Dielectrics

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CPC
H05K2201/01

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/01Dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,162,138
- Issue date Dec 10, 2024
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,134,682
- Issue date Nov 5, 2024
- ELITE MATERIAL CO., LTD.
- Tse-Hung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lighting system with lens assembly
- Patent number 12,129,990
- Issue date Oct 29, 2024
- KORRUS, INC.
- Ariel Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,127,343
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aerosol generating device and method for controlling same
- Patent number 12,108,802
- Issue date Oct 8, 2024
- KT & G Corporation
- Hun Il Lim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 12,108,521
- Issue date Oct 1, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for reducing power noise and electronic devic...
- Patent number 12,108,523
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Kwangmo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preventing liquid ingress in a device
- Patent number 12,101,887
- Issue date Sep 24, 2024
- Koninklijke Philips N.V.
- Marinus Arnoldus Martinus Vugts
- F21 - LIGHTING
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICA GLASS SUBSTRATE
- Publication number 20240407089
- Publication date Dec 5, 2024
- AGC Inc.
- Kent SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407090
- Publication date Dec 5, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...
- Publication number 20240397604
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSERPENTINES AND ELECTRODES FOR STRETCHABLE AND CONFORMABLE BIO...
- Publication number 20240355504
- Publication date Oct 24, 2024
- University of Central Florida Research Foundation, Inc.
- Swaminathan RAJARAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION
- Publication number 20240357735
- Publication date Oct 24, 2024
- LG ENERGY SOLUTION, LTD.
- Young Joong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...
- Publication number 20240343866
- Publication date Oct 17, 2024
- TAMURA CORPORATION
- Taiki ENDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
- Publication number 20240343027
- Publication date Oct 17, 2024
- LG ELECTRONICS INC.
- Takashi KINO
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT
- Publication number 20240341031
- Publication date Oct 10, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Glass Bubbles and Articles Therefrom
- Publication number 20240327270
- Publication date Oct 3, 2024
- 3M Innovative Properties Company
- Yong K. Wu
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PHOTOIMAGABLE DIELECTRICS
- Publication number 20240317940
- Publication date Sep 26, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Nora Sabina Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...
- Publication number 20240314938
- Publication date Sep 19, 2024
- UNEO INC.
- Chih-Sheng HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
SURGE PROTECTION MODULE
- Publication number 20240306355
- Publication date Sep 12, 2024
- HO-HSIEN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-frequency circuit and communication module

Method for manufacturing a ceramic copper circuit board

Systems, devices, and methods for robotic end effectors

Multilayer substrate

Curable resin, curable resin composition, and cured product

Wiring board and method for manufacturing wiring board

Film-closure apparatus for plastic film material, printed circuit b...

Camera module having a soldering portion coupling a driving device...

Circuit board structure

Resin composition and article made therefrom

Printed circuits with embedded resistive thermal devices

Lighting system with lens assembly

Resin composition, resin sheet, multilayer printed wiring board, an...

Insulated circuit substrate manufacturing method

Flexible circuit board with thermally conductive connection to a he...

Semi-flex component carrier with dielectric material surrounding an...

Printed circuit board

Resin multilayer substrate and method for manufacturing resin multi...

Reel mechanism and winding device for flexible copper clad laminate

Multi-dielectric printed circuit board

Electronic component embedded substrate

Aerosol generating device and method for controlling same

Multi-layer printed circuit board made of different materials and m...

Circuit board and electronic device

Printed circuit board for reducing power noise and electronic devic...

Bent laminated printed circuit board

Circuit board and manufacturing method therefor

Preventing liquid ingress in a device

Flexible circuit board

Nanocomposite material for ultraviolet curable direct write semicon...

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICA GLASS SUBSTRATE

FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

Flexible Hybrid Interconnect Circuits

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

MICROSERPENTINES AND ELECTRODES FOR STRETCHABLE AND CONFORMABLE BIO...

FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

Transparent Conductive Film

POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...

ELECTRONIC DEVICE

COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

Glass Bubbles and Articles Therefrom

PHOTOIMAGABLE DIELECTRICS

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

SURGE PROTECTION MODULE