide Transition
- Publication number 20230107707
- Publication date Apr 6, 2023
- WAYMO LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...
- Publication number 20230084535
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Kwangmo YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CERAMIC CARRIER SUBSTRATE AND POWER MODULE
- Publication number 20230051374
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230046699
- Publication date Feb 16, 2023
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220418106
- Publication date Dec 29, 2022
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM
- Publication number 20220256696
- Publication date Aug 11, 2022
- WUHAN TIANMA MICRO-ELECTRONICS CO.,LTD.
- Di LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectric or adhesive layers comprising a plurality of layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board structure

Flexible circuit board with thermally conductive connection to a he...

Printed circuit board

Printed circuit board for reducing power noise and electronic devic...

Flexible and stretchable structures

Printed circuit board comprising via portions

Interconnect structure surface modifications by passivating agents

Low dielectric substrate for high-speed millimeter-wave communication

Ceramic carrier substrate and power module

Ceramic electronic component

Coating for electrical components of surgical devices

Thermosetting resin composition, resin sheet, laminate, and printed...

Protection tape for printed circuit board and display device includ...

Low dielectric substrate for high-speed millimeter-wave communication

Circuit signal enhancement method of circuit board and structure th...

Circuit material and circuit board containing the same

Materials for printed circuit boards

Method for manufacturing multilayer substrate and multilayer substrate

Low cost panel AESA with thermal management

Wiring board and semiconductor module including the same

Circuit board structure

Substrate integrated waveguide transition including an impedance tr...

Application of electrical conductors of a solar cell

Patterned glass layers in electronic devices

Metal-clad laminate, printed circuit board, and method for manufact...

Application of electrical conductors to an electrically insulating...

Metal-clad laminate and manufacturing method of the same

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Printed circuit board and manufacturing method thereof

Integrated passive component

Patents Applicationslast 30 patents

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARD

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...

MATERIALS FOR PRINTED CIRCUIT BOARDS

THERMOSETTING RESIN SHEET AND PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE

Prepregs and Laminates Having a UV Curable Resin Layer

Substrate Integrated Waveguide Transition

PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...

CERAMIC CARRIER SUBSTRATE AND POWER MODULE

CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM