Digital devices

Industry

CPC
H01L2924/143

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/143Digital devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package
- Patent number 12,368,104
- Issue date Jul 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,368,108
- Issue date Jul 22, 2025
- Canon Kabushiki Kaisha
- Nobuaki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,368,121
- Issue date Jul 22, 2025
- SK hynix Inc.
- Yu Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter exchange for a die-to-die interconnect
- Patent number 12,360,934
- Issue date Jul 15, 2025
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,362,302
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,362,303
- Issue date Jul 15, 2025
- Kioxia Corporation
- Nobuaki Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 12,354,965
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,354,938
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 12,354,985
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 12,354,982
- Issue date Jul 8, 2025
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and fabrication method
- Patent number 12,354,994
- Issue date Jul 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhiyong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure with support features and methods
- Patent number 12,354,940
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250240979
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239553
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Keisuke NAKATSUKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...
- Publication number 20250240957
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250240980
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- KEONWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250240978
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Soochan CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONTROLLER PACKAGE AND OPTOELECTRONIC MEMORY MODULE INCLUDI...
- Publication number 20250239576
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- G02 - OPTICS
Information Patent Application
MULTI-DIE LAYER MEMORY DEVICE
- Publication number 20250234564
- Publication date Jul 17, 2025
- Rambus Inc.
- Thomas VOGELSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234554
- Publication date Jul 17, 2025
- Yunjo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
- Publication number 20250234543
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
- Publication number 20250234545
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233098
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
- Publication number 20250233114
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...
- Publication number 20250232828
- Publication date Jul 17, 2025
- Samsung Electronics Co., LTD
- Myeong-Woo Lee
- G11 - INFORMATION STORAGE
Information Patent Application
NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME
- Publication number 20250234563
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Guyeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
- Publication number 20250233095
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233118
- Publication date Jul 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20250224556
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MERGED SUB ARRAY
- Publication number 20250227926
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Changyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS

Digital devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package

Electronic module and electronic device

Methods and apparatus for using spacer-on-spacer design for solder...

Semiconductor package

Semiconductor memory device

IPD modules with flexible connection scheme in packaging

Semiconductor package

Power management

Semiconductor chip package having underfill material surrounding a...

Double side integration semiconductor package and method of forming...

Thermocompression bonding with passivated silver-based contacting m...

Parameter exchange for a die-to-die interconnect

Semiconductor package comprising semiconductor chip with stepped po...

Methods of packaging semiconductor devices and packaged semiconduct...

Basin-shaped underbump plates and methods of forming the same

Semiconductor devices and data storage systems including the same

Semiconductor memory device

Method of making a fan-out semiconductor assembly with an intermedi...

Semiconductor package with ball grid array connection having improv...

Thermocompression bonding with passivated gold contacting metal

Chip package structure and storage system

Semiconductor device with redistribution structure and method for f...

Semiconductor package and methods of manufacturing

Memory device including memory chip and peripheral memory chip and...

Memory devices with backside bond pads under a memory array

Three-dimensional memory device and fabrication method

Thermocompression bonding with passivated tin-based contacting metal

Signal routing between memory die and logic die for performing oper...

Semiconductor package

Redistribution layer structure with support features and methods

Patents Applicationslast 30 patents

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...

CAVITY TAPE FOR PACKAGE PROTECTION

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

SEMICONDUCTOR MEMORY DEVICE

MEMORY DEVICE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

OPTICAL CONTROLLER PACKAGE AND OPTOELECTRONIC MEMORY MODULE INCLUDI...

MULTI-DIE LAYER MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGES

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...

SEMICONDUCTOR DEVICE

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...

NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

MEMORY DEVICE INCLUDING MERGED SUB ARRAY