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H01L2224/83206

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83206Direction of oscillation

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for permanent bonding
- Patent number 9,947,638
- Issue date Apr 17, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ultrasonic bonding having at least one first and second...
- Patent number 9,296,065
- Issue date Mar 29, 2016
- Hesse GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for bonding electrical devices using an electrica...
- Patent number 8,129,220
- Issue date Mar 6, 2012
- Hong Kong Polytechnic University
- Derek Siu Wing Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method
- Patent number 7,528,489
- Issue date May 5, 2009
- Renesas Technology Corp.
- Ryouichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for mounting a semiconductor element
- Patent number 6,686,607
- Issue date Feb 3, 2004
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3051826
- Patent number 3,051,826
- Issue date Aug 28, 1962
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...
- Publication number 20140151439
- Publication date Jun 5, 2014
- Hesse GmbH
- Hans-Juergen Hesse
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND SYSTEM FOR BONDING ELECTRICAL DEVICES USING AN ELECTRICA...
- Publication number 20120097335
- Publication date Apr 26, 2012
- Derek Siu Wing Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR BONDING ELECTRICAL DEVICES USING AN ELECTRICA...
- Publication number 20110045640
- Publication date Feb 24, 2011
- Derek Siu Wing Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus and manufacturing method
- Publication number 20060151889
- Publication date Jul 13, 2006
- Ryouichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for mounting a semiconductor element
- Publication number 20020175331
- Publication date Nov 28, 2002
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS

Direction of oscillation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for permanent bonding

Method for ultrasonic bonding having at least one first and second...

Method and system for bonding electrical devices using an electrica...

Semiconductor apparatus and manufacturing method

Structure and method for mounting a semiconductor element

3051826

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

DEVICE AND METHOD FOR PERMANENT BONDING

METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...

METHOD AND SYSTEM FOR BONDING ELECTRICAL DEVICES USING AN ELECTRICA...

METHOD AND SYSTEM FOR BONDING ELECTRICAL DEVICES USING AN ELECTRICA...

Semiconductor apparatus and manufacturing method

Structure and method for mounting a semiconductor element