Diffusion bonding

Industry

CPC
H01L2224/8582

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8582Diffusion bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for stabilizing leads in wire-bonded semicondu...
- Patent number 9,824,959
- Issue date Nov 21, 2017
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,911,061
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method for fabricating the same
- Patent number 7,495,339
- Issue date Feb 24, 2009
- Panasonic Corporation
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...
- Publication number 20170278776
- Publication date Sep 28, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
- Publication number 20170012018
- Publication date Jan 12, 2017
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection structure and method for fabricating the same
- Publication number 20070187834
- Publication date Aug 16, 2007
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical microfilament to circuit interface
- Publication number 20070132109
- Publication date Jun 14, 2007
- Sarcos Investments LC.
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Diffusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Lead-free soldering method and soldered article

Structure and method for stabilizing leads in wire-bonded semicondu...

Electrical microfilament to circuit interface

Semiconductor device

Electrical microfilament to circuit interface

Semiconductor device

Electrical microfilament to circuit interface

Connection structure and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE

SEMICONDUCTOR DEVICE

Electrical Microfilament to Circuit Interface

SEMICONDUCTOR DEVICE

Connection structure and method for fabricating the same

Electrical microfilament to circuit interface