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H01L2924/143

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/143Digital devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,274,079
- Issue date Apr 8, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and stacked storage unit...
- Patent number 12,274,049
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory peripheral circuit having three-dimensional transistors and...
- Patent number 12,274,066
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,268,005
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and related methods of forming a memory device
- Patent number 12,261,111
- Issue date Mar 25, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standardized commodity programmable logic semi...
- Patent number 12,255,195
- Issue date Mar 18, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,250,830
- Issue date Mar 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, memory system and method of controlling semic...
- Patent number 12,243,606
- Issue date Mar 4, 2025
- AP Memory Technology Corporation
- Hsin-Nan Chueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- Ygal Arbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having laterally extending capacitors of different le...
- Patent number 12,238,917
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118672
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Sang Sub Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
- Publication number 20250118689
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH MULTIPLE HBM STACKS
- Publication number 20250118719
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Brett P. WILKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250118721
- Publication date Apr 10, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BONDING STRUCTURE
- Publication number 20250118619
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118620
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphics Processing Unit and High Bandwidth Memory Integration Usin...
- Publication number 20250118722
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118652
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250118707
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...
- Publication number 20250113484
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masato NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...
- Publication number 20250113486
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Nobuyuki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113492
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CHIPLET-BASED APPLICATION SPECIFIC INTEGRATED CIRCUIT
- Publication number 20250112207
- Publication date Apr 3, 2025
- Block, Inc.
- Vikram Suresh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...
- Publication number 20250112098
- Publication date Apr 3, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...
- Publication number 20250112204
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...
- Publication number 20250112160
- Publication date Apr 3, 2025
- Intel Corporation
- Andrew P. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113485
- Publication date Apr 3, 2025
- Western Digital Technologies, Inc.
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE
- Publication number 20250113503
- Publication date Apr 3, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20250112125
- Publication date Apr 3, 2025
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS

Digital devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deep trench capacitors embedded in package substrate

Memory devices having vertical transistors and stacked storage unit...

Memory peripheral circuit having three-dimensional transistors and...

Stacked dies and methods for forming bonded structures

Semiconductor structure

Semiconductor packages and manufacturing methods thereof

Info structure with copper pillar having reversed profile

Semiconductor package having an encapulant comprising conductive fi...

Memory devices and related methods of forming a memory device

Semiconductor device having package on package structure and method...

Bond pads for semiconductor die assemblies and associated methods a...

Methods for forming three-dimensional memory devices

Semiconductor package including heat dissipation layer

Logic drive based on standardized commodity programmable logic semi...

Semiconductor package and method manufacturing the same

3D semiconductor memory devices and structures

Semiconductor device including penetration via structure

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Semiconductor device, memory system and method of controlling semic...

Devices, systems, and methods for stacked die packages

Thermocompression bonding with passivated nickel-based contacting m...

Alternative surfaces for conductive pad layers of silicon bridges f...

3D stack of split graphics processing logic dies

Deep trench capacitors embedded in package substrate

Semiconductor package

Semiconductor device having plural stacked first chips sealed in a...

Chip bump interface compatible with different orientations and type...

Integrated circuit structure

Memory device having laterally extending capacitors of different le...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING A CONTROLLER

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE WITH MULTIPLE HBM STACKS

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

SEMICONDUCTOR PACKAGE

THERMAL CONDUCTIVE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Graphics Processing Unit and High Bandwidth Memory Integration Usin...

SEMICONDUCTOR PACKAGE

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

INTEGRATED CIRCUIT PACKAGES AND METHODS

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

MULTI-DIE CHIPLET-BASED APPLICATION SPECIFIC INTEGRATED CIRCUIT

PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...

DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

Power, Signaling and Thermal Path Co-optimization

INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE

BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES