Digital signal processor [DSP]

Industry

CPC
H01L2924/14335

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14335Digital signal processor [DSP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
- Patent number 12,119,235
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for heuristic-based power gating of non-CMOS l...
- Patent number 12,026,034
- Issue date Jul 2, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,021,055
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die FPGA implementing built-in analog circuit using active si...
- Patent number 12,009,307
- Issue date Jun 11, 2024
- WUXI ESIONTECH CO., LTD.
- Yueer Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods to display cardiac signals based on a signal pa...
- Patent number 11,896,379
- Issue date Feb 13, 2024
- BioSig Technologies, Inc.
- Budimir S. Drakulic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 11,869,847
- Issue date Jan 9, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric or paraelectric memory and logic chiplet with thermal...
- Patent number 11,791,233
- Issue date Oct 17, 2023
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D stacked compute and memory with copper-to-copper hybrid bond
- Patent number 11,784,164
- Issue date Oct 10, 2023
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,764,128
- Issue date Sep 19, 2023
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for performing electrophysiology (EP) signal pr...
- Patent number 11,737,699
- Issue date Aug 29, 2023
- BioSig Technologies, Inc.
- Budimir S. Drakulic
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
3D stack of accelerator die and multi-core processor die
- Patent number 11,694,940
- Issue date Jul 4, 2023
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,664,359
- Issue date May 30, 2023
- Samsung Display Co., Ltd.
- Yijoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and display apparatus including the same
- Patent number 11,645,971
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Kyoungjun Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit device with separate die for programmable fabric...
- Patent number 11,632,112
- Issue date Apr 18, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin bonded interposer package
- Patent number 11,621,243
- Issue date Apr 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for removing a large-signal voltage offset fr...
- Patent number 11,617,529
- Issue date Apr 4, 2023
- BioSig Technologies, Inc.
- Budimir S. Drakulic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for removing a large-signal voltage offset fr...
- Patent number 11,617,530
- Issue date Apr 4, 2023
- BioSig Technologies, Inc.
- Budimir S. Drakulic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages and related methods
- Patent number 11,462,580
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for performing electrophysiology (EP) signal pr...
- Patent number 11,324,431
- Issue date May 10, 2022
- BioSig Technologies, Inc.
- Budimir S. Drakulic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387194
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240290704
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE
- Publication number 20240274549
- Publication date Aug 15, 2024
- ADVANCED MICRO DEVICES, INC.
- Alexander Helmut Pfeiffenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20240071934
- Publication date Feb 29, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063131
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...
- Publication number 20240030152
- Publication date Jan 25, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20230386977
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...
- Publication number 20230369171
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Young Jun HONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...
- Publication number 20230253294
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Wonyong LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Device with Separate Die for Programmable Fabric...
- Publication number 20230253965
- Publication date Aug 10, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM
- Publication number 20230154871
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Kwangsook NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR AND PERFORMANCE CHIPLET
- Publication number 20230100375
- Publication date Mar 30, 2023
- Intel Corporation
- Gerald PASDAST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Systems And Methods Using Spacer Dies
- Publication number 20230100829
- Publication date Mar 30, 2023
- Intel Corporation
- Sheue Fen Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED COMPUTE AND MEMORY WITH COPPER-TO-COPPER HYBRID BOND
- Publication number 20230059491
- Publication date Feb 23, 2023
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230049283
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT CONNECTIONS OF WAFER-ON-WAFER BONDED MEMORY AND LOGIC
- Publication number 20230048628
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND
- Publication number 20230048103
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20220415943
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE COUPLING USING A SUBSTRATE WITH A GLASS CORE
- Publication number 20220406721
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220384378
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE FPGA IMPLEMENTING BUILT-IN ANALOG CIRCUIT USING ACTIVE SI...
- Publication number 20220344268
- Publication date Oct 27, 2022
- WUXI ESIONTECH CO., LTD.
- Yueer SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR INTEGRATING POWER GATE CIRCUIT USING SILIC...
- Publication number 20220328452
- Publication date Oct 13, 2022
- WUXI ESIONTECH CO., LTD.
- Jicong FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20220208648
- Publication date Jun 30, 2022
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...
- Publication number 20220093524
- Publication date Mar 24, 2022
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407981
- Publication date Dec 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Yijoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Tier Processor/Memory Package
- Publication number 20210358894
- Publication date Nov 18, 2021
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Digital signal processor [DSP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacture of semiconductor devices having redistributi...

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

High density interconnect device and method

Semiconductor device and method to minimize stress on stack via

Method and apparatus for heuristic-based power gating of non-CMOS l...

Semiconductor package and method for manufacturing semiconductor pa...

Multi-die FPGA implementing built-in analog circuit using active si...

Semiconductor device and manufacturing method thereof

Wafer-on-wafer formed memory and logic for genomic annotations

Systems and methods to display cardiac signals based on a signal pa...

Semiconductor device with integrated heat distribution and manufact...

Logic drive based on multichip package comprising standard commodit...

Semiconductor device having conductive wire with increased attachme...

Ferroelectric or paraelectric memory and logic chiplet with thermal...

3D stacked compute and memory with copper-to-copper hybrid bond

Semiconductor chip including through electrode, and semiconductor p...

Systems and methods for performing electrophysiology (EP) signal pr...

3D stack of accelerator die and multi-core processor die

Package structure and manufacturing method thereof

Display apparatus

High density interconnect device and method

Light emitting diode package and display apparatus including the same

Integrated circuit device with separate die for programmable fabric...

Thin bonded interposer package

Apparatus and methods for removing a large-signal voltage offset fr...

Apparatus and methods for removing a large-signal voltage offset fr...

Packaged integrated circuit with interposing functionality and meth...

Image sensor packages and related methods

Systems and methods for performing electrophysiology (EP) signal pr...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE

COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY

SEMICONDUCTOR PACKAGE

LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...

COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...

Integrated Circuit Device with Separate Die for Programmable Fabric...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM

REPAIR AND PERFORMANCE CHIPLET

Circuit Systems And Methods Using Spacer Dies

3D STACKED COMPUTE AND MEMORY WITH COPPER-TO-COPPER HYBRID BOND

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

INPUT/OUTPUT CONNECTIONS OF WAFER-ON-WAFER BONDED MEMORY AND LOGIC

MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND

IMAGE SENSOR PACKAGES AND RELATED METHODS

DIE COUPLING USING A SUBSTRATE WITH A GLASS CORE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

MULTI-DIE FPGA IMPLEMENTING BUILT-IN ANALOG CIRCUIT USING ACTIVE SI...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE FOR INTEGRATING POWER GATE CIRCUIT USING SILIC...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Multi-Tier Processor/Memory Package