Dielectrics

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CPC
H05K2201/01

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/01Dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,219,692
- Issue date Feb 4, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 12,207,419
- Issue date Jan 21, 2025
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room-temperature-curable polybutadiene resin composition, method fo...
- Patent number 12,202,930
- Issue date Jan 21, 2025
- Shin-Etsu Chemical Co., Ltd.
- Akitsugu Fujiwara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film, wiring board, and method for manufacturing wiring board
- Patent number 12,202,941
- Issue date Jan 21, 2025
- FUJIFILM Corporation
- Shohei Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly with reduced height and reduced width, camer...
- Patent number 12,207,396
- Issue date Jan 21, 2025
- Rayprus Technology (Foshan) Co., Ltd.
- Han-Ru Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board and printed circuit...
- Patent number 12,200,873
- Issue date Jan 14, 2025
- ACULON INC.
- Eric Lee Hanson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring structure, display substrate and display device
- Patent number 12,193,154
- Issue date Jan 7, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhifeng Zhan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Planar transformer isolation circuit for an X-ray source
- Patent number 12,193,135
- Issue date Jan 7, 2025
- Moxtek, Inc.
- David Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal clad laminate and production method thereof
- Patent number 12,172,408
- Issue date Dec 24, 2024
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing conductive member for touch panel and condu...
- Patent number 12,175,050
- Issue date Dec 24, 2024
- FUJIFILM Corporation
- Takato Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,162,138
- Issue date Dec 10, 2024
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE
- Publication number 20250034424
- Publication date Jan 30, 2025
- FUJIFILM CORPORATION
- Miyoko HARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040054
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...
- Publication number 20250040043
- Publication date Jan 30, 2025
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE ESTER RESIN
- Publication number 20250026883
- Publication date Jan 23, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031306
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250031301
- Publication date Jan 23, 2025
- Avary Holding (Shenzhen) Co., Ltd.
- Hao-Wen ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...
- Publication number 20250031314
- Publication date Jan 23, 2025
- SAFRAN
- Rabih KHAZAKA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ULTRAVIOLET-CURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, INSULATIN...
- Publication number 20250026917
- Publication date Jan 23, 2025
- PELNOX, LTD.
- Kazuki KIMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250024601
- Publication date Jan 16, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME
- Publication number 20250023223
- Publication date Jan 16, 2025
- QuantumZ Inc.
- Kun Yen TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIODEGRADABLE COMPOSITE MATERIAL
- Publication number 20250019505
- Publication date Jan 16, 2025
- CTK RESEARCH AND DEVELOPMENT CANADA LTD.
- Jitendra Panda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250016931
- Publication date Jan 9, 2025
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
- Publication number 20250016919
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Motoki MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS
- Publication number 20250008654
- Publication date Jan 2, 2025
- Corning Incorporated
- Sean Matthew Garner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRODE AND CABLE STRUCTURE
- Publication number 20250008643
- Publication date Jan 2, 2025
- Board of Regents, The University of Texas System
- Negar Geramifard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250008647
- Publication date Jan 2, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...
- Publication number 20240431020
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kwangmo YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fuse and Method of Fabricating the Same
- Publication number 20240429013
- Publication date Dec 26, 2024
- LG ENERGY SOLUTION, LTD.
- Chang Bog Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...
- Publication number 20240431016
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Joohan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Circuit board

Method for manufacturing dielectric sheet, method for manufacturing...

Fold flex circuit for LNOP

Room-temperature-curable polybutadiene resin composition, method fo...

Film, wiring board, and method for manufacturing wiring board

Circuit board assembly with reduced height and reduced width, camer...

Circuit board structure

Method of manufacturing a printed circuit board and printed circuit...

Wiring structure, display substrate and display device

Planar transformer isolation circuit for an X-ray source

Flexible wiring board

Rigid flexible printed circuit board and electronic device comprisi...

Printed circuit board having embedded component

Flexible circuit board and manufacturing method thereof

Copper-clad laminate and method of forming the same

Metal clad laminate and production method thereof

Insulating resin circuit substrate

Electrically conductive film

Heat-dissipating circuit board, heat-dissipating member, and produc...

Circuit board and manufacturing method thereof and electronic device

Method of forming a flexible electronics assembly

Method of manufacturing conductive member for touch panel and condu...

High-frequency circuit and communication module

Method for manufacturing a ceramic copper circuit board

Systems, devices, and methods for robotic end effectors

Multilayer substrate

Curable resin, curable resin composition, and cured product

Wiring board and method for manufacturing wiring board

Film-closure apparatus for plastic film material, printed circuit b...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

FILM AND LAMINATE

TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

Printed Circuits with Embedded Resistive Thermal Devices

CAMERA MODULE

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

ACTIVE ESTER RESIN

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...

ULTRAVIOLET-CURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, INSULATIN...

PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED WIRING BOARD

ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME

BIODEGRADABLE COMPOSITE MATERIAL

FLEXIBLE AND STRETCHABLE STRUCTURES

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...

METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

INTEGRATED ELECTRODE AND CABLE STRUCTURE

MULTILAYER SUBSTRATE

PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...

Fuse and Method of Fabricating the Same

PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF