Differences between the conductors of different layers of a multilayer

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H05K2201/0352

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0352Differences between the conductors of different layers of a multilayer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer-multi-turn structure for high efficiency wireless commu...
- Patent number 11,916,400
- Issue date Feb 27, 2024
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer-multi-turn structure for high efficiency wireless commu...
- Patent number 11,476,566
- Issue date Oct 18, 2022
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer, multi-turn inductor structure for wireless transfer of...
- Patent number 11,336,003
- Issue date May 17, 2022
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having a multi-layer-multi-turn antenna with frequency
- Patent number 11,335,999
- Issue date May 17, 2022
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer, multi-turn inductor structure for wireless transfer of...
- Patent number 11,296,402
- Issue date Apr 5, 2022
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and method for manufacturing the same
- Patent number 11,234,331
- Issue date Jan 25, 2022
- HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor and method of manufacturing the same
- Patent number 10,886,037
- Issue date Jan 5, 2021
- Alps Alpine Co., Ltd.
- Yui Abe
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Component carrier with different surface finishes
- Patent number 10,806,027
- Issue date Oct 13, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductor structure and display device
- Patent number 10,756,121
- Issue date Aug 25, 2020
- Innolux Corporation
- Ming-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and method for manufacturing the same
- Patent number 10,631,406
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 10,559,534
- Issue date Feb 11, 2020
- Industrial Technology Research Institute
- Sheng-Che Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating tamper-respondent sensor
- Patent number 10,257,939
- Issue date Apr 9, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent sensors with formed flexible layer(s)
- Patent number 10,172,239
- Issue date Jan 1, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vehicular panel and wiring structure for vehicle
- Patent number 10,017,133
- Issue date Jul 10, 2018
- Yazaki Corporation
- Mitsunori Tsunoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board
- Patent number 9,986,641
- Issue date May 29, 2018
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board combined with carrier board and manufacturin...
- Patent number 9,775,249
- Issue date Sep 26, 2017
- Advanced Flexible Circuits Co., Ltd.
- Kuo-Fu Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless surface treatment plated layers of printed circuit boar...
- Patent number 9,743,508
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Jun Lee
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 9,565,757
- Issue date Feb 7, 2017
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,565,775
- Issue date Feb 7, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and module including same
- Patent number 9,538,644
- Issue date Jan 3, 2017
- Murata Manufacturing Co., Ltd.
- Hiromichi Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 9,532,469
- Issue date Dec 27, 2016
- Fujitsu Limited
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of multi-layer-multi-turn high efficiency in...
- Patent number 9,300,046
- Issue date Mar 29, 2016
- NuCurrent, Inc.
- Vinit Singh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board structure
- Patent number 9,237,643
- Issue date Jan 12, 2016
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform substrate stackup
- Patent number 9,232,639
- Issue date Jan 5, 2016
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board having multilayer core substrate
- Patent number 9,226,397
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,136,212
- Issue date Sep 15, 2015
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction box
- Patent number 9,113,557
- Issue date Aug 18, 2015
- YAZAKI EUROPE LIMITED
- Iqbal Kazi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240147612
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Commu...
- Publication number 20230223787
- Publication date Jul 13, 2023
- NUCURRENT, INC.
- Vinit Singh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CERAMIC CARRIER SUBSTRATE AND POWER MODULE
- Publication number 20230051374
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210337665
- Publication date Oct 28, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20210337675
- Publication date Oct 28, 2021
- STEMCO CO., LTD.
- Sung Jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20210007217
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
- Publication number 20200315023
- Publication date Oct 1, 2020
- Intel Corporation
- Suddhasattwa NAD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...
- Publication number 20160360611
- Publication date Dec 8, 2016
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SURFACE TREATMENT PLATED LAYERS OF PRINTED CIRCUIT BOAR...
- Publication number 20150382452
- Publication date Dec 31, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Dong Jun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...
- Publication number 20150359086
- Publication date Dec 10, 2015
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20150156868
- Publication date Jun 4, 2015
- MURATA MANUFACTURING CO., LTD.
- Masato NOMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150136459
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING SAME
- Publication number 20140305686
- Publication date Oct 16, 2014
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING BOARD AND METHOD FOR PRODUCING MULTI-LAYER WIRIN...
- Publication number 20140226296
- Publication date Aug 14, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-UNIFORM SUBSTRATE STACKUP
- Publication number 20140160707
- Publication date Jun 12, 2014
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140138132
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- John Su Kyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-PLANE CONDUCTIVE LINE INTERCONNECTS IN MICROELECTRONIC DEVICES
- Publication number 20140063761
- Publication date Mar 6, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL FOR PRINTED CIRCUIT
- Publication number 20140057123
- Publication date Feb 27, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20140017397
- Publication date Jan 16, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20140000952
- Publication date Jan 2, 2014
- Young Gwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130299218
- Publication date Nov 14, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20130299227
- Publication date Nov 14, 2013
- Doosan Corporation
- Eun Yong Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Printed Wiring Board
- Publication number 20130248234
- Publication date Sep 26, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS FOR ELECTRICAL CIR...
- Publication number 20130207744
- Publication date Aug 15, 2013
- Vinit SINGH
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR MANUFACTURE OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY IN...
- Publication number 20130205582
- Publication date Aug 15, 2013
- Vinit SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130206466
- Publication date Aug 15, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OPERATION OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDU...
- Publication number 20130208389
- Publication date Aug 15, 2013
- Vinit SINGH
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SYSTEMS USING MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS
- Publication number 20130208390
- Publication date Aug 15, 2013
- NUCURRENT, INC.
- Vinit SINGH
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR OPERATION OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY TUNA...
- Publication number 20130201589
- Publication date Aug 8, 2013
- Vinit SINGH
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Differences between the conductors of different layers of a multilayer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer-multi-turn structure for high efficiency wireless commu...

Multi-layer-multi-turn structure for high efficiency wireless commu...

Multi-layer, multi-turn inductor structure for wireless transfer of...

Device having a multi-layer-multi-turn antenna with frequency

Multi-layer, multi-turn inductor structure for wireless transfer of...

Multilayer printed circuit board and method for manufacturing the same

Insulated circuit board

Conductor and method of manufacturing the same

Component carrier with different surface finishes

Conductor structure and display device

Substrate structure and method for manufacturing the same

Circuit substrate

Method of fabricating tamper-respondent sensor

Tamper-respondent sensors with formed flexible layer(s)

Vehicular panel and wiring structure for vehicle

Circuit board

Wiring board

Flexible circuit board combined with carrier board and manufacturin...

Electroless surface treatment plated layers of printed circuit boar...

Electronic component and manufacturing method therefor

Wiring board, semiconductor device, and method of manufacturing wir...

Multilayer wiring substrate and module including same

Printed wiring board and method for manufacturing printed wiring board

Multilayer substrate

Method for manufacture of multi-layer-multi-turn high efficiency in...

Circuit board structure

Non-uniform substrate stackup

Multilayer printed wiring board having multilayer core substrate

Circuit board

Junction box

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Commu...

CERAMIC CARRIER SUBSTRATE AND POWER MODULE

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER BOARD AND METHOD FOR MANUFACTURING SAME

INSULATED CIRCUIT BOARD

COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS

FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...

ELECTROLESS SURFACE TREATMENT PLATED LAYERS OF PRINTED CIRCUIT BOAR...

FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING SAME

MULTI-LAYER WIRING BOARD AND METHOD FOR PRODUCING MULTI-LAYER WIRIN...

NON-UNIFORM SUBSTRATE STACKUP

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

OFF-PLANE CONDUCTIVE LINE INTERCONNECTS IN MICROELECTRONIC DEVICES

COPPER FOIL FOR PRINTED CIRCUIT

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

MULTILAYER PRINTED WIRING BOARD

NEW PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Multilayer Printed Wiring Board

MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS FOR ELECTRICAL CIR...

METHOD FOR MANUFACTURE OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY IN...

MULTILAYER PRINTED WIRING BOARD

METHOD FOR OPERATION OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDU...

SYSTEMS USING MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY INDUCTORS

METHOD FOR OPERATION OF MULTI-LAYER-MULTI-TURN HIGH EFFICIENCY TUNA...