Dielectric or adhesive layers comprising a plurality of layers

Industry

CPC
H05K2201/0195

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,974,389
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Materials for printed circuit boards
- Patent number 11,930,596
- Issue date Mar 12, 2024
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor module including the same
- Patent number 11,903,145
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seung-Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate integrated waveguide transition including an impedance tr...
- Patent number 11,894,595
- Issue date Feb 6, 2024
- Waymo LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned glass layers in electronic devices
- Patent number 11,864,304
- Issue date Jan 2, 2024
- Apple Inc.
- James R. Wilson
- G02 - OPTICS
Information Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
- Patent number 11,840,047
- Issue date Dec 12, 2023
- Taiwan Union Technology Corporation
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate and manufacturing method of the same
- Patent number 11,818,838
- Issue date Nov 14, 2023
- Taiwan Union Technology Corporation
- Wen-Ren Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,812,556
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated passive component
- Patent number 11,800,635
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Jyou Kikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned bonded glass layers in electronic devices
- Patent number 11,696,397
- Issue date Jul 4, 2023
- Apple Inc.
- James R. Wilson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil and method for manufacturing the same
- Patent number 11,688,553
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,678,432
- Issue date Jun 13, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fibrillated liquid crystal polymer powder, method of producing fibr...
- Patent number 11,646,127
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Hiroyuki Ohata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer magneto-dielectric material
- Patent number 11,626,228
- Issue date Apr 11, 2023
- ROGERS CORPORATION
- Karl E. Sprentall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a double-sided laminate including dry milli...
- Patent number 11,617,270
- Issue date Mar 28, 2023
- Gentherm Incorporated
- Michael Peter Ciaccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
- Publication number 20230317614
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR PRINTED CIRCUIT BOARDS
- Publication number 20230309221
- Publication date Sep 28, 2023
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN SHEET AND PRINTED WIRING BOARD
- Publication number 20230257576
- Publication date Aug 17, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Eiichiro SAITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230262890
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20230247759
- Publication date Aug 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...
- Publication number 20230239997
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230156918
- Publication date May 18, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepregs and Laminates Having a UV Curable Resin Layer
- Publication number 20230127186
- Publication date Apr 27, 2023
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Application
Substrate Integrated Waveguide Transition
- Publication number 20230107707
- Publication date Apr 6, 2023
- WAYMO LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...
- Publication number 20230084535
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Kwangmo YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CERAMIC CARRIER SUBSTRATE AND POWER MODULE
- Publication number 20230051374
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230046699
- Publication date Feb 16, 2023
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220418106
- Publication date Dec 29, 2022
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM
- Publication number 20220256696
- Publication date Aug 11, 2022
- WUHAN TIANMA MICRO-ELECTRONICS CO.,LTD.
- Di LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20220248526
- Publication date Aug 4, 2022
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232695
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20220232697
- Publication date Jul 21, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YONG-CHAO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Patterned Glass Layers in Electronic Devices
- Publication number 20220232698
- Publication date Jul 21, 2022
- Apple Inc.
- James R. Wilson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Substrate Integrated Waveguide Transition
- Publication number 20220209385
- Publication date Jun 30, 2022
- WAYMO LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20220210925
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Seung-Yeol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20220167500
- Publication date May 26, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YONG-CHAO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE AND MULTILAYER SUBSTRATE
- Publication number 20220141966
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210392758
- Publication date Dec 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL LAMINATED CIRCUIT BOARDS FOR IMPROVED ELECTRICAL PERFO...
- Publication number 20210385948
- Publication date Dec 9, 2021
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectric or adhesive layers comprising a plurality of layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low dielectric substrate for high-speed millimeter-wave communication

Circuit signal enhancement method of circuit board and structure th...

Circuit material and circuit board containing the same

Materials for printed circuit boards

Method for manufacturing multilayer substrate and multilayer substrate

Low cost panel AESA with thermal management

Wiring board and semiconductor module including the same

Circuit board structure

Substrate integrated waveguide transition including an impedance tr...

Application of electrical conductors of a solar cell

Patterned glass layers in electronic devices

Metal-clad laminate, printed circuit board, and method for manufact...

Application of electrical conductors to an electrically insulating...

Metal-clad laminate and manufacturing method of the same

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Printed circuit board and manufacturing method thereof

Integrated passive component

Method for applying a pattern to a substrate

Patterned bonded glass layers in electronic devices

Multilayer printed wiring board and method of manufacturing the same

Multilayer coil and method for manufacturing the same

Low dielectric substrate for high-speed millimeter-wave communication

Resin substrate and method for manufacturing resin substrate

Ceramic electronic component

Fibrillated liquid crystal polymer powder, method of producing fibr...

Ceramic electronic component

Multi-layer magneto-dielectric material

Circuit board and method for manufacturing the same

Method of manufacturing a double-sided laminate including dry milli...

Ultra-thin embedded semiconductor device package and method of manu...

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...

MATERIALS FOR PRINTED CIRCUIT BOARDS

THERMOSETTING RESIN SHEET AND PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE

Prepregs and Laminates Having a UV Curable Resin Layer

Substrate Integrated Waveguide Transition

PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...

CERAMIC CARRIER SUBSTRATE AND POWER MODULE

CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...

Patterned Glass Layers in Electronic Devices

Substrate Integrated Waveguide Transition

WIRING BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME

CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...

METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE AND MULTILAYER SUBSTRATE

THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ASYMMETRICAL LAMINATED CIRCUIT BOARDS FOR IMPROVED ELECTRICAL PERFO...