Dielectrics

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CPC
H05K2201/01

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/01Dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuse element
- Patent number 12,362,123
- Issue date Jul 15, 2025
- Autonetworks Technologies, Ltd.
- Misato Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composites for high-frequency printed circuit boards and methods of...
- Patent number 12,356,544
- Issue date Jul 8, 2025
- Corning Incorporated
- Dayue Jiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hydrophobic low-dielectric-constant film and preparation method the...
- Patent number 12,351,911
- Issue date Jul 8, 2025
- JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polyimide resin precursor, polyimide resin, metal-clad laminated bo...
- Patent number 12,351,684
- Issue date Jul 8, 2025
- Arisawa MFG. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated assembly comprising radio-frequency interface board
- Patent number 12,356,539
- Issue date Jul 8, 2025
- AGC GLASS EUROPE
- Mohsen Yousefbeiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,349,269
- Issue date Jul 1, 2025
- Toray Industries, Inc.
- Ryutaro Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of a curved electronic device using differential heatin...
- Patent number 12,349,272
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dynamic pattern transfer printing and pattern transfer sheets with...
- Patent number 12,337,608
- Issue date Jun 24, 2025
- Wuhan DR Laser Technology Corp., LTD
- Amir Noy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prepregs and laminates having a UV curable resin layer
- Patent number 12,336,103
- Issue date Jun 17, 2025
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer board and method of manufacturing the same
- Patent number 12,336,093
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric, copper clad laminate, circuit board, method for manufac...
- Patent number 12,336,096
- Issue date Jun 17, 2025
- Nippon Pillar Packing Co., Ltd.
- Manami Noda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Asymmetrical laminated circuit boards for improved electrical perfo...
- Patent number 12,328,816
- Issue date Jun 10, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aerosol generating device
- Patent number 12,317,923
- Issue date Jun 3, 2025
- KT & G Corporation
- Tae Hun Kim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Connection structure and connection structure manufacturing method
- Patent number 12,324,098
- Issue date Jun 3, 2025
- Murata Manufacturing Co., Ltd.
- Yuma Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesive film and flexible printed circuit board
- Patent number 12,312,510
- Issue date May 27, 2025
- MEKTEC CORPORATION
- Hisae Oba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device
- Patent number 12,317,430
- Issue date May 27, 2025
- IRISO ELECTRONICS CO., LTD.
- Yujiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate, single-sided metal-clad laminated sheet, and multi-layer...
- Patent number 12,309,919
- Issue date May 20, 2025
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 12,309,925
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surge protection module
- Patent number 12,309,986
- Issue date May 20, 2025
- CYBER POWER SYSTEMS, INC.
- Ho-Hsien Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 12,297,354
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,295,098
- Issue date May 6, 2025
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...
- Publication number 20250240871
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Deborah COGONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...
- Publication number 20250230550
- Publication date Jul 17, 2025
- Kaneka Corporation
- Takashi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC AND METHOD FOR PRODUCING SAME
- Publication number 20250230289
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...
- Publication number 20250234458
- Publication date Jul 17, 2025
- Resonac Corporation
- Takayo KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250227846
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE SUPPORT WITH PRINTED HEATER
- Publication number 20250227851
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Melvin Verbaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMI...
- Publication number 20250215153
- Publication date Jul 3, 2025
- UBE Corporation
- Kosuke YAMAJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate for a Printed Circuit Board
- Publication number 20250212325
- Publication date Jun 26, 2025
- Ticona LLC
- Xiaowei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Module
- Publication number 20250203758
- Publication date Jun 19, 2025
- Nippon Telegraph and Telephone Corporation
- Josuke Ozaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20250203772
- Publication date Jun 19, 2025
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
- Publication number 20250188302
- Publication date Jun 12, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194004
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250185162
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES
- Publication number 20250185163
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG AND USES OF THE SAME
- Publication number 20250176100
- Publication date May 29, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT SENSOR FOR PRINTED CIRCUIT BOARD
- Publication number 20250172641
- Publication date May 29, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yongshun SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT...
- Publication number 20250168991
- Publication date May 22, 2025
- Aculon, Inc.
- ERIC LEE HANSON
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPL...
- Publication number 20250163218
- Publication date May 22, 2025
- UBE Corporation
- Taiga ADACHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250159793
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Meng-Jen WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
- Publication number 20250154395
- Publication date May 15, 2025
- ZACROS Corporation
- Tadahiro NOMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250151201
- Publication date May 8, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Unit Capable of Suppressing an Increase in Size...
- Publication number 20250142739
- Publication date May 1, 2025
- HITACHI ASTEMO, LTD.
- Tomohiro FUKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...
- Publication number 20250136805
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Xinwen WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS FILM AND COPPER CLAD LAMINATE
- Publication number 20250129212
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Li-Ting HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Fuse element

Composites for high-frequency printed circuit boards and methods of...

Hydrophobic low-dielectric-constant film and preparation method the...

Polyimide resin precursor, polyimide resin, metal-clad laminated bo...

Laminated assembly comprising radio-frequency interface board

Recyclable electronic device

Apparatus, system, and method for achieving certain characteristics...

Low cost, low loss material for microwave or antenna printed circui...

Wiring board

Manufacture of a curved electronic device using differential heatin...

Dynamic pattern transfer printing and pattern transfer sheets with...

Prepregs and laminates having a UV curable resin layer

Multilayer board and method of manufacturing the same

Dielectric, copper clad laminate, circuit board, method for manufac...

Asymmetrical laminated circuit boards for improved electrical perfo...

Aerosol generating device

Connection structure and connection structure manufacturing method

Semiconductor storage device including staggered semiconductor memo...

Copper clad laminate film and electronic device including same

Adhesive film and flexible printed circuit board

Preparation method for copper clad laminate having low dielectric c...

Electronic package and method of manufacturing the same

Electrical device

Laminate, single-sided metal-clad laminated sheet, and multi-layer...

Display panel and display device including the same

Surge protection module

Resin composition, copper foil with resin, dielectric layer, copper...

Multilayer board and manufacturing method thereof

Component carrier with partially metallized hole using anti-plating...

Patents Applicationslast 30 patents

DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...

METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...

DIELECTRIC AND METHOD FOR PRODUCING SAME

METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...

WIRING BOARD

SUBSTRATE SUPPORT WITH PRINTED HEATER

POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMI...

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

Laminate for a Printed Circuit Board

Optical Module

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

WIRING BOARD

ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES

PREPREG AND USES OF THE SAME

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

CURRENT SENSOR FOR PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT...

POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPL...

ELECTRONIC DEVICE

ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE

FLEXIBLE AND STRETCHABLE STRUCTURES

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

Electronic Control Unit Capable of Suppressing an Increase in Size...

COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...

MASKING METHOD AND MASKED PRODUCT

POROUS FILM AND COPPER CLAD LAMINATE